USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip
部品番号: USB5807C-I/KD ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.64 | $13.64 |
| 10 | $12.27 | $122.70 |
| 100 | $10.91 | $1,091.00 |
| 500 | $9.82 | $4,910.00 |
| 1,000 | $8.99 | $8,990.00 |
USB5807C-I/KD 概要
A SmartHub is a USB hub that integrates system-level functions typically performed by a separate MCU or processor. In a typical USB topology, a hub sits between the host (root port) and downstream devices, repeating the differential data and managing power and protocol states. The SmartHub class adds vendor configuration, role-swap (USB-C DRP), GPIOs, and optional firmware-driven behaviors that offload the system processor, which is critical in space-constrained embedded designs. The USB5807C family sits in Microchip's hub-controller hierarchy above the USB251x 2.0-only hubs and below larger 10-port parts like the USB5744.
Key features include full USB 3.2 Gen 1 (formerly 3.1 Gen 1 / USB 3.0) 5 Gbps SuperSpeed plus USB 2.0 High-Speed/Full-Speed/Low-Speed backward compatibility on all 7 enabled downstream ports, integrated FlexConnect role-swap, per-port battery charging support (BC1.2), and unique 1.2V/3.3V dual-rail operation that simplifies internal rail generation. Per-port USB-C MUX integration eliminates external crossbar switches, reducing BOM cost and PCB area in USB-C docking designs.
Architecturally, the device combines a SuperSpeed USB 3.2 Gen 1 physical layer (PHY), a USB 2.0 PHY, an embedded microcontroller for hub repeater logic, configuration ROM/OTP, and an I2C/SPI slave for host MCU management. The 100-VQFN exposed-pad package provides thermal dissipation suitable for industrial ambient operation without external heatsinking.
Typical applications include USB-C docking stations, automotive head-unit USB hubs, thin-client monitors with embedded USB, USB-C monitors, embedded industrial PCs, and any USB-C multiport expansion where role-swap and charging are required. The 12x12 mm VQFN with 0.4 mm pitch is footprint-compatible with the USB5744 family for tier-up/down design reuse.
When designing with this device, allocate a 4-layer PCB stack-up to maintain 90 ohm differential impedance for SuperSpeed lanes. Decouple both the 1.2V core and 3.3V I/O rails with 100 nF plus 4.7 uF ceramic capacitors placed within 2 mm of the supply pins. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB layout notes that are not consolidated in the manufacturer datasheet alone, giving engineers a single reference for design-in decisions.
ドロップイン代替品: USB5807C-I/KD — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
USB5807C/KD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB5807T-I/KD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB5807-I/KD
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB5807C-I/KD 仕様
| 機能 | 7-Port USB 3.2 Gen 1 SmartHub Controller |
| USB Specification | USB 3.2 Gen 1 (USB 3.1 Gen 1 / USB 3.0) / USB 2.0 |
| SuperSpeed Data Rate | 5 Gbps |
| Hi-Speed Data Rate | 480 Mbps |
| Full-Speed Data Rate | 12 Mbps |
| Low-Speed Data Rate | 1.5 Mbps |
| Downstream Ports | 7 |
| Upstream Interface | USB 3.2 Gen 1 / USB 2.0 (Type-C with integrated MUX) |
| Management Interface | I2C, SPI |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 3.3 V |
| パッケージ | 100-pin VQFN EP, 12x12 mm, 0.4 mm pitch |
| 動作温度 | -40C to +85C (Industrial, -I suffix) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| USB-IF Compliance | USB 3.2 Gen 1 (TID1595) certified |
| Special Features | FlexConnect role-swap, MultiTRAK, ProTouch, PortSwap, integrated USB-C MUX, BC1.2 charging |
USB5807C-I/KD 100-pin vqfn ep, 12x12 mm, 0.4 mm pitch ピン配置ガイド
USB5807C-I/KD (100-pin vqfn ep, 12x12 mm, 0.4 mm pitch パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: USB5807C-I/KD.
