XC6SLX100-2FG676I - 101261-Cell Spartan-6 LX FPGA | AMD
料号： XC6SLX100-2FG676I ✓ 量产中XC6SLX100-2FG676I 概述
A field-programmable gate array is a programmable logic semiconductor in which digital functions are implemented through configurable lookup tables, routing resources, block RAM, and dedicated input/output blocks. Within the device hierarchy, an FPGA belongs to programmable logic devices and sits above general-purpose fixed-function processors when designers need parallel hardware execution, adaptable interfaces, or rapid hardware revisions. The Spartan-6 LX family combines these FPGA resources with a 45 nm process optimized for cost-sensitive embedded and industrial designs.
Key features of the XC6SLX100-2FG676I include 101261 logic cells, 480 user I/O, a stated internal frequency of 667 MHz, and 45 nm CMOS construction. The 676-BGA package provides a high pin count and supports designs requiring numerous board connections. The -2 speed grade positions this part below the -3 grade in the Spartan-6 LX ordering hierarchy, while the I suffix identifies the industrial-temperature option. Its large logic-cell count allows multiple processors, control blocks, communication interfaces, and data-processing pipelines to be consolidated into one device.
The device belongs to the Spartan-6 LX FPGA family, which targets bridging, industrial automation, embedded control, networking, video processing, and general-purpose programmable logic. Its architecture combines programmable logic, dedicated hard blocks, and abundant I/O in a single package. Compared with smaller members of the Spartan-6 LX family, the XC6SLX100 configuration provides greater logic density and more I/O, allowing a design to connect external memory, high-speed interfaces, sensors, converters, and display or communications peripherals without distributing the system across multiple programmable devices.
Typical applications include industrial control gateways, data-acquisition systems, network-interface bridges, embedded video processors, and test equipment. The 480 I/O count is useful for parallel sensor interfaces, memory buses, capture logic, and legacy peripheral connections, while the programmable architecture allows protocol updates without changing the PCB. For automotive, industrial, and communications equipment, the I temperature designation is the relevant selection factor when the design must operate across an extended temperature range.
When planning the PCB, treat the 676-ball BGA as a high-density, fine-pitch assembly and follow the package ball map and recommended escape-routing guidance in the AMD/Xilinx package documentation. Power, ground, decoupling, configuration, clocking, and I/O planning should be completed before layout because changes to BGA escape routing can affect signal integrity and manufacturability. The -2 speed grade also needs to be considered during timing closure rather than relying only on the stated internal frequency.
This product page consolidates the exact device identity, package and logic resources, drop-in family alternatives, application guidance, and design cautions engineers need when evaluating the XC6SLX100-2FG676I for a new programmable-logic design. It also distinguishes the important speed-grade and temperature-grade changes that determine whether an otherwise pin-compatible Spartan-6 LX option is suitable for the intended product environment.
直接替换替代料： XC6SLX100-2FG676I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX100-2FG676I （相同外形与封装尺寸） ——差异在于 Logic Cells, Mounting Type, Speed Grade, Package, Package Type.
XC6SLX100-3FGG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX100-2FGG676C
✅ 直接替换联系询价
查看数据手册 →XC6SLX100-3FGG676C
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX100-3FG676I
✅ 直接替换联系询价
查看数据手册 →XC6SLX100-3FG676C
✅ 直接替换联系询价
查看数据手册 →XC6SLX100-2FG676I 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 101261 cells |
| User I/O | 480 I/O |
| Internal Frequency | 667 MHz |
| Speed Grade | -2 |
| Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| 封装 | 676-BGA |
| Package Type | Flip-chip BGA |
| Package Ball Pitch | 1.0 mm |
| Package Dimensions | 27 x 27 mm |
| 安装类型 | Surface Mount |
| 工作温度范围 | -40 °C to 100 °C (TJ) |
| Technology Node | 45 nm |
| Programming Technology | SRAM configurable FPGA |
| Lead-Free Status | Lead-free |
XC6SLX100-2FG676I 27 x 27 mm 引脚配置指南
XC6SLX100-2FG676I（27 x 27 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX100-2FG676I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX100-2FG676I 适用于 6 应用s: Industrial Control and Automation, Data Acquisition and Signal Conditioning, Network Interface and Protocol Bridging, Video and Image Processing, Embedded Communications Equipment, Test, Measurement, and Programmable Logic.
Industrial Control and Automation
The XC6SLX100-2FG676I suits industrial controllers that combine deterministic control logic with numerous external connections. Its 101261 logic cells can support several control domains, while 480 user I/O accommodates digital sensors, actuators, machine buses, status indicators, and service interfaces. The -2 speed grade provides a defined timing class for logic operating at the family’s stated 667 MHz internal frequency. The I temperature designation supports a -40 °C to 100 °C junction-temperature range, making it preferable to commercial-grade variants in factory equipment where enclosure temperature varies throughout the operating cycle. Engineers should still verify power dissipation, clock uncertainty, I/O standards, and environmental margins in the final machine.
推荐
Data Acquisition and Signal Conditioning
The XC6SLX100-2FG676I can implement parallel acquisition, digital filtering, trigger management, and data formatting in one programmable device. Its 480 user I/O provides substantial connectivity for multiplexed sensor inputs, counters, memory interfaces, and synchronization signals, while 101261 logic cells support parallel pipelines that reduce dependence on a separate processor. The -2 grade gives a consistent performance target for timing closure, and the industrial-temperature option accommodates laboratory and factory equipment operating beyond commercial conditions. A practical implementation should budget logic and routing resources for each acquisition channel, use dedicated clocking where available, and isolate high-energy or noisy inputs from sensitive acquisition circuitry.
