EP2SGX60CF780C3 vs EP2SGX60CF780C4 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2SGX60CF780C3 بواسطة Intel و EP2SGX60CF780C4 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2SGX60CF780C3 | EP2SGX60CF780C4 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | نشط |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Speed Grade | C3 (commercial) | C4 (commercial) |
| العلبة | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) |
| درجة حرارة التشغيل | Commercial (0C to +85C junction) | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| مستوى MSL | [DATA_NEEDED: MSL level] | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | Stratix II GX |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 3,022 |
| User I/O Count | — | 364 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Internal Operating Frequency | — | up to 732.1 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | Flip-Chip Fine-Pitch BGA |