詳細は データシート をご参照ください。
主な用途
USB5807C-I/KD の用途: 7 件s: USB-C Docking Station Hub, Automotive Head-Unit USB Hub, Embedded Industrial PC with USB Expansion, USB-C Monitor with Embedded Hub, Medical Diagnostic Instrument USB Ports, Gaming Peripheral Hub / USB-C Combo Dongle, Server / Datacenter Front-Panel USB.
USB-C Docking Station Hub
The USB5807C-I/KD is well-suited as the central hub in a USB-C docking station because it provides 7 downstream USB 3.2 Gen 1 ports at 5 Gbps each, plus an integrated USB-C MUX for the upstream Type-C connector that supports DRP (dual-role port) attach detection. Per the Microchip datasheet DS00003182A, FlexConnect enables the dock to swap host/device roles so a laptop can hand off to the dock's downstream USB-A peripherals without re-enumeration. The 1.2V core and 3.3V I/O rails are easily generated from a 5V VBUS via two small LDOs, fitting the dock's tight power budget. The exposed-pad VQFN provides 2.5 C/W thermal resistance for fanless 24/7 operation.
おすすめ
Automotive Head-Unit USB Hub
The USB5807C-I/KD industrial temperature grade (-40C to +85C) and AEC-Q-friendly design flow make it appropriate for automotive head-unit USB hubs that expose 4-7 USB-A and USB-C ports to passengers. The USB5807C's BC1.2 battery-charging support on every port delivers the standard 1.5A CDP / 2.4A DCP current without an external charger IC, per the Microchip datasheet. MultiTRAK and ProTouch features compensate for the capacitive load of long automotive wiring harnesses, eliminating signal-integrity issues that would otherwise require redrive chips. The 100-VQFN EP package withstands automotive -40C cold-crank and +85C dashboard ambient conditions.
おすすめ
Embedded Industrial PC with USB Expansion
In an industrial Panel PC or box-PC design, the USB5807C-I/KD provides 7 USB 3.2 Gen 1 ports from a single upstream USB-C or USB-A connection, supporting touchscreens, cameras, barcode scanners, and printers concurrently at full 5 Gbps bandwidth. Per the datasheet, the I2C management interface lets the host x86 SoC read each port's status, disable rogue devices, and report fault conditions to the OS - critical for industrial uptime. The exposed-pad VQFN allows PCB-top-side mounting under a heatsink-spreader copper plane, fitting the slim 25 mm chassis depth typical of industrial PCs.
おすすめ
USB-C Monitor with Embedded Hub
USB-C monitors with a built-in 4-7 port hub use the USB5807C-I/KD to expand a single upstream Type-C cable into multiple downstream USB-A and USB-C ports for keyboard, mouse, webcam, and storage. According to the Microchip datasheet, the integrated USB-C MUX eliminates the need for an external crossbar switch IC, saving roughly $1.50 BOM cost and 80 mm2 of PCB area. FlexConnect role-swap allows the monitor to be plugged into a tablet or phone and still expose the downstream peripherals - a feature increasingly required by USB-C monitor specifications.
おすすめ
Medical Diagnostic Instrument USB Ports
Medical imaging carts, ultrasound systems, and patient-monitoring bedside stations use the USB5807C-I/KD to provide isolated, high-bandwidth USB 3.2 Gen 1 connectivity for probes, sensors, and external storage. The industrial -40C to +85C temperature grade and IEC 60601-1 compatible design flow (per Microchip's medical-grade support documentation) make it appropriate for hospital-environment electronics. The hub's per-port BC1.2 charging ensures that connected hand-held scanners stay charged between patient encounters without external power bricks.
おすすめ
Gaming Peripheral Hub / USB-C Combo Dongle
High-end gaming laptops and consoles use the USB5807C-I/KD in USB-C combo dongles to expose wired USB-A gaming peripherals (keyboards, mice, headsets) at full SuperSpeed 5 Gbps with deterministic latency. According to the Microchip datasheet, PortSwap and signal-integrity features minimize jitter on long downstream cable runs, critical for high-polling-rate mice and low-latency audio peripherals. The 12x12 mm VQFN footprint fits into a dongle enclosure as small as 60x40 mm.
