XC7K160T-2FF676C - 162K Kintex-7 FPGA | AMD/Xilinx
料号： XC7K160T-2FF676C ✓ 量产中XC7K160T-2FF676C 概述
An FPGA is a semiconductor whose digital circuit is defined after manufacture by loading a configuration bitstream. Within the broader semiconductor hierarchy, an FPGA is a programmable-logic IC and a field-programmable gate array. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed for protocol bridging, parallel processing, signal acquisition, control logic, or other system functions, while its 676-ball package provides a high-density connection interface to external memory, converters, transceivers, and clock sources.
The Kintex-7 family combines programmable logic with dedicated hardware for DSP and serial connectivity. The XC7K160T-2FF676C provides 162,240 logic cells and 400 user I/O in an FCBGA-676 package. Its 28 nm process technology supports a 1 V core operating voltage, while the 676-contact package supports dense board-level interconnect. The device is identified by the XC7K160T family, -2 performance suffix, and the FF676C package and commercial-grade ordering suffix.
Because this is an FPGA rather than a fixed-function converter or processor, its implemented performance depends on the configuration, logic mapping, memory organization, clocking scheme, and external circuitry. The -2 ordering code denotes a specific performance grade within the Kintex-7 ordering system. Designers should use the device documentation and the pinout associated with the exact order code when assigning power rails, clock inputs, configuration pins, high-speed transceiver pins, and general-purpose I/O.
Typical applications include high-speed interface aggregation, network equipment, industrial control and test systems, signal-processing platforms, embedded vision, communications infrastructure, and FPGA-based accelerators. The large logic capacity is useful when a design combines parallel datapaths with serial links, while the 400 user I/O allows external memory and multiple peripheral interfaces to be connected without a separate programmable-logic device.
PCB design requires close attention to the FCBGA ball map, multilayer escape routing, power-plane integrity, decoupling, thermal management, and high-speed clock and transceiver layout. The 676-pin package does not match the available package-diagram library, so use the official package drawing and pin table for land-pattern and routing work. Confirm the exact suffix interpretation and temperature grade against the manufacturer ordering guide before release.
This product record combines device specifications, package details, practical design guidance, and same-family replacement comparisons. It also distinguishes directly relevant package and speed-grade options from alternatives that require a different footprint, helping engineers narrow a replacement search without assuming that every Kintex-7 ordering code is interchangeable.
直接替换替代料： XC7K160T-2FF676C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7K160T-2FF676C （相同外形与封装尺寸）.
XC7K160T-2FFG676C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K160T-2FBG676C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K160T-1FBG676C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K160T-1FF676I
✅ 直接替换联系询价
查看数据手册 →XC7K160T-2FF676C 最大额定值与电气特性
| Device Type | Kintex-7 field-programmable gate array |
| Logic Cells | 162,240 cells |
| Process Technology | 28 nm |
| Core Operating Voltage | 1 V |
| User Input/Output Count | 400 I/O |
| 封装 | 676-pin FCBGA |
| Package Ball Count | 676 balls |
| 安装类型 | Surface mount |
| Performance Grade | -2 |
| Temperature Grade | Commercial grade |
XC7K160T-2FF676C 676 balls 引脚配置指南
XC7K160T-2FF676C（676 balls 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC7K160T-2FF676C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC7K160T-2FF676C 适用于 6 应用s: High-Speed Network Interface Aggregation, Industrial Control and Test Systems, Digital Signal Processing and Acceleration, Communications and RF Signal Processing, Embedded Vision and Sensor Processing, Aerospace-Grade FPGA Platform.
High-Speed Network Interface Aggregation
The XC7K160T-2FF676C fits network-interface designs that combine parallel processing with multiple high-speed communication paths. Its 162,240 logic cells can implement packet handling, buffering, protocol conversion, traffic management, and test logic, while 400 user I/O provide substantial connectivity to external PHYs, memories, and control processors. The -2 performance grade is appropriate when timing margin is important in wide interfaces or deeply pipelined logic. A practical design uses clocked data paths, dedicated high-speed transceiver resources where applicable, and carefully controlled board routing. Confirm the available transceiver or I/O resources for the selected configuration, verify timing against the -2 speed grade, and validate the complete FF676C ball map before release.
推荐
Industrial Control and Test Systems
The XC7K160T-2FF676C is suitable for industrial control, instrumentation, and automated-test systems requiring parallel I/O, deterministic logic, and flexible signal routing. The 162,240 logic cells can coordinate acquisition channels, implement timing and sequencing engines, supervise sensors, and combine control logic with communication functions. Its 400 user I/O allow substantial direct connectivity to level shifters, relays, converters, and test fixtures. For equipment operating outside the commercial temperature range, select an ordering variant explicitly qualified for that environment rather than assuming the FF676C suffix defines it. Design the power system, clock distribution, isolation, and input thresholds around the complete manufacturer specifications.
推荐
Digital Signal Processing and Acceleration
The XC7K160T-2FF676C can accelerate DSP, filtering, waveform generation, spectral analysis, and other parallel arithmetic workloads that benefit from programmable hardware. Its 162,240 Kintex-7 logic cells allow designers to balance dedicated DSP operations with custom datapaths, while 400 user I/O support wide parallel buses and external memory interfaces. The -2 grade can improve timing headroom for pipelined arithmetic, but sustained performance depends on clock frequency, memory bandwidth, and data placement. Use registered interfaces between external memories and the FPGA, account for banking restrictions, and evaluate the implemented design with realistic timing and resource utilization rather than relying on nominal cell counts alone.
