EP2SGX60CF780C4 vs EP2SGX60DF780C3 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2SGX60CF780C4 بواسطة Intel و EP2SGX60DF780C3 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2SGX60CF780C4 | EP2SGX60DF780C3 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | Obsolete |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | Up to 20 |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| العلبة | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Package Type | Flip-Chip Fine-Pitch BGA | — |
| Speed Grade | C4 (commercial) | C3 (fastest commercial) |
| درجة حرارة التشغيل | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| نوع التركيب | Surface Mount | Surface Mount |
| حالة RoHS | [DATA_NEEDED: RoHS compliance] | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Family | — | Stratix II GX |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 1.2 V |
| Internal Frequency (max) | — | ~717 MHz |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |