EP2AGZ350HF40C3N vs EP2AGZ350HF40C3G مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2AGZ350HF40C3N بواسطة Intel و EP2AGZ350HF40C3G بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Intel
EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G ✓ نشطمقارنة المواصفات
| المعامل | EP2AGZ350HF40C3N | EP2AGZ350HF40C3G |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count and 18x18 multiplier count] |
| Transceivers | Up to 24 (per family datasheet) | Up to 6.375 Gbps (channel count [DATA_NEEDED]) |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| العلبة | 1517-ball FCBGA (HF40) | 1517-ball FineLine BGA (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| نوع التركيب | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LEs) | — | 350,000 |
| Embedded Memory | — | [DATA_NEEDED: total embedded memory bits] |
| User I/O Pins | — | 734 |
| Package Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C3 (commercial, -3) |
| درجة حرارة التشغيل | — | Commercial (0C to 85C, suffix 0C) |
| External Memory Interfaces | — | DDR3, DDR2, QDR II+ (up to 800 MHz) |
| PCI Express Hard Blocks | — | Yes (Gen1/Gen2) |
| حالة RoHS | — | Compliant |
| Lead-Free | — | Yes |
| مستوى MSL | — | [DATA_NEEDED: MSL rating] |