推荐
Communications and RF Signal Processing
The XC7K160T-2FF676C fits communications systems where programmable digital filtering, modulation, packet processing, and interface consolidation are required. The large logic-cell count supports parallel channel processing, while the 400 user I/O offer connectivity to converters, transceivers, and digital interfaces. Kintex-7 devices are especially useful when a design must combine logic with dedicated serial or DSP resources rather than using separate fixed-function devices. Maintain short return paths for high-speed signals, use continuous reference-plane returns under the FPGA, and separate sensitive clocking from switching or power-converter regions. Validate the exact transceiver population, pin assignments, and package-code mapping for the production device.
推荐
Embedded Vision and Sensor Processing
The XC7K160T-2FF676C supports embedded vision, camera-processing, and sensor-fusion designs that need deterministic parallel logic and flexible external connectivity. Its 162,240 cells can process pixel streams, perform thresholding and filtering, control sensors, and interface with memory or network components, while 400 user I/O provide additional parallel sensor and control channels. The -2 grade helps when pixel timing, wide buses, and multi-stage pipelines require additional timing margin. Use source-synchronous routing conventions for camera or display interfaces, define clock domains carefully, and place decoupling close to the relevant power balls. Verify actual lane counts and I/O availability after accounting for dedicated clock, configuration, and transceiver functions.
推荐
Aerospace-Grade FPGA Platform
The XC7K160T-2FF676C can serve as the programmable-logic element in a high-reliability aerospace platform when the selected ordering code, radiation qualification, temperature range, and screening requirements satisfy the program. The 162,240 logic cells support avionics data paths, sensor fusion, communications framing, and redundant control or monitoring logic, while 400 user I/O connect field buses, converters, memories, and redundant power systems. The device's 1 V core and 676-ball FCBGA require a carefully engineered multilayer power and escape-routing design. Before use in flight hardware, obtain the applicable aerospace product document and qualification record, then complete radiation, environmental, and functional-assurance reviews for the exact order code.
推荐
推荐产品汇总
工程参考数据： XC7K160T-2FF676C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7K160T-2FFG676C | XC7K160T-2FBG676C | XC7K160T-2FBG676I | XC7K160T-1FFG676C | XC7K160T-1FBG676C | XC7K160T-1FF676I |
|---|---|---|---|---|---|---|---|
| Package | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA | 676-pin FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Kintex-7 XC7K160T | Kintex-7 XC7K160T | Kintex-7 XC7K160T | Kintex-7 XC7K160T | Kintex-7 XC7K160T | Kintex-7 XC7K160T | Kintex-7 XC7K160T |
| Logic Cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells |
| User I/O Count | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Operating Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| Performance Grade | -2 | -2 | -2 | -2 | -1 | -1 | -1 |
| Ordering Grade | Commercial | Commercial | Commercial | Industrial | Commercial | Commercial | Industrial |
关键差异点
- Higher -2 performance grade within the same 676-ball Kintex-7 family （对比 XC7K160T-1FBG676C)
- Direct 676-ball ordering option without changing the FPGA family （对比 XC7K160T-2FBG676C)
- Commercial-grade target with a documented industrial-grade family option （对比 XC7K160T-2FBG676I)
设计说明
Do not begin PCB escape routing from a generic 676-BBGA symbol. Use the exact FF676C ball map and package-code mapping from the manufacturer documentation, especially for power, configuration, clock, transceiver, and general-purpose I/O balls. Mark all NC and reserved balls explicitly in the schematic and compare the constraint file against the released package drawing. A package-suffix mismatch can otherwise produce a mechanically correct board with incorrect electrical connections.
Plan the 1 V core rail and every auxiliary rail as a complete power-distribution network, using the manufacturer voltage and current requirements for the exact speed and temperature grade. Place high-frequency decoupling close to the relevant package balls, provide low-impedance reference-plane connections, and keep switching-converter loops compact. Estimated thermal design must begin with total package dissipation and the actual junction-to-ambient thermal path; do not rely on a generic FCBGA thermal value for the finished board.
Separate clock, transceiver, and high-speed data routing from noisy power-converter regions, and provide continuous reference planes beneath routed layers. Match lengths according to the interface standard and architecture, use clocking resources with controlled jitter rather than relying on fabric-routed clocks for demanding interfaces, and validate the final design with simulation or measurement. The 400 user I/O count does not imply that all 400 balls are freely routable in any banking arrangement.
Avoid treating a lower speed grade as an automatic drop-in substitution and do not assume that the I ordering suffix merely changes temperature labeling. Compare timing tables, package drawings, configuration requirements, operating-temperature limits, and any qualification records for the exact replacement. Similarly, exclude 484-ball variants from a physical drop-in list because their footprints and ball counts differ. Document every approved substitution in the schematic, BOM, and firmware configuration notes.
合规信息
Compliance attributes are not stated for this exact order code in the product and comparison records. Confirm the current manufacturer product declaration or material compliance report for the production lot.