10M40DCF256C8G vs 10M40DAF256C7G Perbandingan
Perbandingan bersamaan detil 10M40DCF256C8G dari Intel dan 10M40DAF256C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M40DCF256C8G | 10M40DAF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | — |
| Tipe Memori | Embedded SRAM (block RAM) | — |
| Number of I/O | 178 (MAX) | — |
| Number of Logic Blocks / LABs | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| On-die Flash | Yes (non-volatile configuration) | — |
| Integrated ADC | Yes (MAX 10 family feature) | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | — |
| Supply Voltage Range | [DATA_NEEDED: VCCINT/VCCIO range] | — |
| Speed Grade | -8 (fastest commercial) | — |
| Suhu Kerja | 0 °C to 85 °C (TJ, commercial, C-suffix) | — |
| Paket | 256-FBGA (F256, 17 mm × 17 mm) | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Terminal Finish | Lead-free / Pb-free (G suffix, RoHS) | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | On-die flash (instant-on) | — |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| AEC-Q100 | Not qualified (use I-suffix variants for industrial) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Non-volatile FPGA | — | Yes |
| Number of Logic Elements | — | 40000 |
| Total RAM Bits | — | 1290240 bits |
| Embedded Memory | — | 1.23 Mbit |
| Number of User I/Os | — | 178 |
| Core Supply Voltage | — | 1.2 V |
| Minimum Operating Temperature | — | 0C |
| Maximum Operating Temperature | — | +85C |
| Paket / Case | — | FBGA-256 (256-LBGA) |
| Package Body Size | — | 17 mm x 17 mm |
| Package Pitch | — | 1 mm |
| Gaya Mounting | — | SMD/SMT |
| Packaging Type | — | Tray |
| Device Option Code | — | DAF256C7G |
| ADC Input Count | — | [DATA_NEEDED: Number of analog-to-digital converter inputs] |
| Supported I/O Standards | — | [DATA_NEEDED: Supported I/O standards] |
| Configuration Modes | — | [DATA_NEEDED: Configuration modes supported] |