10AX090U4F45E3LG vs 10AX090U3F45E2LG مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 10AX090U4F45E3LG بواسطة Intel و 10AX090U3F45E2LG بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | 10AX090U4F45E3LG | 10AX090U3F45E2LG |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Manufacturer | Altera | — |
| Current Brand | Intel | — |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria 10 GX | — |
| Logic Elements | 900000 | — |
| User I/O | 480 | — |
| Embedded Memory | 59234304 bit | — |
| العلبة | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA |
| Terminal Count | 1932 | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Maximum Transceiver Data Rate | [DATA_NEEDED: maximum transceiver data rate] | [DATA_NEEDED: exact Gbps] |
| DSP Block Count | [DATA_NEEDED: DSP block count] | — |
| Temperature Grade | [DATA_NEEDED: temperature grade] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Speed Grade | [DATA_NEEDED: speed grade] | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Series | — | Arria 10 GX |
| Logic Elements (LE) | — | 900,000 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory Bits | — | 59,234,304 bits |
| Number of Transceivers | — | 48 transceiver macro channels (480 I/O references) |
| Hard Memory Controllers | — | Yes - DDR4, DDR3, QDR IV, RLDRAM 3 with hardened PHY |
| Hard PCIe Controllers | — | PCIe Gen3 x8 |
| Hard Ethernet MACs | — | 10GbE and 100GbE MACs |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of I/O Banks | — | [DATA_NEEDED: bank count] |
| Maximum User I/O Pins | — | 480 (per DigiKey listing) |
| Package Pin Pitch | — | [DATA_NEEDED: pitch] |
| Operating Temperature Grade | — | OTHER / Extended (per Partstack listing) |
| Process Technology | — | 20nm TSMC |
| Configuration Method | — | Serial (active/passive) and parallel via Quartus Prime |
| Development Tool | — | Intel Quartus Prime |