推荐
Network Interface and Protocol Bridging
The XC6SLX100-2FG676I is appropriate for gateways and protocol converters that must translate between multiple wide or narrow data interfaces in hardware. With 101261 logic cells and 480 I/O, it can host parallel bus logic, packet buffering, arbitration, framing, and interface timing rather than relying entirely on sequential processor execution. The 676-BGA package also exposes enough connections for external memory and multiple physical-layer devices. Designers can pair the FPGA with Ethernet PHY or isolated communication components while using programmable logic to implement protocol conversion, test instrumentation, or heartbeat supervision. Power, I/O-bank voltage, clock quality, and signal-integrity simulations must be reviewed before releasing the PCB layout.
推荐
Video and Image Processing
The XC6SLX100-2FG676I can consolidate parallel video timing, pixel transport, color processing, and test-pattern generation in a programmable-logic device. Its 101261 logic cells and 480 I/O offer sufficient parallel resources for multi-stage image pipelines or format conversion without requiring several fixed-function chips. The -2 grade supports a defined timing target, while the industrial-temperature designation makes the device appropriate for imaging cabinets, test systems, and machine-vision equipment exposed to variable internal temperatures. Clocking and data-valid timing should use the dedicated resources of the selected Spartan-6 LX device, and video interface voltage requirements must be mapped against the package I/O-bank constraints before schematic capture is completed.
推荐
Embedded Communications Equipment
The XC6SLX100-2FG676I fits communication modules that combine packet processing, physical-layer adaptation, control, and diagnostics. Its programmable logic can implement framing, line coding, channelization, buffering, and error handling, while 480 I/O support external transceivers, memory, status controls, and service ports. The industrial-temperature option supports equipment deployed in telecom edge systems, industrial gateways, and remote monitoring units where commercial-temperature parts may not provide enough environmental margin. The design should include deterministic reset and configuration behavior, clock jitter analysis for high-rate links, and carefully partitioned power rails so switching communication circuitry does not disturb sensitive FPGA supply nodes.
推荐
Test, Measurement, and Programmable Logic
The XC6SLX100-2FG676I is well suited to configurable test systems that need parallel stimulus generation, timing control, pattern storage, and communication with instruments. A large FPGA can consolidate multiple channels and adapt to new test requirements through reconfiguration rather than a new PCB spin. The 480 user I/O provides access to fixture signals and instrument controls, while 101261 logic cells allow substantial pattern-processing parallelism. The -2 grade provides a defined timing class for fixture timing budgets, and the industrial-temperature option broadens its use in automated test equipment and production environments. Engineers should preserve margin for fixture loading, skew, ground bounce, and cable effects instead of treating nominal FPGA timing as the complete end-to-end measurement accuracy.
推荐
推荐产品汇总
工程参考数据： XC6SLX100-2FG676I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX100-3FGG676I | XC6SLX100-2FGG676C | XC6SLX100-3FGG676C | XC6SLX100-3FG676I | XC6SLX100-3FG676C |
|---|---|---|---|---|---|---|
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -3 | -2 | -3 | -3 | -3 |
| Temperature Grade | Industrial (I): -40 °C to 100 °C (TJ) | Industrial (I): -40 °C to 100 °C (TJ) | Commercial (C): 0 °C to 85 °C | Commercial (C): 0 °C to 85 °C | Industrial (I): -40 °C to 100 °C (TJ) | Commercial (C): 0 °C to 85 °C |
| Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
关键差异点
- Higher speed grade than the -2 baseline （对比 XC6SLX100-3FGG676I)
- Industrial-temperature operation （对比 XC6SLX100-2FGG676C)
- Same package and family resources across the principal alternatives （对比 XC6SLX100-3FGG676C)
设计说明
Treat the 676-BGA as a high-density routing problem. Use the exact AMD/Xilinx ball map and recommended escape-routing geometry rather than assigning 676-ball positions from a generic BGA library. Place configuration, clock, and decoupling connections directly beneath or close to their assigned balls, and preserve access to all power and ground balls. Because the package is surface mounted and densely connected, paste volume, solder-mask design, via placement, and assembly warpage should be reviewed with the PCB fabricator before release.
Separate the 1.2 V core rail from other supply requirements and follow the pin-specific decoupling guidance in the device documentation. Place bulk and high-frequency decoupling capacitors near the appropriate power and ground balls, and use low-impedance planes or vias to carry current between the source and the FPGA. Do not assume that an average logic-power estimate covers transient current during configuration or high switching activity. Validate rail droop, startup sequencing, and voltage tolerance across temperature and the complete I/O-load range.
Assign clock inputs, dedicated configuration pins, and high-fanout I/O before finalizing the ball map. Keep clock traces short, continuous, and away from noisy switching nets; provide matched-length routing where source-synchronous interfaces require it. Escape I/O according to the selected I/O standard and voltage bank, while accounting for package crosstalk and board-level return paths. Re-run signal-integrity and timing simulations after any layer-stack or component-placement change.
Do not substitute the XC6SLX100-2FG484C merely because it uses the same speed grade: the target has a 676-ball package rather than the 484-ball package. Also distinguish the I and C temperature suffixes and the -2 and -3 speed grades. A mechanically similar FPGA can require different bitstreams, power sequencing, timing constraints, or PCB escape routing. Record the exact ordering code in the schematic, BOM, and assembly documentation to prevent accidental substitution.
合规信息
The package information identifies the device as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status were not stated. AEC-Q100 is not applicable because the target is an industrial-temperature FPGA rather than an identified automotive-qualified variant.
