XC7A50T-2FG484I - 52,160-L Logic Artix-7 FPGA | AMD
料号： XC7A50T-2FG484I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $250 | $250.00 |
| 10 | $225 | $2,250.00 |
| 100 | $195 | $19,500.00 |
| 500 | $170 | $85,000.00 |
| 1,000 | $150 | $150,000.00 |
XC7A50T-2FG484I 概述
A field-programmable gate array is a programmable-logic semiconductor: configurable logic blocks, digital signal processing resources, block RAM, and programmable I/O are combined on one integrated circuit. An FPGA sits within the broader semiconductor and programmable-logic hierarchy, allowing parallel hardware functions to be implemented and revised without changing the PCB. This makes the Artix-7 family suitable for control, signal processing, communications, and embedded systems where parallel throughput and reconfigurability matter.
The XC7A50T-2FG484I combines 52,160 logic elements with 2.64 Mbit embedded memory in the supplied comparison data. Its 484-pin FBGA package provides extensive board connectivity for high-speed interfaces and external memory. The “-2” speed designation and “I” temperature suffix are family ordering codes, but the verified excerpt does not provide complete timing, temperature, or power values; those parameters should be checked in the AMD datasheet before design release.
The device is appropriate for industrial automation, robotics, embedded control, communications, instrumentation, and signal-processing designs. Its large I/O count is useful when a design combines multiple parallel buses, high-speed transceivers, DDR memory, clocks, and management signals. Compared with smaller FPGAs, the XC7A50T provides more parallel resources, but its 484-BBGA package requires careful PCB escape routing, thermal planning, and manufacturing control.
A key design consideration is package complexity: the dense FBGA footprint demands via-in-pad or via-under-bump considerations, precise ball assignment, and validated manufacturing rules. Power, decoupling, clocking, configuration, and high-speed signal-integrity requirements also depend on the selected board stack-up and the exact I/O standards enabled.
This page consolidates verified distributor specifications, package information, source links, and engineering-oriented selection guidance. It distinguishes confirmed values from parameters that require the manufacturer datasheet, avoiding invented electrical or lifecycle claims.
直接替换替代料： XC7A50T-2FG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7A50T-2FG484I （相同外形与封装尺寸） ——差异在于 Block RAM, Configuration, Package, Process Technology.
快速对比工具——选择替代料号进行并排对比：
XC7A50T-2FGG484I
✅ 直接替换✓ 有现货
$27.5 / 个
查看数据手册 →XC7A50T-1FGG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC7A50T-2FGG484C
✅ 直接替换📋 参考替代料（不在目录中）
XC7A50T-2FGG484I
✅ 直接替换✓ 有现货
$27.5 / 个
查看数据手册 →XC7A50T-1FGG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC7A50T-2FG484I 最大额定值与电气特性
| FPGA Family | Artix-7 |
| Logic Elements | 52,160 logic elements |
| Adaptive Logic Modules | 8,150 ALM |
| Embedded Memory | 2.64 Mbit |
| I/O Count | 250 I/O |
| 封装 | 484-pin FBGA |
| 安装类型 | Surface mount |
| Process Technology | 28 nm CMOS |
| 电源电压 | 1 V |
| Series | XC7A50 |
| Product Type | Field-programmable gate array (FPGA) |
| Configuration | Configurable programmable logic device |
| Temperature Suffix | I |
| Speed Suffix | 2 |
| RoHS 状态 | Compliant |
| Block RAM | 2.64 Mbit total embedded memory |
XC7A50T-2FG484I 484-pin fbga 引脚配置指南
XC7A50T-2FG484I（484-pin fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC7A50T-2FG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC7A50T-2FG484I 适用于 6 应用s: Industrial Automation Controller, Robotics and Motor Control, Communications and Protocol Conversion, Embedded Signal Processing, Data Acquisition and Instrumentation, Secure Embedded Systems.
Industrial Automation Controller
The XC7A50T-2FG484I fits industrial automation controllers that combine parallel machine-control logic, sensor conditioning, communications, and local storage. Its 52,160 logic elements and 8,150 ALMs provide substantial programmable capacity, while 250 I/O support multiple buses, discrete inputs, outputs, counters, and interface signals. The 484-pin FBGA also leaves room for external memory and high-speed control peripherals when they are required. In a factory controller, the FPGA could implement timing-critical sequencing, encoder capture, interlocks, and protocol conversion. Before release, verify the I voltage, temperature grade, clocking scheme, EMC constraints, and long-term supply using AMD documentation.
推荐
Robotics and Motor Control
The Artix-7 FPGA is well suited to robotic control because parallel programmable logic can coordinate motion profiles, encoder feedback, sensor fusion, and safety interlocks. The 52,160 logic-element device can host multiple control channels and timing-critical state machines, while its 250 I/O count supports encoder, pulse-width, analog-control, communications, and discrete signaling paths. The 2.64 Mbit embedded memory can hold trajectory, calibration, or diagnostic data, although memory bandwidth and resource mapping must be checked against the AMD device data. For motor systems, place power conversion and isolation outside the FPGA domain and validate grounding, isolation, timing, and thermal performance in the complete system.
