EP2SGX60CF780C3 vs EP2SGX60CF780C4 Perbandingan
Perbandingan bersamaan detil EP2SGX60CF780C3 dari Intel dan EP2SGX60CF780C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX60CF780C3 | EP2SGX60CF780C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Speed Grade | C3 (commercial) | C4 (commercial) |
| Paket | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) |
| Suhu Kerja | Commercial (0C to +85C junction) | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | Stratix II GX |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 3,022 |
| User I/O Count | — | 364 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Internal Operating Frequency | — | up to 732.1 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | Flip-Chip Fine-Pitch BGA |