XC6SLX45-3CSG484I - 43,661 LE Spartan-6 FPGA | Xilinx
料号： XC6SLX45-3CSG484I ✓ 量产中XC6SLX45-3CSG484I 概述
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor in which lookup tables, registers, routing resources, and programmable I/O blocks implement custom logic. Within the device hierarchy, an FPGA belongs to programmable logic devices and combines logic density, parallel processing, configurable interfaces, and deterministic hardware execution. The Spartan-6 LX family targets embedded control, communications, industrial automation, signal processing, and cost-sensitive systems requiring high integration.
The XC6SLX45-3CSG484I provides 6,822 adaptive logic modules and 43,661 logic elements for implementing parallel datapaths, control logic, protocol engines, and state machines. Its 2.04 Mbit of embedded block RAM supports buffers, packet storage, data acquisition, and general-purpose memory functions. The 484-ball CSPBGA package offers 320 I/O according to the device listing, while the -3 speed grade identifies the performance class and the I suffix identifies the industrial temperature grade.
The device uses a 45 nm CMOS process and a 1.2 V nominal core supply. Its 1.14 V to 1.26 V operating range provides the design margin needed for a properly regulated core rail. The 500 MHz internal frequency is not a guarantee that every design will close at that frequency; timing closure depends on architecture, routing, I/O standards, speed grade, tool settings, and board constraints. AMD specifies the complete operating limits and characteristics in the Spartan-6 FPGA data sheet DS162.
Typical uses include industrial controller and sensor-hub designs, industrial networking equipment, high-resolution data-acquisition systems, motor and motion-control platforms, instrument interfaces, and embedded video processing. The combination of programmable logic, dedicated block RAM, and a high pin count permits parallel sensor aggregation, protocol conversion, and real-time filtering without relying on a separate microprocessor for every control task.
PCB implementation requires a precision multilayer layout, local decoupling, careful supply grounding, and complete via-in-pad or fanout planning for the fine-pitch 484-ball package. Designers should also confirm the selected Spartan-6 package pinout file, memory-interface constraints, and I/O voltage requirements before releasing the board layout. Because this package has many balls and dense escape routing, manufacturing capability and assembly-process selection are central design decisions.
This product page combines the key device ratings, verified commercial availability, package and cross-reference details, alternative-part comparisons, and practical implementation guidance. It is intended to help engineers confirm footprint compatibility, assess speed-grade and temperature-grade changes, and plan power, layout, and lifecycle decisions before placing the FPGA into a production design.
直接替换替代料： XC6SLX45-3CSG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX45-3CSG484I （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Speed Grade, Adaptive Logic Modules, Device Type.
XC6SLX45-3CSG484C
✅ 直接替换📋 参考替代料（不在目录中）
XA6SLX45-3CSG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-2CSG484I
✅ 直接替换联系询价
查看数据手册 →XC6SLX45-3FGG484C
✅ 直接替换联系询价
查看数据手册 →XA6SLX45-3CSG484C
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-3CSG484I 最大额定值与电气特性
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Elements | 43,661 LE |
| Adaptive Logic Modules | 6,822 ALM |
| Embedded Memory | 2.04 Mbit |
| Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Process Technology | 45 nm CMOS |
| Speed Grade | -3 |
| Temperature Grade | Industrial |
| 工作温度 | -40 °C to 100 °C (TJ) |
| 封装 | 484-ball CSPBGA, 19 mm x 19 mm |
| Terminal Count | 484 terminals |
| Input/Output Count | 320 I/O |
| 安装方式 | Surface Mount |
| Lead-Free Status | Lead-free |
| REACH Compliance | Compliant |
XC6SLX45-3CSG484I 484-ball cspbga, 19 mm x 19 mm 引脚配置指南
XC6SLX45-3CSG484I（484-ball cspbga, 19 mm x 19 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX45-3CSG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX45-3CSG484I 适用于 6 应用s: Industrial Control and Automation, Industrial Networking Gateway, High-Speed Data Acquisition, Motor and Motion Control, Embedded Instrumentation, Parallel Sensor Aggregation.
Industrial Control and Automation
The XC6SLX45-3CSG484I suits industrial controllers that combine parallel logic, real-time control, and multiple communication interfaces. Its 43,661 logic elements can host state machines, motion-control sequencing, and safety interlocks, while 2.04 Mbit of embedded memory supports local buffering and protocol data. The 484-ball package provides 320 I/O for digital sensors, actuator outputs, encoders, and industrial field buses. The -40 °C to 100 °C junction-temperature specification supports equipment intended for industrial environments, although enclosure design must keep the device below its thermal limits.
推荐
Industrial Networking Gateway
The XC6SLX45-3CSG484I can implement protocol conversion, packet filtering, and parallel data routing in an industrial networking gateway. Its 6,822 adaptive logic modules provide substantial configurable parallelism for Ethernet or field-bus data paths, while the 2.04 Mbit of block RAM can support buffering, packet classification, and descriptor queues. The 320 available I/O leave room for multiple physical interfaces and status signals. A 500 MHz internal clock supports demanding datapaths, although achievable interface rates must be validated through AMD implementation tools and board-level timing analysis.
