XCZU9CG-L2FFVB1156E - Zynq UltraScale+ MPSoC CG, 599K+ Logic Cells | AMD
料号： XCZU9CG-L2FFVB1156E ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2625 | $26,250.00 |
| 25 | $2450 | $61,250.00 |
| 100 | $2280 | $228,000.00 |
| 500 | $2100 | $1,050,000.00 |
XCZU9CG-L2FFVB1156E 概述
A Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) is a class of adaptive SoC devices that tightly couples an FPGA fabric with multi-core ARM CPUs, GPU, and real-time controllers on a single die. Within AMD's portfolio, Zynq UltraScale+ devices sit at the top of the MPSoC hierarchy under the Adaptive Compute Acceleration Platform (ACAP) family, preceding Versal devices; the CG sub-family omits the Mali GPU and Video Codec Unit to reduce silicon cost while retaining the A53 + R5 + FPGA triad - a popular middle-ground for compute-intensive embedded designs that do not require on-chip graphics.
Key features of the XCZU9CG-L2FFVB1156E include up to 599K logic cells, an extensive DDR4/LPDDR4 memory controller subsystem, integrated Programmable Logic (PL) hardening blocks (DSP48E2, UltraRAM, BRAM), and rich connectivity with high-speed transceivers (GTH), PCIe Gen2/3, SATA, DisplayPort, and USB 3.0 controllers. The device is built on TSMC's 16nm FinFET process and supports MultiBoot, partial reconfiguration, and platform management via PMU + CSU. The 1156-ball FCBGA package offers a 35x35 mm body compatible with the ZU7CG / ZU9EG / ZU15EG stack, enabling footprint-scalable design.
The architecture integrates high-speed serial interfaces directly into the PL through GTH transceivers supporting up to 16.3 Gb/s line rates. Security features include ARM TrustZone, secure boot, hardware root of trust, and AES/SHA acceleration engines. The embedded programmers' view exposes four ARM cores through separate SMP/AMP clusters, allowing Linux-and-RTOS concurrent operation with deterministic real-time response.
Typical applications include industrial machine vision, 5G baseband preprocessing, ADAS sensor fusion, medical imaging, and military/aerospace signal processing. The CG sub-family cost-down makes the device attractive when the Mali GPU is not needed but ARM Cortex-A53 + FPGA horsepower is still required. Designers also use the ZU9CG in IoT edge gateways, software-defined radio front-ends, and broadcast video processing at 4K/8K resolutions.
When designing with the XCZU9CG-L2FFVB1156E, ensure that the selected reference design accommodates the FCBGA-1156 footprint thermal requirements - the package does not expose a thermal pad in the conventional sense but requires 4-8 stacked PCB layers with microvia stitching for signal and ground integrity. Power sequencing of MIO banks and PS/PL voltage rails must follow UG1085 / UG1087 (Zynq UltraScale+ PCB Design Guide); designers usually employ a UCD90120A or equivalent sequencer. The device must be paired with an AMD-supported JTAG programmer (Xilinx Platform Cable USB II or SmartLynq+).
This page synthesizes distributor availability, drop-in same-family and same-package alternatives, and practical design notes not consolidated into a single document on the AMD datasheet site.
直接替换替代料： XCZU9CG-L2FFVB1156E ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
XCZU7CG-L1FFVB1156E
✅ 直接替换📋 参考替代料（不在目录中）
XCZU15EG-L2FFVB1156E
✅ 直接替换📋 参考替代料（不在目录中）
XCZU9CG-2FFVB1156E
✅ 直接替换📋 参考替代料（不在目录中）
XCZU9CG-1FFVB1156I
✅ 直接替换📋 参考替代料（不在目录中）
XCZU9CG-L2FFVC1156E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCZU9CG-L2FFVB1156E 最大额定值与电气特性
| Family | Zynq UltraScale+ MPSoC |
| Sub-family | CG (Cost-Optimized, GPU-removed) |
| Application Processor Cores | Dual-core ARM Cortex-A53 MPCore with CoreSight |
| Real-time Processor Cores | Dual-core ARM Cortex-R5 with CoreSight |
| GPU | Not integrated (CG variant) |
| FPGA Logic Cells | 599K+ UltraScale+ logic cells |
| Speed Grade | -2 (extended) |
| Temperature Grade | E (extended, -40C to +100C) |
| 封装 | 1156-ball FCBGA (35x35 mm) |
| 安装类型 | Surface Mount (BGA) |
| Process Node | TSMC 16nm FinFET |
| Memory Controllers | DDR4 / LPDDR4 (PS-side) |
| High-Speed Transceivers | GTH up to 16.3 Gb/s |
| PCIe Support | PCIe Gen2/3 |
| RoHS 状态 | Compliant |
XCZU9CG-L2FFVB1156E 1156-ball fcbga (35x35 mm) 引脚配置指南
XCZU9CG-L2FFVB1156E（1156-ball fcbga (35x35 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XCZU9CG-L2FFVB1156E.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XCZU9CG-L2FFVB1156E 适用于 6 应用s: Industrial Machine Vision & Robotics, 5G Remote Radio Head Baseband Preprocessor, Automotive ADAS Front Camera Domain Controller, Medical Imaging MRI/CT Reconstruction Accelerator, Software Defined Radio (SDR) Front-End, Pro A/V Broadcast Video Processing (4K/8K).
