XA7A75T-2FGG484I - Automotive Artix-7 FPGA | AMD
料号： XA7A75T-2FGG484I ✓ 量产中XA7A75T-2FGG484I 概述
A field-programmable gate array, or FPGA, is a programmable digital semiconductor whose interconnect and logic blocks can be configured after manufacture. FPGAs occupy the programmable-logic segment of the semiconductor hierarchy and are used when design flexibility, parallel processing, specialized interfaces, or rapid product revisions are more important than the power efficiency of a fixed-function ASIC. The XA7A75T family is positioned between small low-cost FPGAs and larger devices with more logic, memory, and I/O resources.
Key features of the XA7A75T-2FGG484I include 75,520 logic cells, 285 user I/O pins, and operation from a 1 V core supply. The FGG484 package contains 484 terminals in a compact BGA arrangement with 1 mm pitch. The XA designation identifies the automotive-oriented XA Artix-7 family, and the part is identified as AEC-Q100 compliant in the manufacturer-related product information.
The -2 speed designation places this device in the middle performance grade of the XA7A75T family. Its 28 nm fabrication process supports a balance between programmable performance and power efficiency, while its large I/O count allows connections to external memory, communication transceivers, sensors, actuators, and mixed-signal peripherals. These characteristics make the device suitable for embedded control, gateway, instrumentation, and vehicle electronics systems that benefit from parallel programmable logic.
Typical automotive applications include sensor fusion, camera and radar signal preprocessing, vehicle-network interfaces, body and chassis control, industrial communications gateways, and high-reliability data-acquisition systems. The same programmable architecture allows one physical design to support several protocol or sensor configurations, reducing hardware duplication and allowing field updates through the device configuration mechanism.
PCB design requires careful treatment of the 484-ball BGA footprint. Follow the AMD Artix-7 package pinout files, UG475, and the PCB design guidance for escape routing, via placement, power-plane geometry, and decoupling. Confirm the exact pin functions, configuration pins, power rails, and decoupling requirements against the manufacturer datasheet before releasing the layout.
This page organizes the confirmed device identity, package information, functional characteristics, design considerations, and qualified replacement options. It also provides application-focused guidance and parameter comparisons intended to help engineers evaluate the XA7A75T-2FGG484I before starting PCB implementation or lifecycle planning.
直接替换替代料： XA7A75T-2FGG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XA7A75T-2FGG484I （相同外形与封装尺寸） ——差异在于 Process Technology, Logic Cells, Automotive Qualification, Device Type, Mounting Type.
XA7A75T-1FGG484Q
✅ 直接替换联系询价
查看数据手册 →XC7A75T-2FGG484I
✅ 直接替换联系询价
查看数据手册 →XA7A75T-2FGG484Q
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XA7A75T-1FGG484I
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC7A75T-1FGG484C
✅ 直接替换📋 参考替代料（不在目录中）
XA7A75T-2FGG484I 最大额定值与电气特性
| Device Type | Artix-7 field-programmable gate array |
| Product Family | XA Artix-7 |
| Logic Cells | 75,520 cells |
| User I/O Pins | 285 pins |
| 封装 | FGG484 BGA, 484 terminals |
| Ball Pitch | 1 mm |
| Core Supply Voltage | 1 V |
| Process Technology | 28 nm |
| Speed Grade | -2 |
| Automotive Qualification | AEC-Q100 |
| Programmable Logic Type | FPGA |
| Terminal Count | 484 terminals |
| Package Form | Square BGA |
| Terminal Pitch | 1 mm |
| Manufacturer | AMD, formerly Xilinx |
| 生命周期状态 | Active |
XA7A75T-2FGG484I square bga 引脚配置指南
XA7A75T-2FGG484I（square bga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XA7A75T-2FGG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XA7A75T-2FGG484I 适用于 6 应用s: Automotive Sensor Fusion, Vehicle Network Gateway, Industrial Communication Gateway, Camera and Radar Signal Preprocessing, High-Speed Data Acquisition, Programmable Industrial Control.
