XCKU5P-1FFVD900I - Kintex UltraScale+ FPGA | AMD
料号： XCKU5P-1FFVD900I ✓ 量产中XCKU5P-1FFVD900I 概述
A field-programmable gate array is a reconfigurable digital semiconductor in which programmable logic blocks, programmable input/output resources, embedded memory, clocking, and dedicated serial transceivers form a flexible hardware platform. Kintex UltraScale+ devices belong to the FPGA hierarchy and combine parallel programmable logic with high-speed serial connectivity, supporting designs that benefit from hardware parallelism, rapid prototyping, and field-updatable configurations.
Principal characteristics include 474,600 logic cells and 27,120 configurable logic blocks in a -1 performance grade. The 900-ball FCBGA package supports dense, high-performance interconnect requirements, while the industrial temperature designation supports operation from -40°C to +100°C. The device combines large programmable logic capacity with integrated high-speed resources for demanding communications, processing, storage, and test systems.
The -1 suffix identifies the device performance grade within AMD's Kintex UltraScale+ ordering scheme. Device configuration is handled through the AMD FPGA programming ecosystem, and board-level implementation must follow the package pinout, power architecture, decoupling, clocking, and thermal guidelines in the Kintex UltraScale+ documentation. Exact I/O counts, memory totals, transceiver ratings, power limits, and configuration interface details require the corresponding manufacturer tables for the selected device.
Typical implementation areas include high-speed data conversion, industrial networking, test and measurement, video and image processing, communications infrastructure, and compute-intensive accelerator prototypes. The large logic-cell count supports parallel datapaths, while integrated serial interfaces can reduce external component count in systems requiring high-bandwidth links.
A successful design depends on PCB escape routing from the 900-ball package, adequate multi-rail supply sequencing, thermal management, and signal-integrity control on high-speed interfaces. Use the AMD package files and design tools to validate pin assignments and timing rather than relying on generic BGA layouts, because ball location, power planes, and high-speed routing determine whether the selected FPGA achieves its intended performance.
This page combines the exact device identity, package and capacity characteristics with practical FPGA design guidance, available sourcing data, comparison parameters, and same-family replacement considerations. It also distinguishes true same-footprint choices from broader FPGA alternatives that may require a different package, power design, or device migration.
直接替换替代料： XCKU5P-1FFVD900I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
XCKU5P-L1FFVD900I
✅ 直接替换📋 参考替代料（不在目录中）
XCKU5P-2FFVD900I
✅ 直接替换📋 参考替代料（不在目录中）
XCKU5P-1FFVD900E
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XCKU5P-2FFVD900E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCKU5P-L1FFVD900E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCKU5P-1FFVD900I 最大额定值与电气特性
| Product Type | Kintex UltraScale+ field-programmable gate array |
| Logic Cells | 474,600 cells |
| Configurable Logic Blocks | 27,120 CLBs |
| Process Technology | 20 nm |
| Core Voltage | 0.72 V |
| Performance Grade | -1 |
| Package Type | FCBGA |
| Package Ball Count | 900 balls |
| Package Code | FFVD900 |
| Temperature Grade | Industrial |
| 工作温度 | -40°C to +100°C |
| Logic Resource Type | Configurable logic blocks |
| Programmability | Reconfigurable digital logic |
| Device Family | Kintex UltraScale+ |
| Manufacturer | AMD |
| Product Lifecycle | Active |
XCKU5P-1FFVD900I ffvd900 引脚配置指南
XCKU5P-1FFVD900I（ffvd900 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XCKU5P-1FFVD900I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XCKU5P-1FFVD900I 适用于 6 应用s: High-Performance Communications Systems, Test and Measurement Instrumentation, Industrial Network and Control Equipment, Video and Image Processing, Data Storage and Signal Processing, Aerospace and Defense Prototyping.
High-Performance Communications Systems
The XCKU5P-1FFVD900I fits communications equipment requiring substantial programmable logic, dense interconnect, and configurable high-speed datapaths. Its 474,600 logic cells and 27,120 CLBs can support parallel framing, filtering, protocol conversion, and interface adaptation while the FFVD900 package provides the ball density needed by complex designs. The -1 performance grade must still close system timing under the actual clock, voltage, and temperature conditions. Engineers should use AMD timing analysis and package-specific constraints during implementation, particularly where serial links, clocking, and high-speed memory interfaces share the same PCB.
推荐
Test and Measurement Instrumentation
The XCKU5P-1FFVD900I is suitable for modular test systems that combine acquisition, real-time processing, pattern generation, and control in one FPGA. Its 474,600 logic cells allow multiple parallel processing channels to share programmable resources, while the 900-ball FCBGA package supports the pin density expected from advanced instrumentation. A practical implementation uses dedicated clocking, carefully decoupled supply rails, and deterministic routing for high-speed inputs. The exact transceiver, I/O, and memory capabilities should be checked against the FFVD900 device tables before assigning interfaces or setting acquisition bandwidth.