Industrial Machine Vision & Robotics
The XCZU9CG-L2FFVB1156E's 599K+ logic cells and dual ARM Cortex-A53 cores make it well-suited for multi-camera machine vision inspection systems running convolutional neural networks at the edge. Designers pair the device with MIPI CSI-2 image sensor pipes through the PL fabric and frame the inference pipeline into the ARM A53 side, achieving sub-50ms latency on 1080p streams. Compared with pure GPU SoCs, the ZU9CG delivers deterministic response via the Cortex-R5 isolated cluster for safety-critical E-stop paths while keeping PS-side Linux running the vision pipeline.
推荐
5G Remote Radio Head Baseband Preprocessor
The -2 speed grade of the XCZU9CG-L2FFVB1156E supports the GTH transceiver line rates required for CPRI/eCPRI fronthaul at 9.83-16.3 Gb/s, while the FPGA fabric executes FFT/iFFT processing with DSP48E2 slices. The dual Cortex-R5 cores handle Layer-1 real-time control with deterministic latency, and the Cortex-A53 side runs a Linux-based Layer-2/3 stack. Thermal headroom on the 35x35 mm FCBGA allows sealing the device in an IP65 RRH enclosure at 70C ambient without active cooling.
推荐
Automotive ADAS Front Camera Domain Controller
Although the XCZU9CG-L2FFVB1156E is not AEC-Q100 qualified, the E temperature grade (-40C to +100C) and Fmax of the -2 speed grade allow prototype ADAS development with ISO 26262 readiness on the Cortex-R5 lockstep path. The PL fabric handles multi-object detection using CNN accelerators while ARM A53 runs the AUTOSAR application stack. Drops into a developer board as a stand-in for AEC-Q100 successors in non-safety-critical ADAS work flows such as development and lab validation only.
推荐
Medical Imaging MRI/CT Reconstruction Accelerator
The XCZU9CG-L2FFVB1156E's UltraRAM and block RAM capacity supports ping-pong buffers for tomographic reconstruction at 1024x1024x512 voxels. The Cortex-A53 MPCore runs the patient-interface software stack while FPGA fabric executes back-projection kernels with DSP48E2 slices at sub-second reconstruction times. Compared with GPU accelerators, the ZU9CG offers lower power per inference and deterministic interrupt response - critical for CT gantry synchronization. The E temperature grade covers the thermal envelope of MRI control rooms without throttling.
推荐
Software Defined Radio (SDR) Front-End
The XCZU9CG-L2FFVB1156E's GTH transceivers and DSP count enable wideband SDR implementations up to 2 GHz instantaneous bandwidth. The PL fabric implements channelization and digital down-conversion while ARM A53 runs GNU Radio / REDHAWK SDR frameworks. The Cortex-R5 cores handle low-latency AGC loops and trigger synchronization. Compared with pure FPGA implementations, the ZU9CG saves board space by integrating the host processor, eliminating the need for a companion ARM module.
推荐
Pro A/V Broadcast Video Processing (4K/8K)
The XCZU9CG-L2FFVB1156E's CG sub-family trades the Mali GPU and VCU for 599K+ logic cells, ideal for broadcast pipelines that need on-screen-display composition, color-space conversion, and frame-rate conversion in PL without on-chip GPU acceleration. The E temperature grade handles 24/7 broadcast rack operating temperatures. The -2 speed grade supports 4K60 processing at 12G-SDI rates when paired with onboard SDI transceivers, making it a cost-effective production mixer for outside-broadcast vans.
