EP2AGZ350HF40C3N vs EP2AGZ350HF40C3G तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ350HF40C3N द्वारा Intel और EP2AGZ350HF40C3G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G ✓ सक्रियविशेषता तुलना
| पैरामीटर | EP2AGZ350HF40C3N | EP2AGZ350HF40C3G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count and 18x18 multiplier count] |
| Transceivers | Up to 24 (per family datasheet) | Up to 6.375 Gbps (channel count [DATA_NEEDED]) |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| पैकेज | 1517-ball FCBGA (HF40) | 1517-ball FineLine BGA (HF40) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LEs) | — | 350,000 |
| Embedded Memory | — | [DATA_NEEDED: total embedded memory bits] |
| User I/O Pins | — | 734 |
| Package Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C3 (commercial, -3) |
| ऑपरेटिंग तापमान | — | Commercial (0C to 85C, suffix 0C) |
| External Memory Interfaces | — | DDR3, DDR2, QDR II+ (up to 800 MHz) |
| PCI Express Hard Blocks | — | Yes (Gen1/Gen2) |
| RoHS स्थिति | — | Compliant |
| Lead-Free | — | Yes |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |