EP2SGX60CF780C4 vs EP2SGX60DF780C3 Perbandingan
Perbandingan bersamaan detil EP2SGX60CF780C4 dari Intel dan EP2SGX60DF780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX60CF780C4 | EP2SGX60DF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | Up to 20 |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Paket | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Package Type | Flip-Chip Fine-Pitch BGA | — |
| Speed Grade | C4 (commercial) | C3 (fastest commercial) |
| Suhu Kerja | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Family | — | Stratix II GX |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 1.2 V |
| Internal Frequency (max) | — | ~717 MHz |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |