10M40DCF256C8G vs 10M40DAF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M40DCF256C8G disebabkan oleh Intel dan 10M40DAF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M40DCF256C8G | 10M40DAF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | — |
| Jenis Ingatan | Embedded SRAM (block RAM) | — |
| Number of I/O | 178 (MAX) | — |
| Number of Logic Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| On-die Flash | Yes (non-volatile configuration) | — |
| Integrated ADC | Yes (MAX 10 family feature) | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | — |
| Supply Voltage Range | [DATA_NEEDED: VCCINT/VCCIO range] | — |
| Speed Grade | -8 (fastest commercial) | — |
| Suhu Operasi | 0 °C to 85 °C (TJ, commercial, C-suffix) | — |
| Kemasan | 256-FBGA (F256, 17 mm × 17 mm) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Terminal Finish | Lead-free / Pb-free (G suffix, RoHS) | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | On-die flash (instant-on) | — |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| AEC-Q100 | Not qualified (use I-suffix variants for industrial) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Non-volatile FPGA | — | Yes |
| Number of Logic Elements | — | 40000 |
| Total RAM Bits | — | 1290240 bits |
| Embedded Memory | — | 1.23 Mbit |
| Number of User I/Os | — | 178 |
| Core Supply Voltage | — | 1.2 V |
| Minimum Operating Temperature | — | 0C |
| Maximum Operating Temperature | — | +85C |
| Kemasan / Case | — | FBGA-256 (256-LBGA) |
| Package Body Size | — | 17 mm x 17 mm |
| Package Pitch | — | 1 mm |
| Gaya Pemasangan | — | SMD/SMT |
| Packaging Type | — | Tray |
| Device Option Code | — | DAF256C7G |
| ADC Input Count | — | [DATA_NEEDED: Number of analog-to-digital converter inputs] |
| Supported I/O Standards | — | [DATA_NEEDED: Supported I/O standards] |
| Configuration Modes | — | [DATA_NEEDED: Configuration modes supported] |