EP2SGX60DF780C4 vs EP2SGX60CF780C5 तुलना
विस्तृत दोनों ओर की तुलना EP2SGX60DF780C4 द्वारा Intel और EP2SGX60CF780C5 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2SGX60DF780C4 | EP2SGX60CF780C5 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | Obsolete |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 | 2,544,192 bits |
| User I/O Count | 364 | — |
| Maximum Internal Frequency | 717 MHz | 717 MHz |
| Transceiver Channels | [DATA_NEEDED: exact transceiver count and data rate] | — |
| Number of CLBs | 60,440 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 4 (C4) | C5 (commercial) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 3,022 |
| Maximum User I/Os | — | 364 |
| पिन की संख्या | — | 780 |
| पैकेज | — | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) |
| Core Voltage | — | 1.2 V |
| Propagation Delay | — | [DATA_NEEDED: propagation delay in ns] |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Up to 20 multi-gigabit transceivers |
| DSP Blocks | — | Yes (TriMatrix embedded multiplier blocks) |
| PLLs | — | 4 enhanced PLLs + 8 fast PLLs |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Memory Interfaces | — | DDR/DDR2 SDRAM controllers with source-synchronous PHY |
| Lead-Free | — | Yes |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |