XC7K70T-1FB484C - Kintex-7 FPGA, 65K LCs, 484-FCBGA | AMD
料号： XC7K70T-1FB484C ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $380 | $3,800.00 |
| 100 | $335 | $33,500.00 |
| 500 | $295 | $147,500.00 |
| 1,000 | $258 | $258,000.00 |
XC7K70T-1FB484C 概述
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as DSP slices, block RAM, and transceivers. Within the broader programmable-logic hierarchy (FPGA → programmable logic → digital IC → semiconductor), FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism that microcontrollers cannot match. The Kintex-7 series inherits high-end features from Virtex-7 while targeting mainstream markets where cost-per-logic and DSP ratio are decisive.
Key features include 4,976,640 system gates and 65,600 logic cells organized into 5,125 CLBs, with speed grade -1 and commercial (C) temperature qualification. Integrated hard IP blocks include DSP slices for high-performance fixed- and floating-point arithmetic, up to 156 maximum transceivers at speeds suitable for high-speed serial protocols, and an embedded Block RAM and UltraRAM hierarchy. The 484-ball FCBGA package provides ample I/O (285 user I/O) and a 1.00 mm terminal pitch, suitable for high-density board layouts.
The XC7K70T-1FB484C is the speed-grade -1 variant of the Kintex-7 family using the FB484 ball-grid package. Same-die speed-grade uprades (e.g. -2, -3) exist in identical packaging and increase Fmax timing margin; extended-temperature (I grade) variants also share the FB484 footprint. Through silicon interconnect technology packages of the same pinout (FBG484/FBV484) use the same die and can be interchanged on the same PCB layout where JESD-30 ball-pattern compatibility is verified.
Typical applications include 5G and wired communication MAC-layer processing, high-speed interface bridging, protocol encapsulation/decapsulation, data-channel aggregation, and DSP-intensive baseband functions. Designers commonly pair the Kintex-7 with DDR3 memory controllers, PCIe Gen2 endpoints, and SFP/SFP+ transceivers. Compared with the smaller Artix-7 family, Kintex-7 offers roughly 2× the serial bandwidth and DSP resources at a moderate cost premium, making it a sweet spot for mid-range wireline and wireless systems.
When designing with this FPGA, ensure that power rail sequencing follows AMD Xilinx UG483 recommendations (VCCINT first, then VCCAUX, then VCCO for IO banks). The FB484 package's thermal resistance requires a thermal via array under the central BGA ground balls to maintain junction temperature under full DSP utilization.
直接替换替代料： XC7K70T-1FB484C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
XC7K70T-1FBG484C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K70T-2FB484C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K70T-1FBV484C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K70T-2FBG484C
✅ 直接替换📋 参考替代料（不在目录中）
XC7K70T-1FBG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC7K70T-1FB484C 最大额定值与电气特性
| Family | Kintex-7 |
| Process Technology | 28 nm HKMG (CMOS) |
| Logic Cells | 65,600 |
| System Gates | 4,976,640 |
| CLBs | 5,125 |
| User I/Os | 285 |
| 封装 | 484-ball FCBGA (FB484) |
| Terminal Pitch | 1.00 mm |
| Speed Grade | -1 |
| Temperature Grade | Commercial (C, 0C to +85C) |
| Supply Voltage (Core) | 0.97 V to 1.03 V (nominal 1.0 V) |
| 安装类型 | Surface Mount |
| Package Code (JESD-30) | S-PBGA-B484 |
| RoHS 状态 | Compliant (per DigiKey listing) |
XC7K70T-1FB484C s-pbga-b484 引脚配置指南
XC7K70T-1FB484C（s-pbga-b484 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC7K70T-1FB484C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC7K70T-1FB484C 适用于 6 应用s: 5G and Wired Communication MAC-Layer Processing, High-Speed Interface Bridging and Protocol Conversion, DSP-Intensive Baseband and Channel Processing, Video Broadcast and Image Processing Pipelines, Industrial Control and Machine Vision, Aerospace Avionics and Test Equipment.
5G and Wired Communication MAC-Layer Processing
The Kintex-7 XC7K70T-1FB484C is well-suited to MAC-layer baseband and fronthaul/intermediate processing in 5G base stations, LTE small cells, and wired backhaul. Its 65,600 logic cells and integrated high-speed serial transceivers give the throughput required for 10G/25G Ethernet, CPRI, and eCPRI links while the on-chip DSP slices accelerate modulation, coding, and channelization. Paired with a DDR3 memory controller (via Vivado MIG) and PCIe Gen2 endpoint, the device handles aggregation, mapping, and QoS scheduling for multiple carriers on a single chip. The commercial temperature grade suits indoor cabinet and baseband-unit deployment, and the 484-ball FCBGA leaves enough user I/O for multi-port SFP+ cages plus board-to-board links to the RF front end.
