XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
料号： XC6SLX45T-3FG484I ✓ 量产中XC6SLX45T-3FG484I 概述
An FPGA is a digital semiconductor whose internal logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LXT family sits between low-cost Spartan-6 LX devices and larger FPGA families, balancing logic density, embedded processing support, connectivity, and implementation cost. XC6SLX45T-3FG484I is therefore useful when a fixed-function controller is insufficient but a larger or more expensive programmable-logic platform would be unnecessary.
The verified product information identifies 43,661 logic cells, 45 nm CMOS fabrication, and 1.2 V operation for this device. The 484-ball package provides a high-density surface-mount interface suitable for multilayer PCB designs. The -3 speed designation is a meaningful selection criterion because FPGA timing, achievable clock rates, and design-tool performance targets must be evaluated together rather than treating the FPGA as a conventional fixed-function IC.
Spartan-6 LXT devices are designed for parallel processing, high-speed interface bridging, custom data acquisition, industrial automation, communications infrastructure, embedded vision, and test-and-measurement systems. Their parallel logic fabric allows multiple independent channels or algorithms to execute concurrently, while dedicated block RAM reduces external-memory traffic for suitable buffering operations and DSP slices accelerate arithmetic-heavy filtering and signal-processing tasks.
The primary PCB constraint is the 484-ball FBGA land pattern. Because its interconnects are fine-pitch and distributed beneath the package, escape routing, power-plane continuity, via structure, solder-mask design, and assembly capability require careful planning. The design must also be checked against the selected AMD or Xilinx implementation toolchain and the exact device, package, speed grade, and temperature-grade identifiers.
Before releasing a new PCB, compare the target against XC6SLX45T-2FG484C, XC6SLX45T-2FGG484I, XC6SLX45T-N3FG484I, XC6SLX45-3FG484I, and XC6SLX45T-3FGG484I using the package pin files and device selection guidance. Speed-grade, temperature-grade, marking, and ordering-code differences affect qualification even when the mechanical footprint remains unchanged.
This product page consolidates verified distributor pricing, package information, same-footprint alternatives, technical comparison data, and practical PCB-design guidance. Those details help engineers separate true pin-compatible purchasing alternatives from superficially similar Spartan-6 devices and support faster procurement, qualification, and design-review decisions.
直接替换替代料： XC6SLX45T-3FG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
XC6SLX45T-2FG484C
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45T-2FGG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45T-N3FG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-3FG484I
✅ 直接替换联系询价
查看数据手册 →XC6SLX45T-3FGG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45T-3FG484I 最大额定值与电气特性
| Device Type | Spartan-6 LXT Field-Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells |
| Process Technology | 45 nm CMOS |
| 电源电压 | 1.2 V |
| 封装 | 484-pin FBGA |
| Package Type | 484-BBGA |
| 引脚数量 | 484 balls |
| 安装类型 | Surface Mount |
| Terminal Form | Ball |
| Package Shape | Square |
| Speed Grade | -3 |
| Temperature Grade | Industrial |
| FPGA Family | Spartan-6 LXT |
| Package Dimensions | 15 mm x 15 mm |
| Package Pitch | 0.80 mm |
| Programmability | Field-programmable digital logic |
XC6SLX45T-3FG484I 0.80 mm 引脚配置指南
XC6SLX45T-3FG484I（0.80 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX45T-3FG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX45T-3FG484I 适用于 6 应用s: Industrial Automation and Motion Control, Communications and Protocol Bridging, Parallel Signal Acquisition, DSP and Digital Filtering, Test and Measurement Instrumentation, Embedded Vision and Image Processing.
Industrial Automation and Motion Control
The XC6SLX45T-3FG484I fits industrial automation when a controller must execute multiple real-time tasks concurrently. Its 43,661 logic cells can support sequencing logic, machine-state monitoring, encoder or sensor interfaces, and communication handling within one FPGA. The -3 speed grade provides a distinct timing-class option when a design must close at higher clock targets than a -2 device. A 484-ball FBGA also supports dense I/O and power distribution, but the board must be designed for fine-pitch assembly, continuous supply planes, controlled decoupling, and industrial temperature qualification. Engineers should establish worst-case timing and thermal margins before freezing the controller design.
Communications and Protocol Bridging
The XC6SLX45T-3FG484I is appropriate for communications equipment that requires deterministic parallel processing, custom framing, and simultaneous interface handling. Its 43,661-cell Spartan-6 LXT fabric can implement protocol converters, packet processing, clock-domain isolation, and test logic without relying on a single fixed-function microcontroller. Using the -3 grade gives timing analysis a faster performance target than -2 alternatives, while the 484-ball package provides ample physical I/O for parallel and high-speed interfaces. The implementation must still comply with the selected I/O standard, voltage rules, configuration requirements, and timing constraints for every transceiver or transceiver-equivalent interface.
