A3P600-FGG484 vs A3P600-2FGG484I तुलना
विस्तृत दोनों ओर की तुलना A3P600-FGG484 द्वारा Microchip Technology और A3P600-2FGG484I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3P600-2FGG484I - ProASIC3 FPGA 600K 235 I/O | Microchip
A3P600-2FGG484I ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3P600-FGG484 | A3P600-2FGG484I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600000 |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 235 | — |
| पैकेज | 484-Pin FBGA (FGG484) | 484-BGA (FGG484) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | Flash (non-volatile, single-chip) |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| RoHS स्थिति | Lead Free | [DATA_NEEDED: RoHS status] |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| User I/O | — | 235 |
| On-chip Resource Bits | — | 110592 |
| Speed Grade | — | -2 (25% faster than standard) |
| ऑपरेटिंग तापमान | — | -40C to +100C (industrial, I suffix) |
| I/O Banks | — | 4 (dedicated VCCIBx per bank) |
| Reprogrammability | — | Yes, in-system |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Lead Free | — | Yes (per PCB Electronics: LEAD FREE) |
| MSL स्तर | — | [DATA_NEEDED: moisture sensitivity level] |
| Architecture | — | CMOS flash-based FPGA sea-of-gates |