EP2SGX60DF780C4 vs EP2SGX60CF780C5 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2SGX60DF780C4 بواسطة Intel و EP2SGX60CF780C5 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2SGX60DF780C4 | EP2SGX60CF780C5 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | Obsolete |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 | 2,544,192 bits |
| User I/O Count | 364 | — |
| Maximum Internal Frequency | 717 MHz | 717 MHz |
| Transceiver Channels | [DATA_NEEDED: exact transceiver count and data rate] | — |
| Number of CLBs | 60,440 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 4 (C4) | C5 (commercial) |
| نوع التركيب | Surface Mount | Surface Mount |
| حالة RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 3,022 |
| Maximum User I/Os | — | 364 |
| عدد الدبابيس | — | 780 |
| العلبة | — | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) |
| Core Voltage | — | 1.2 V |
| Propagation Delay | — | [DATA_NEEDED: propagation delay in ns] |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Up to 20 multi-gigabit transceivers |
| DSP Blocks | — | Yes (TriMatrix embedded multiplier blocks) |
| PLLs | — | 4 enhanced PLLs + 8 fast PLLs |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Memory Interfaces | — | DDR/DDR2 SDRAM controllers with source-synchronous PHY |
| Lead-Free | — | Yes |
| مستوى MSL | — | [DATA_NEEDED: MSL rating] |