推荐
High-Speed Data Acquisition
The XC6SLX45-3CSG484I is appropriate for parallel data-acquisition systems requiring deterministic sampling, digital filtering, and programmable trigger logic. Its 43,661 logic elements can accommodate wide parallel processing pipelines, and its 2.04 Mbit of embedded memory can buffer batches of samples between acquisition and transfer stages. The 484-ball package offers 320 I/O for converters, clocks, triggers, and parallel data buses. Designers should use the -3 speed grade when timing margins are tight and verify converter capture timing, input thresholds, and clock jitter rather than assuming the 500 MHz internal frequency determines sampling bandwidth.
推荐
Motor and Motion Control
The XC6SLX45-3CSG484I can serve as the programmable control core in a motor-drive or motion-control system. Parallel logic resources are useful for encoder decoding, current-loop control, PWM generation, fault handling, and deterministic sequencing, while the large I/O count accommodates control signals and multiple position interfaces. The 1.14 V to 1.26 V core range demands a stable low-noise supply, and the -3 grade provides additional timing margin over the -2 option. The design must still include suitable external gate drivers, isolation, current sensing, protection, and thermal management for the power stage.
推荐
Embedded Instrumentation
The XC6SLX45-3CSG484I supports programmable instrument front ends that combine calibration, digital filtering, control sequencing, and communication. Its embedded memory can hold calibration tables, samples, and status records, while the large programmable logic fabric can implement fixed-function signal processing and timing control. The 484-ball CSPBGA provides enough physical connections for analog-to-digital converter inputs, digital buses, displays, and service interfaces. For precise measurements, use the -3 speed grade and validate every analog front end independently; FPGA logic can process sampled information but cannot remove converter noise, reference error, or analog-layout limitations.
推荐
Parallel Sensor Aggregation
The XC6SLX45-3CSG484I is well suited to systems combining numerous digital sensors with local computation and a high-speed uplink. Its 43,661 logic elements can consolidate multiple sensor streams, perform thresholding and filtering, and format data for transmission, while 2.04 Mbit of embedded memory provides short-term buffering. With 320 I/O listed for the device, the package can accommodate numerous parallel sensor inputs and control outputs. Practical deployments should include input conditioning, isolation where required, clock-domain planning, and error checking so a faulty sensor cannot corrupt the combined data stream.
推荐
推荐产品汇总
工程参考数据： XC6SLX45-3CSG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX45-3CSG484C | XA6SLX45-3CSG484I | XC6SLX45-2CSG484I | XC6SLX45-3FGG484C | XA6SLX45-3CSG484C |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | AMD | Xilinx | Xilinx | AMD |
| Package | 484-ball CSPBGA | 484-ball CSPBGA | 484-ball CSPBGA | 484-ball CSPBGA | 484-ball FBGA | 484-ball CSPBGA |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Elements | 43,661 LE | 43,661 LE | 43,661 LE | 43,661 LE | 43,661 LE | 43,661 LE |
| Adaptive Logic Modules | 6,822 ALM | 6,822 ALM | 6,822 ALM | 6,822 ALM | 6,822 ALM | 6,822 ALM |
| Embedded Memory | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit |
| Speed Grade | -3 | -3 | -3 | -2 | -3 | -3 |
| Temperature Grade | Industrial, -40 °C to 100 °C (TJ) | Commercial | Industrial | Industrial | Commercial | Commercial |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
关键差异点
- Industrial-temperature selection within the Spartan-6 LX family （对比 XC6SLX45-3CSG484C)
- Higher performance grade than the -2 alternative （对比 XC6SLX45-2CSG484I)
- Same device capacity and core voltage as the functional equivalent （对比 XA6SLX45-3CSG484I)
设计说明
Treat the CSG484 land pattern as a high-density fanout and escape-routing problem. Assign all power, ground, configuration, clock, and user I/O balls directly from the AMD package pinout file, then confirm the board's microvia and via-in-pad capability against the selected assembly process. Preserve continuous ground-reference planes beneath the device and route sensitive clock inputs away from high-current switching nodes. Do not infer ball functions from a generic 484-ball package drawing.
Design the 1.14 V to 1.26 V core rail for the device's full operating condition rather than a nominal 1.2 V point. Place local decoupling at the device's supply balls, use multiple power and ground connections where the package permits, and keep sensitive returns short and continuous. Follow the power-supply sequencing and ramp requirements in AMD data sheet DS162. Confirm steady-state and transient current through the implementation flow because the available listing does not provide a complete power table.
Use the -40 °C to 100 °C junction-temperature range as a device limit, not an enclosure specification. Estimate board-level junction temperature from ambient temperature, package dissipation, and the PCB's actual thermal path. The 19 mm by 19 mm CSPBGA benefits from a multilayer board with uninterrupted copper around the device, but the final thermal result depends on copper area, via construction, airflow, and neighboring heat sources. Validate the worst-case corner of the operating environment.
Avoid treating the 500 MHz internal clock as a guaranteed system clock. Logic depth, routing congestion, I/O timing, clock skew, and tool directives determine the actual design frequency. Review timing at the intended speed grade, include board-level clock uncertainty, and confirm all external interface timing against the pinout and electrical characteristics in DS162. Also verify that an alternative MPN retains the same power balls, configuration pins, and user I/O assignments before reusing a PCB.
合规信息
The package listing identifies the exact device as lead-free, and the product catalog identifies the XC6SLX45-3CSG484I as REACH compliant. No exact RoHS, halogen-free, conflict-minerals, or automotive qualification statement was confirmed for the target suffix.
