10M40DCF256C8G vs 10M40DAF256C7G مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 10M40DCF256C8G بواسطة Intel و 10M40DAF256C7G بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | 10M40DCF256C8G | 10M40DAF256C7G |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | — |
| نوع الذاكرة | Embedded SRAM (block RAM) | — |
| Number of I/O | 178 (MAX) | — |
| Number of Logic Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| On-die Flash | Yes (non-volatile configuration) | — |
| Integrated ADC | Yes (MAX 10 family feature) | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | — |
| Supply Voltage Range | [DATA_NEEDED: VCCINT/VCCIO range] | — |
| Speed Grade | -8 (fastest commercial) | — |
| درجة حرارة التشغيل | 0 °C to 85 °C (TJ, commercial, C-suffix) | — |
| العلبة | 256-FBGA (F256, 17 mm × 17 mm) | — |
| نوع التركيب | Surface Mount (BGA) | — |
| Terminal Finish | Lead-free / Pb-free (G suffix, RoHS) | — |
| مستوى MSL | [DATA_NEEDED: MSL level] | — |
| حالة RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | On-die flash (instant-on) | — |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| AEC-Q100 | Not qualified (use I-suffix variants for industrial) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Non-volatile FPGA | — | Yes |
| Number of Logic Elements | — | 40000 |
| Total RAM Bits | — | 1290240 bits |
| Embedded Memory | — | 1.23 Mbit |
| Number of User I/Os | — | 178 |
| Core Supply Voltage | — | 1.2 V |
| Minimum Operating Temperature | — | 0C |
| Maximum Operating Temperature | — | +85C |
| العلبة / الحالة | — | FBGA-256 (256-LBGA) |
| Package Body Size | — | 17 mm x 17 mm |
| Package Pitch | — | 1 mm |
| نمط التركيب | — | SMD/SMT |
| Packaging Type | — | Tray |
| Device Option Code | — | DAF256C7G |
| ADC Input Count | — | [DATA_NEEDED: Number of analog-to-digital converter inputs] |
| Supported I/O Standards | — | [DATA_NEEDED: Supported I/O standards] |
| Configuration Modes | — | [DATA_NEEDED: Configuration modes supported] |