EP2SGX60CF780C3 vs EP2SGX60CF780C4 तुलना
विस्तृत दोनों ओर की तुलना EP2SGX60CF780C3 द्वारा Intel और EP2SGX60CF780C4 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2SGX60CF780C3 | EP2SGX60CF780C4 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | सक्रिय |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Speed Grade | C3 (commercial) | C4 (commercial) |
| पैकेज | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) |
| ऑपरेटिंग तापमान | Commercial (0C to +85C junction) | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| MSL स्तर | [DATA_NEEDED: MSL level] | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | Stratix II GX |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 3,022 |
| User I/O Count | — | 364 |
| Total Memory Bits | — | 2,544,192 |
| Number of Transceivers | — | [DATA_NEEDED: number of transceivers] |
| Internal Operating Frequency | — | up to 732.1 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | Flip-Chip Fine-Pitch BGA |