A3P600-FGG484 vs A3P600-2FGG484I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-FGG484 بواسطة Microchip Technology و A3P600-2FGG484I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600-FGG484 | A3P600-2FGG484I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600000 |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 235 | — |
| العلبة | 484-Pin FBGA (FGG484) | 484-BGA (FGG484) |
| نوع التركيب | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | Flash (non-volatile, single-chip) |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| حالة RoHS | Lead Free | [DATA_NEEDED: RoHS status] |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| User I/O | — | 235 |
| On-chip Resource Bits | — | 110592 |
| Speed Grade | — | -2 (25% faster than standard) |
| درجة حرارة التشغيل | — | -40C to +100C (industrial, I suffix) |
| I/O Banks | — | 4 (dedicated VCCIBx per bank) |
| Reprogrammability | — | Yes, in-system |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Lead Free | — | Yes (per PCB Electronics: LEAD FREE) |
| مستوى MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Architecture | — | CMOS flash-based FPGA sea-of-gates |