A3P600-2FGG484I vs A3P600-FGG484 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-2FGG484I بواسطة Microchip Technology و A3P600-FGG484 بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600-2FGG484I | A3P600-FGG484 |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | 600K |
| User I/O | 235 | — |
| On-chip Resource Bits | 110592 | — |
| Speed Grade | -2 (25% faster than standard) | — |
| العلبة | 484-BGA (FGG484) | 484-Pin FBGA (FGG484) |
| نوع التركيب | Surface Mount | Surface Mount |
| Configuration Memory | Flash (non-volatile, single-chip) | Flash-based (non-volatile, single chip) |
| درجة حرارة التشغيل | -40C to +100C (industrial, I suffix) | — |
| I/O Banks | 4 (dedicated VCCIBx per bank) | — |
| Reprogrammability | Yes, in-system | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Lead Free | Yes (per PCB Electronics: LEAD FREE) | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | Lead Free |
| مستوى MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Architecture | CMOS flash-based FPGA sea-of-gates | — |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm CMOS |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |