A3P600-FGG484 vs A3P600-2FGG484I 比較
詳細並排比較 A3P600-FGG484 由 Microchip Technology 與 A3P600-2FGG484I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | A3P600-FGG484 | A3P600-2FGG484I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600000 |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 235 | — |
| 封裝 | 484-Pin FBGA (FGG484) | 484-BGA (FGG484) |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | Flash (non-volatile, single-chip) |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| RoHS 狀態 | Lead Free | [DATA_NEEDED: RoHS status] |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| User I/O | — | 235 |
| On-chip Resource Bits | — | 110592 |
| Speed Grade | — | -2 (25% faster than standard) |
| 工作溫度 | — | -40C to +100C (industrial, I suffix) |
| I/O Banks | — | 4 (dedicated VCCIBx per bank) |
| Reprogrammability | — | Yes, in-system |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| Lead Free | — | Yes (per PCB Electronics: LEAD FREE) |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |
| Architecture | — | CMOS flash-based FPGA sea-of-gates |