推荐
High-Speed Interface Bridging and Protocol Conversion
The XC7K70T-1FB484C's combination of multi-gigabit transceivers and flexible SelectIO makes it ideal for bridging between PCIe, SFP+, SATA, and custom serial protocols in telecom and datacenter equipment. Designers can implement protocol encapsulation and decapsulation, data-channel aggregation, and rate-matching in dedicated RTL without external bridges. The 285 user I/Os accommodate multiple SFP+ cages plus board-to-board interconnect to a host CPU or switch ASIC. Compared with a CPLD or small FPGA approach, the Kintex-7 retains headroom for additional glue logic and statistics engines, while the Vivado IP catalog provides certified PCIe Gen2 and 10G Ethernet cores, reducing time-to-market for protocol-conversion designs.
推荐
DSP-Intensive Baseband and Channel Processing
With roughly 240 DSP48E1 slices available in this density, the XC7K70T-1FB484C delivers the multiply-accumulate throughput required for radar pulse compression, digital down/up-conversion, MIMO processing, and software-defined radio (SDR) channelizer designs. The Kintex-7 DSP architecture provides 25×18-bit signed multipliers and 48-bit accumulators, suitable for fixed-point QAM/QPSK demodulation and FFT/iFFT pipelines. Designers place the FPGA between the ADC/DAC and the host processor, running the high-rate signal-processing loops on-chip while offloading slow control and statistics to an embedded ARM or external CPU. Its commercial temperature grade covers indoor test equipment; for outdoor deployment, the XC7K70T-1FBG484I industrial variant in the same FB484 footprint extends operating range to -40C to +100C.
推荐
Video Broadcast and Image Processing Pipelines
Broadcast video routers, multi-viewers, and industrial image-processing boards rely on the Kintex-7's block RAM, DSP, and video-processing IP to handle real-time 4K and HD-SDI streams. The XC7K70T-1FB484C's 285 user I/Os accept multiple SDI inputs, while transceivers support SMPTE 2022, HDMI, or DisplayPort output. On-chip DSP slices accelerate color-space conversion, scaling, deinterlacing, and overlays without external ASSPs. Pairing the FPGA with DDR3 external memory lets designers implement frame buffers and lookup tables for calibration data, while the PCIe Gen2 endpoint offers plug-in card connectivity to host servers. The 484-ball FCBGA keeps trace length matched for high-speed serial links needed for uncompressed 4K.
推荐
Industrial Control and Machine Vision
Factory automation lines and machine-vision systems use the XC7K70T-1FB484C for real-time image inspection, PLC co-processing, and deterministic EtherCAT / Profinet slave interfaces. Its 65,600 logic cells handle multi-camera GigE Vision or CoaXPress aggregation, while block-RAM tiles implement line buffers and statistics accumulators. The FCBGA-484 footprint supports multiple SFP+ cages for camera links and a PCIe Gen2 link to the host PC. Compared with a CPU-only approach, the FPGA delivers deterministic latency and frees the host CPU for higher-level analytics. The commercial temperature grade is acceptable for IP54 enclosures; for hot factory floors, the industrial-speed FBG484I drop-in (same footprint) extends the operating envelope.
推荐
Aerospace Avionics and Test Equipment
Avionics databus concentrators, MIL-STD-1553 / ARINC 429 bridges, and lab test instrumentation all leverage the XC7K70T-1FB484C's mix of hard transceivers and programmable logic. The device implements multiple ARINC 429 channels, Manchester-encoded databuses, and discrete I/O sampling within a single FB484 package, simplifying board layout versus a multi-chip solution. Embedded test equipment (PXI, LXI) uses the Kintex-7 for waveform generation, signal-conditioning glue, and trigger logic. For high-reliability applications requiring full -40C to +125C operation, the FBG484I industrial variant upgrades the temperature grade without changing the footprint; a full MIL-spec flow needs the XQ (XQ7K70T) variant sourced specifically for defense programs.