推荐
Communications and Protocol Conversion
The XC7A50T-2FG484I can be used in communications equipment where parallel FPGA logic improves throughput and makes protocol handling flexible. The available 250 I/O and 2.64 Mbit embedded memory can support packet buffers, parallel-to-serial conversion, framing logic, and multiple interface domains. Its 52,160 logic elements also allow substantial concurrent datapath implementation compared with a small microcontroller. Designers should allocate pins according to the device’s supported I/O standards, review AC timing for the selected speed grade, and implement clocking and equalization according to the AMD board-design guidance. The part’s role in a communications product does not itself establish protocol certification or compliance.
推荐
Embedded Signal Processing
The Artix-7 device is suitable for embedded signal-processing functions that benefit from deterministic parallel execution, such as filtering, modulation, data reduction, or interface pre-processing. Its 52,160 logic elements provide substantial combinational and sequential capacity, while the embedded memory total of 2.64 Mbit can support buffering and coefficient storage where the required architecture permits. The 484-pin package exposes many I/O for ADC, DAC, digital sensor, and memory connections. Actual throughput depends on DSP resources, memory interfaces, clock frequency, and I/O timing values that are not included in the supplied excerpts. Engineers should obtain the device resource tables and timing data before committing to throughput targets.
推荐
Data Acquisition and Instrumentation
The XC7A50T-2FG484I can serve as the digital control core in a data-acquisition or instrumentation system that must gather multiple channels and perform deterministic processing. The 250 I/O count can accommodate parallel sensor interfaces, trigger signals, clock distribution, status indicators, and communications ports. The 2.64 Mbit embedded memory can assist with sample buffering, while the programmable logic can implement filtering, calibration tables, timing control, and protocol conversion. For laboratory or test equipment, supply rails must be quiet and stable, clocks must be carefully routed, and the 484-BBGA assembly process must be qualified. Confirm analog, isolation, and safety requirements separately from the FPGA specification.
推荐
Secure Embedded Systems
The XC7A50T-2FG484I is suitable as the programmable control fabric in an embedded system requiring hardware-assisted logic, protocol handling, or secure I/O partitioning. A 52,160-logic-element FPGA can implement multiple control paths in parallel, and the 250 I/O count provides flexibility for sensors, memory, communications, and external accelerators. FPGA configuration security and system-level authentication still require appropriate design measures; those protections are not established by the supplied distributor excerpts. Use a reproducible configuration process, protect the configuration interface, validate boot behavior, and review the device’s security capabilities in the official AMD documentation before treating it as a secure component.
推荐
推荐产品汇总
工程参考数据： XC7A50T-2FG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7A50T-2FGG484I | XC7A50T-1FGG484I | XC7A50T-2FGG484C | XC7A50T-2FGG484I | XC7A50T-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Process Technology | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS |
| Supply Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| Temperature Grade | I suffix; exact range not supplied | I suffix; exact range not supplied | I suffix; exact range not supplied | C suffix; exact range not supplied | I suffix; exact range not supplied | I suffix; exact range not supplied |
| Speed Grade | 2 | 2 | 1 | 2 | 2 | 1 |
关键差异点
- High logic density in the same Artix-7 family （对比 XC7A50T-2FGG484I)
- Same 484-pin package family （对比 XC7A50T-1FGG484I)
- Industrial-oriented I suffix （对比 XC7A50T-2FGG484C)
- Parallel programmable-logic capacity （对比 XC7A50T-1FGG484I)
设计说明
The 484-pin FBGA package requires a controlled escape-routing strategy. Use the AMD Artix-7 package pinout files and the selected board stack-up as the source of truth for every ball assignment. Check whether the assembly process uses via-in-pad, via-under-bump, or another interconnect method, and validate solder-mask, paste, and land-pattern rules with the package drawing and assembler capability.
Plan the power tree around the device’s 1 V supply description and the specific I/O rails required by the selected interfaces. Separate core and I/O noise paths, place bulk and high-frequency decoupling near the relevant power balls, and verify steady-state and transient current against the AMD power-estimation tools. Do not infer allowable I/O voltage levels from the distributor excerpts; use the device pinout and electrical tables for each bank.
Use the 52,160 logic elements and 250 I/O only after assigning interfaces according to supported standards and bank constraints. For memory, clocks, serial links, or parallel buses, use controlled-impedance routing, return paths, source-synchronous layout rules, and the AMD timing constraints. The large I/O count does not mean every ball is freely usable; configuration, clocks, power, and dedicated functions must be reserved first.
Thermal design should begin with the actual utilization of programmable logic, I/O activity, clocking, and attached memory. A 484-BBGA package can be thermally challenging in compact systems because heat must leave the device through the board and its copper structure. Use the manufacturer thermal models and power reports, maintain a qualified solder-joint and via pattern, and verify temperature rise in the assembled mechanical design rather than relying only on component specifications.
合规信息
The supplied distributor result states RoHS Compliant. REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification information are not provided. The I suffix is an ordering designation, but the supplied data does not state the exact operating-temperature range.