推荐
推荐产品汇总
工程参考数据： XCZU9CG-L2FFVB1156E ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCZU7CG-L1FFVB1156E | XCZU15EG-L2FFVB1156E | XCZU9CG-2FFVB1156E | XCZU9CG-1FFVB1156I | XCZU9CG-L2FFVC1156E |
|---|---|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | AMD | AMD | AMD |
| Package | 1156-ball FCBGA (35x35 mm) | 1156-ball FCBGA (35x35 mm) - same | 1156-ball FCBGA (35x35 mm) - same | 1156-ball FCBGA (35x35 mm) - same | 1156-ball FCBGA (35x35 mm) - same | 1156-ball FCBGA (35x35 mm) - same |
| Logic Cells | 599K+ | 504K (-15%) | 1143K (+91%) | 599K+ (identical) | 599K+ (identical) | 599K+ (identical) |
| Speed Grade | -2 (extended) | -1 (default) | -2 (extended) | -2 (extended) | -1 (default) | -2 (extended) |
| Sub-family | CG (cost-optimized, no GPU) | CG (cost-optimized, no GPU) | EG (with GPU + VCU) | CG (cost-optimized, no GPU) | CG (cost-optimized, no GPU) | CG (cost-optimized, no GPU) |
| Application Processor | Dual ARM Cortex-A53 | Dual ARM Cortex-A53 | Quad ARM Cortex-A53 | Dual ARM Cortex-A53 | Dual ARM Cortex-A53 | Dual ARM Cortex-A53 |
| Price Tier (qty-1, indicative) | $2,850 | $1,950 (lower) | $5,800 (higher) | $2,650 (similar) | $2,300 (lower) | $3,000 (slightly higher) |
关键差异点
- Cost-optimized CG sub-family removes unneeded GPU and VCU （对比 XCZU9EG-2FFVB1156E)
- Same package footprint as ZU7CG and ZU15EG families （对比 XCZU7CG-L1FFVB1156E)
- -2 speed grade extends Fmax envelope （对比 XCZU9CG-1FFVB1156I)
设计说明
The 1156-ball FCBGA package requires 4-8 stacked PCB layers with microvia stitching for ground/thermal conductivity. Estimated: at 0.5W/cm^2 uniform dissipation across the 35x35 mm body, a 6-layer board with 2 oz copper pours achieves theta_JA of approximately 8 C/W, allowing total package dissipation of ~5W at ambient 70C without active cooling. For higher dissipations (10-15W typical in industrial ADAS or SDR applications), add a heatsink or forced-air cooling.
Place decoupling capacitors within 2 mm of each power pin - especially the PS-side core rail (VCCINT_PS), PL-side core rail (VCCINT), and high-speed transceiver (MGTAVTT) rails. Use 0402-size 100nF X7R for high-frequency bypass, plus bulk 10uF and 47uF tantalum/ceramic capacitors. Follow the AMD Zynq UltraScale+ PCB Design Guide (UG1085) for impedance-controlled MIO/HR/HP routes.
MIO bank and PS/PL voltage rails require staggered power-up sequencing. Use AMD's official design reference UCD90120A or compatible sequencer to ensure PS_POR_B release timing matches required delays (~100 ms between VCCINT_PS and PS_MIO0/1/2). Failure to follow the sequence can cause JTAG non-recognition or PL configuration corruption.
MGT (GTH) transceiver channels require loss budget analysis at 16.3 Gb/s. Use IBIS-AMI simulations with channel s-parameter extraction; AMD recommends 5mm max trace length through raw PCB stack for backplane applications. Keep GTH reference clock lines (MGTRREF) away from switching rails - add ground-stitched guardrails to avoid spurious switching.
合规信息
Per AMD product page, the XCZU9CG family is RoHS-compliant. Not AEC-Q100 qualified - this part targets industrial embedded / prototyping applications, not automotive safety-critical deployments. For automotive-grade Zynq UltraScale+ MPSoC, look for the XAZU7EG-1FFVB1156Q or similar -Q variants.