推荐
Industrial Network and Control Equipment
For industrial networking and machine-control equipment, the XCKU5P-1FFVD900I combines high programmable logic capacity with an industrial temperature grade of -40°C to +100°C. The 474,600 logic cells can support protocol stacks, packet processing, motion-control datapaths, and supervisory logic without relying on several fixed-function processors. The dense FCBGA footprint makes multilayer PCB design and power delivery important. Layout should separate high-speed and sensitive routes, preserve continuous ground references, and use the manufacturer-defined pin and decoupling guidance. Industrial suitability still requires enclosure-level thermal and EMC validation.
推荐
Video and Image Processing
The XCKU5P-1FFVD900I can implement parallel video pipelines, image enhancement, pixel-format conversion, and real-time analytics because its 474,600 logic cells and 27,120 CLBs provide substantial parallelism. The FFVD900 package is appropriate for designs requiring numerous I/O and high-speed connections to external memory or image sensors. Engineers should constrain interfaces according to selected bank voltage, match external memory timing to the implemented clocking architecture, and verify pin placement through Vivado. The -1 grade is appropriate only when the complete design meets timing at worst-case voltage and temperature conditions.
推荐
Data Storage and Signal Processing
The XCKU5P-1FFVD900I is appropriate for accelerators that process structured or unstructured data in parallel, including filtering, correlation, compression, and storage-interface bridging. Its large programmable logic fabric permits functions to be customized without changing the PCB, while the 900-ball FCBGA package accommodates the high pin count required by wide memory and interface buses. Practical designs should use vendor-supported memory interfaces, constrain block RAM and transceiver resources, and include timing margins for industrial temperature operation. Power and thermal analysis should use actual utilization because dynamic power depends strongly on the selected clock, routing, and logic activity.
推荐
Aerospace and Defense Prototyping
The XCKU5P-1FFVD900I can support reconfigurable signal-processing, control, and communication prototypes that benefit from substantial programmable logic. The device provides 474,600 logic cells in a 20 nm Kintex UltraScale+ implementation and is specified for an industrial temperature range of -40°C to +100°C. For aerospace, defense, or other high-reliability programs, qualification status, radiation performance, controlled sourcing, and exact environmental requirements must be assessed separately; the industrial suffix alone does not establish every program-specific requirement. Secure configuration, traceability, and verified assembly practices should be incorporated early in the program.
推荐
推荐产品汇总
工程参考数据： XCKU5P-1FFVD900I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCKU5P-L1FFVD900I | XCKU5P-2FFVD900I | XCKU5P-1FFVD900E | XCKU5P-2FFVD900E |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 900-ball FCBGA (FFVD900) | 900-ball FCBGA (FFVD900) | 900-ball FCBGA (FFVD900) | 900-ball FCBGA (FFVD900) | 900-ball FCBGA (FFVD900) |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Performance Grade | -1 | L1 | -2 | -1 | -2 |
| Temperature Designation | I (industrial) | I (industrial) | I (industrial) | E | E |
关键差异点
- Combines high logic capacity with a 900-ball package （对比 XCKU5P-L1FFVD900I)
- Provides a direct same-package path to a higher timing grade （对比 XCKU5P-2FFVD900I)
- Matches the industrial-temperature ordering option （对比 XCKU5P-1FFVD900E)
设计说明
Use the FFVD900-specific ball map and escape-routing geometry rather than a generic 900-ball BGA footprint. Confirm every supply, ground, I/O, configuration, and auxiliary connection against AMD's package files before releasing the layout. Preserve uninterrupted reference planes beneath the device, minimize loop area between supply and ground vias, and plan escape routes according to the assigned I/O bank and voltage requirements.
Design the complete power tree from the manufacturer's FFVD900 power-rail definitions and voltage requirements. The device is identified as using a 0.72 V core, but that value does not describe every external rail. Follow the documented sequencing, ramp, decoupling, and monitoring requirements. Estimate each rail's worst-case current from actual design utilization rather than relying on device headline capacity, then validate startup, shutdown, and power-supply tolerance in simulation and bench tests.
The 900-ball FCBGA depends on the PCB and enclosure for heat removal. Model the FPGA, power regulators, memory, and nearby components as a thermal system, including copper planes, thermal vias, airflow, and adjacent heat sources. Check worst-case activity at the -1 grade and the highest specified ambient temperature. If the computed junction temperature approaches its limit, reduce utilization or clocks, improve the thermal path, or improve enclosure airflow before reducing safety margins.
Assign high-speed interfaces and clock networks with attention to bank voltage, return paths, and the package's pin topology. Use the timing report generated by the FPGA design tools as the final authority for routing performance; package migration data may change pin-to-pin timing. Keep sensitive clocks away from high-energy switching nodes, provide continuous return paths, and validate the completed board with appropriate signal-integrity measurements rather than relying only on simulations.
合规信息
The device is identified as an industrial-temperature Kintex UltraScale+ FPGA, but no specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declaration appears in the cited product results. Confirm compliance with the applicable AMD product declaration or quality document before procurement.