推荐
推荐产品汇总
工程参考数据： XC7K70T-1FB484C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7K70T-1FBG484C | XC7K70T-2FB484C | XC7K70T-1FBV484C | XC7K70T-2FBG484C | XC7K70T-1FBG484I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 484-ball FCBGA (FB484) | 484-ball FCBGA (FBG484) | 484-ball FCBGA (FB484) | 484-ball FCBGA (FBV484) | 484-ball FCBGA (FBG484) | 484-ball FCBGA (FBG484) |
| Family / Part | Kintex-7 XC7K70T | Kintex-7 XC7K70T | Kintex-7 XC7K70T | Kintex-7 XC7K70T | Kintex-7 XC7K70T | Kintex-7 XC7K70T |
| Speed Grade | -1 | -1 | -2 (faster Fmax) | -1 | -2 (faster Fmax) | -1 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Logic Cells | 65,600 | 65,600 | 65,600 | 65,600 | 65,600 | 65,600 |
| User I/Os | 285 | 285 | 285 | 285 | 285 | 285 |
| Ball Pitch | 1.00 mm | 1.00 mm | 1.00 mm | 1.00 mm | 1.00 mm | 1.00 mm |
| Core Voltage (Nominal) | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Pricing (Octopart 2026-10-21, qty 1) | ~$425 | ~$425 (same die/package code) | ~+15% premium for -2 speed grade | ~$425 | ~+15% premium for -2 speed grade | ~+5% for industrial temperature |
关键差异点
- Drop-in same-footprint lead-free upgrade path （对比 XC7K70T-1FBG484C)
- Speed-grade upgrade with identical ball pattern （对比 XC7K70T-2FB484C)
- Extended-temperature variant in identical BGA （对比 XC7K70T-1FBG484I)
- BGA solder-ball material variant without footprint change （对比 XC7K70T-1FBV484C)
设计说明
Follow AMD Xilinx UG483 (Kintex-7 PCB Design Guide) power-rail sequencing: bring up VCCINT (1.0 V) first, then VCCAUX/VCCAUX_IO (1.8 V), then VCCO for each I/O bank; failure to sequence can trigger latch-up or in-rush current damage. Estimate VCCINT current at 65-80% utilization at 1.0 V core around 2-3 A; provide at least a 6-layer PCB with dedicated power planes and decoupling of 100 nF / 4.7 uF / 22 uF per bank. For designs using transceivers at multi-gigabit rates, supply VCCO_HP and MGTAVCC/MGTRREF rails separately per UG475.
The 484-ball FCBGA package has a published junction-to-ambient thermal resistance in the order of 12-15 C/W with the recommended thermal-via array under the BGA footprint. At 4-5 W typical FPGA dissipation (Kintex-7 K70T), size the PCB thermal via array to at least 9 vias in the central ground-ball pattern and ensure a continuous ground plane on the inner layers. Estimated: 5 W / 12 C/W theta-JA = ~60 C rise above ambient in still air - provide 200-300 LFM airflow if the enclosure is sealed. Validate with the Xilinx Power Estimator (XPE) spreadsheet before board tape-out.
Estimating: do not assume 100% I/O bank flexibility - VCCO banking (HR vs HP) constrains which I/O standards a given bank can support, and the FB484 pinout groups pins by bank per UG475. Configure banks in Vivado before pin assignment; bank-conflict errors are a common cause of post-routing board rework. Watch for partnumber mismatches in PCB documentation - FB484, FBG484, and FBV484 share the same ball pattern but can require a Vivado target-device recompile. The XC7K70T bitstream is NOT compatible with XC7K160T or XC7K325T; do not mix die densities on the same footprint without rerunning place-and-route.
Multi-gigabit transceivers (MGT) routing must follow AMD Kintex-7 GTH/GTX PCB guidelines: matched differential length with 100-ohm differential impedance, no more than two vias per lane, AC-coupling caps placed symmetrically near the FPGA, and a continuous reference ground plane. Keep MGT lanes on the top and adjacent stripline layers with reference return paths. Reference AMD user guide UG475 (package pinout) and UG476 (transceiver user guide). Use IBIS-AMI models for channel simulation at 10 Gbps and above before committing to PCB stack-up.
合规信息
RoHS compliance and lead-free status confirmed by DigiKey and Mouser distributor listings as of 2026-10-21. AEC-Q100 not applicable (Kintex-7 is not an automotive-qualified FPGA line; Xilinx XA devices cover automotive). REACH conflict-minerals reporting per AMD-Xilinx corporate compliance statements not captured in scraped data.