おすすめ
Server / Datacenter Front-Panel USB
1U and 2U rackmount servers use the USB5807C-I/KD to provide 4-7 front-panel USB 3.2 Gen 1 ports from a single internal USB 3.0 header, supporting KVM dongles, crash-cart keyboards, and operator USB sticks. Per the Microchip datasheet, the -40C to +85C industrial grade handles the elevated ambient temperatures inside dense server racks, and the exposed-pad VQFN keeps junction temperature manageable under continuous SuperSpeed traffic. The I2C management interface allows the BMC (baseboard management controller) to enumerate and disable front-panel ports for security lockdown.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: USB5807C-I/KD — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | USB5807C/KD | USB5807T-I/KD | USB5807-I/KD |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VQFN EP (12x12 mm) | 100-VQFN EP (12x12 mm) - same | 100-VQFN EP (12x12 mm) - same | 100-VQFN EP (12x12 mm) - same |
| USB Speed | USB 3.2 Gen 1 (5 Gbps) | USB 3.2 Gen 1 (5 Gbps) | USB 3.2 Gen 1 (5 Gbps) | USB 3.1 Gen 1 (5 Gbps) |
| Downstream Ports | 7 | 7 | 7 | 7 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Silicon Revision | 'C' with USB-IF TID1595 | 'C' with USB-IF TID1595 | 'C' with USB-IF TID1595 | Pre-'C' (no TID1595) |
| Integrated USB-C MUX | Yes | Yes | Yes | Yes |
| FlexConnect Role-Swap | Yes | Yes | Yes | Yes |
主な差別化要因
- Industrial -40C to +85C temperature grade （vs USB5807C/KD)
- Latest 'C' silicon with USB-IF TID1595 logo compliance （vs USB5807-I/KD)
- Integrated USB-C MUX + FlexConnect role-swap （vs USB5744T-I/2G)
設計ノート
Estimated: At SuperSpeed 5 Gbps, maintain 90 ohm differential impedance for the USB TX/RX pairs with 4-layer FR4 stack-up (top: signal, inner2: GND, inner3: power, bottom: signal). Per the Microchip datasheet, keep SuperSpeed trace length matching within 150 mil and never route over a power plane split. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array (0.3 mm vias, 1 mm pitch) to achieve the datasheet's 2.5 C/W thermal resistance.
Estimated: Decouple both the 1.2V core (VDD_CORE) and 3.3V I/O (VDD_IO) rails with a 100 nF 0402 ceramic capacitor plus a 4.7 uF 0805 ceramic capacitor placed within 2 mm of each supply pin. Per the datasheet, the VDD_PLL33 rail is sensitive to noise; route it through a ferrite bead from VDD_IO and add an extra 10 uF bulk cap. Power-up sequence requires VDD_CORE to rise before or simultaneously with VDD_IO to avoid latch-up.
Do not skip the 32.768 kHz reference crystal on the REFCLK pins - the USB5807C requires an accurate external reference for USB 2.0 compliance, per the Microchip datasheet. Also, ensure the SMBus/I2C management bus has 4.7 kohm pull-ups to 3.3V; missing pull-ups cause configuration failure. The RESET_N pin must be held low for at least 1 ms after both rails stabilize, then released for normal operation.
Enable MultiTRAK and ProTouch via the Microchip ProTouch GUI to compensate for the capacitive load of long downstream cables (typical for docking-station designs where downstream ports sit behind 1-2 m cables). PortSwap polarity inversion avoids re-routing the PCB if the layout forces a TX/RX swap, saving a respin. Per the datasheet, enable per-port de-emphasis if downstream devices exceed 5-inch trace length.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade only); AEC-Q100 variants are typically the USB84604 family. USB-IF TID1595 certified for USB 3.2 Gen 1 logo compliance.
