EP2AGZ350HF40C3N vs EP2AGZ350HF40C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C3N sa pamamagitan ng Intel at EP2AGZ350HF40C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ350HF40C3N EP2AGZ350HF40C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Logic Elements 348,500 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Logic Array Blocks (LABs) 13,940 —
Embedded Memory Bits 21,270,528 —
Embedded Memory Blocks (M9K) [DATA_NEEDED: M9K count] —
User I/Os 734 —
DSP Blocks [DATA_NEEDED: DSP block count] [DATA_NEEDED: DSP block count and 18x18 multiplier count]
Transceivers Up to 24 (per family datasheet) Up to 6.375 Gbps (channel count [DATA_NEEDED])
Transceiver Data Rate Up to 6.553 Gbps —
Core Voltage 0.9 V —
Process Technology 40 nm low-power —
Packhaging 1517-ball FCBGA (HF40) 1517-ball FineLine BGA (HF40)
Operating Temperature Grade Commercial (C3) —
Configuration Mode FPP / AS / JTAG —
Uri ng Pagpapasok Surface Mount (flip-chip BGA) Surface Mount (BGA)
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 350,000
Embedded Memory — [DATA_NEEDED: total embedded memory bits]
User I/O Pins — 734
Package Pitch — 1.0 mm
Process Node — 40 nm
Speed Grade — C3 (commercial, -3)
Temperature na Operasyon — Commercial (0C to 85C, suffix 0C)
External Memory Interfaces — DDR3, DDR2, QDR II+ (up to 800 MHz)
PCI Express Hard Blocks — Yes (Gen1/Gen2)
Tindminan RoHS — Compliant
Lead-Free — Yes
Level ng MSL — [DATA_NEEDED: MSL rating]

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