Automotive Sensor Fusion
The XA7A75T-2FGG484I fits automotive sensor-fusion systems that combine camera, radar, inertial, and vehicle-network data in parallel programmable logic. Its 75,520 logic cells provide substantial processing capacity, while 285 I/O pins support sensors, memory interfaces, and communication links. The 1 V core supply and 28 nm Artix-7 process support efficient implementation of filtering, feature extraction, and data-format conversion. The automotive XA identity and AEC-Q100 association are important when establishing the production device class. Engineers should complete timing, thermal, and functional-safety reviews against the exact device documentation.
Vehicle Network Gateway
The XA7A75T-2FGG484I is suitable for a vehicle-network gateway that must translate among multiple automotive communication domains and provide local protocol handling. The 285 available I/O pins create substantial connectivity for transceivers, switches, memory devices, and status interfaces, while 75,520 logic cells can support multiple concurrent protocol engines. Its 1 V core architecture simplifies integration with modern FPGA power trees, and the 28 nm process provides a practical balance of logic capacity and performance per watt. The FGG484 BGA requires a multilayer PCB with careful power-plane and escape-routing design.
Industrial Communication Gateway
The XA7A75T-2FGG484I can serve as the programmable control and protocol-conversion core of an industrial communication gateway. Its 75,520 logic cells are useful for parallelizing protocol conversion, data filtering, packet inspection, and control functions, while 285 I/O pins support multiple external interfaces and industrial transceivers. The -2 speed grade provides additional timing margin for demanding logic paths compared with a -1 grade. The same device can also support bridge, aggregation, and local monitoring functions without fixed-function logic. For deployment outside vehicles, confirm the required ordering suffix and environmental grade before releasing the design.
Camera and Radar Signal Preprocessing
The XA7A75T-2FGG484I is appropriate for front-end image or radar signal preprocessing where parallel data reduction must occur before data reaches a host processor. Its 75,520 logic cells can support pipeline stages, thresholding, pixel-format conversion, and filtering, while 285 I/O pins permit direct connection to sensors and capture devices. The 28 nm Artix-7 process and -2 speed grade are useful for timing-sensitive pipelines. Because these systems often demand deterministic data movement and low-latency control, engineers should use the AMD timing tools and device-specific constraints during implementation and verify power consumption at the expected operating temperature.
High-Speed Data Acquisition
The XA7A75T-2FGG484I fits modular high-speed acquisition systems that need flexible parallel input, buffering, conversion, and data-routing logic. Its 285 I/O pins can connect multiple converters, memory devices, or source-synchronous interfaces, while 75,520 logic cells support acquisition control, digital filtering, and host-facing data movement. The programmable architecture allows sampling rates, channel assignments, and data formats to change without redesigning the PCB. For instrumentation, the 484-terminal BGA and 1 mm pitch make multilayer construction and controlled assembly essential. Confirm exact I/O standards, supported memory interfaces, and timing constraints in the manufacturer documentation.
Programmable Industrial Control
The XA7A75T-2FGG484I can act as a high-connectivity controller for factories, test systems, and automated equipment requiring deterministic parallel logic. The 75,520 logic cells are suitable for sequencing several machines or instrument channels, and the 285 I/O pins reduce the need for external I/O expansion. Its -2 speed grade offers useful timing headroom for control and data-processing paths, while the 1 V core supply is consistent with modern FPGA power architectures. Engineers should partition the design into clocked domains, define deterministic reset behavior, and validate the thermal design with the actual board stack-up and enclosure.
工程参考数据： XA7A75T-2FGG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XA7A75T-1FGG484Q | XC7A75T-2FGG484I | XA7A75T-2FGG484Q | XA7A75T-1FGG484I | XC7A75T-1FGG484C |
|---|---|---|---|---|---|---|
| Package | FGG484 BGA, 484 terminals, 1 mm pitch | FGG484 BGA, 484 terminals | FGG484 BGA, 484 terminals | FGG484 BGA, 484 terminals | FGG484 BGA, 484 terminals | FGG484 BGA, 484 terminals |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells |
| User I/O | 285 pins | 285 pins | 285 pins | 285 pins | 285 pins | 285 pins |
| Speed Grade | -2 | -1 | -2 | -2 | -1 | -1 |
| Family Identity | XA Artix-7 | XA Artix-7 | XC Artix-7 | XA Artix-7 | XA Artix-7 | XC Artix-7 |
| Automotive Qualification Identity | XA device, AEC-Q100 associated | XA device | XC device | XA device | XA device | XC device |
| Process Technology | 28 nm | 28 nm Artix-7 family | 28 nm Artix-7 family | 28 nm Artix-7 family | 28 nm Artix-7 family | 28 nm Artix-7 family |
| Core Supply | 1 V | 1 V family core supply | 1 V family core supply | 1 V family core supply | 1 V family core supply | 1 V family core supply |
| Pin Compatibility | FGG484 reference pinout | Same package; confirm device-specific pin table | Same package; confirm device-specific pin table | Same package; confirm device-specific pin table | Same package; confirm device-specific pin table | Same package; confirm device-specific pin table |
关键差异点
- Retains the -2 performance grade （对比 XA7A75T-1FGG484Q)
- Preserves the automotive XA family identity （对比 XC7A75T-2FGG484I)
- Matches the full 75T logic and I/O configuration （对比 XC7A75T-1FGG484C)
设计说明
Use the AMD Artix-7 FGG484 package device pinout file and UG475 when defining the PCB footprint and ball assignments. A 1 mm-pitch 484-ball BGA generally requires multilayer construction, via-in-pad or via fanout strategies, and assembly processes capable of handling the pad geometry. Do not derive pin functions from the package outline alone; verify every power, ground, configuration, and user I/O connection against the device-specific pin table.
Implement separate, low-impedance power paths for the 1 V core rail and any required I/O or auxiliary rails. Place high-frequency decoupling capacitors close to the associated device balls and follow the capacitor values and placement guidance in the manufacturer power-guidelines document. Keep switching-regulator and high-current paths away from sensitive configuration and clock inputs. Validate the complete rail sequence, voltage tolerance, startup behavior, and worst-case current in the final board power design.
Estimate junction temperature from actual board construction rather than package size alone. The 484-ball BGA transfers heat through its solder balls, PCB copper planes, and vias, so thermal performance depends strongly on layer count, copper coverage, adjacent heat sources, and enclosure airflow. Run a thermal simulation using the intended stack-up and worst-case FPGA activity. If the estimate approaches the device limit, increase copper area, add thermal vias, improve airflow, or reduce clock and I/O activity.
Preserve signal integrity on high-speed interfaces by following the device-specific I/O standards and reference-design topology. Route clocks with short, symmetric paths, provide continuous reference planes, and avoid stubs or discontinuities where byte lanes or source-synchronous interfaces are used. Keep configuration signals away from aggressive aggressors, follow power-up timing requirements, and include the specified termination or bias networks. Validate the final layout with the AMD implementation constraints and board-level signal-integrity analysis.
Avoid treating any FGG484 Artix-7 ordering code as automatically interchangeable with the automotive target. The XA and XC prefixes identify different family and qualification positions, while the numeric suffix changes speed grade and the final suffix can change commercial or temperature conditions. For a production automotive design, compare the manufacturer ordering guide, device status, AEC-Q100 qualification, temperature grade, and exact pin table before approving a substitution.
合规信息
The XA7A75T-2FGG484I is identified as an automotive XA Artix-7 device associated with AEC-Q100. Other environmental and material-compliance declarations require confirmation from the current manufacturer product documentation.