Parallel Signal Acquisition
The XC6SLX45T-3FG484I suits parallel data-acquisition systems that sample, filter, buffer, and route multiple channels simultaneously. The 43,661 available logic cells provide substantial parallel datapath capacity, and the -3 speed grade can improve available timing margin in wide pipelines. Its 484-ball FBGA package makes the device practical for systems requiring many data and control connections, although fine-pitch escape routing demands careful PCB planning. Important design considerations include input-slew limits, clock jitter, bank voltage compatibility, thermal behavior, and whether the selected FPGA block RAM and DSP resources satisfy the acquisition algorithm without excessive external-memory traffic.
DSP and Digital Filtering
The XC6SLX45T-3FG484I can implement digital filtering, fixed-point arithmetic, and other parallel signal-processing functions in an FPGA. Its 43,661 logic cells provide configurable resources beyond ordinary fixed-function DSP devices, allowing the data path to be adapted during development and optimized for timing. The -3 speed designation is relevant when filter stages need higher clock rates or tighter setup margins than a -2 grade. Designers should map multipliers, adders, and memories to the available Spartan-6 LXT resources, verify DSP and block-RAM counts in the supported toolchain, and include scaling or saturation logic wherever overflow would affect the result.
Test and Measurement Instrumentation
The XC6SLX45T-3FG484I is well suited to programmable test equipment requiring parallel stimulus generation, acquisition, sequencing, and result analysis. A single FPGA can consolidate timing-sensitive control logic and data paths, reducing inter-device coordination compared with a processor-centered implementation. Its 43,661 logic cells support concurrent channels, while the -3 grade provides additional timing-class flexibility for high-rate operation. The 484-ball FBGA requires a board with robust reference-clock routing, separated analog and digital power domains, and careful thermal analysis. Engineers should also validate every I/O standard against the instrumentation’s voltage levels before schematic release.
Embedded Vision and Image Processing
The XC6SLX45T-3FG484I can support embedded image pipelines that require parallel pixel movement, thresholding, filtering, and interface conversion. Its programmable fabric allows the data path to be tailored to the sensor and downstream processor, while 43,661 logic cells provide substantial room for concurrent stages. The -3 speed grade may provide useful timing margin for pixel-clock processing, and the 484-ball package offers extensive I/O for sensor and memory connections. Practical implementation requires consideration of image-data bandwidth, block-RAM capacity, external memory timing, clock-domain crossings, and PCB signal integrity for high-volume parallel pixel buses.
工程参考数据： XC6SLX45T-3FG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX45T-2FG484C | XC6SLX45T-2FGG484I | XC6SLX45T-N3FG484I | XC6SLX45-3FG484I | XC6SLX45T-3FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA (FG484) | 484-pin FBGA (FG484) | 484-pin FBGA (FG484) | 484-pin FBGA (FG484) | 484-pin FBGA (FG484) | 484-pin FBGA (FG484) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -3 | -2 | -2 | N3 | -3 | -3 |
关键差异点
- Higher selected speed grade （对比 XC6SLX45T-2FG484C)
- Same verified 484-pin mechanical footprint （对比 XC6SLX45T-2FGG484I)
- Industrial ordering configuration （对比 XC6SLX45T-2FG484C)
- Direct -3 ordering-code continuity （对比 XC6SLX45T-N3FG484I)
设计说明
Treat the 484-ball FBGA as a fine-pitch, high-density assembly and base the PCB layout on the official AMD Spartan-6 package files. Match ball numbering, power balls, configuration pins, and I/O assignments exactly; do not infer them from a generic BGA drawing. Use the documented escape-routing strategy, preserve power-plane continuity beneath the device, and design pad, via, solder-mask, and paste geometry for the assembly process. Because ball-level data was not supplied in the verified records, obtain the exact FG484 package file before releasing fabrication outputs.
Plan separate distribution for each required supply rail and place the manufacturer's recommended decoupling network directly at the associated FPGA balls. The verified product record identifies a 1.2 V supply specification, but it does not provide the complete power-up sequence, rail tolerances, or decoupling values. Those details must be obtained from the manufacturer data and enforced by the PCB and power-supply design. Verify startup current, configuration behavior, supply sequencing, and power-source impedance rather than applying generic capacitor rules.
Reserve clock-capable pins and route the principal clock source using the AMD Spartan-6 clocking guidance before assigning other I/O. Keep the clock path short, symmetric where appropriate, and isolated from noisy switching returns; otherwise FPGA jitter and timing margin may suffer even though the logic-cell count is adequate. Define every bank voltage and I/O standard in the constraints, then review the resulting implementation report. The -3 speed designation can improve timing margin, but it does not correct poor clock routing or incompatible I/O standards.
Do not substitute a similar Spartan-6 order code solely from its 484-pin package name. Differences in the -2, -3, or N3 speed designation can change timing and power behavior, while T, I, C, and G ordering positions can affect temperature qualification, marking, or product status. Download the official package pin file, compare it against the candidate device, verify tool support, and obtain a formal procurement cross-reference. Also avoid treating the $66.3927 LCSC starting price as a committed volume quote.
合规信息
The supplied search results identify lead-free wording for a related FGG484I listing, but no explicit compliance declaration for the exact XC6SLX45T-3FG484I was provided. Compliance fields therefore remain unknown rather than being inferred from family-level or related-device wording.
