EP2SGX60DF780C4 vs EP2SGX60CF780C5 Perbandingan
Perbandingan bersamaan detil EP2SGX60DF780C4 dari Intel dan EP2SGX60CF780C5 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX60DF780C4 | EP2SGX60CF780C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 | 2,544,192 bits |
| User I/O Count | 364 | — |
| Maximum Internal Frequency | 717 MHz | 717 MHz |
| Transceiver Channels | [DATA_NEEDED: exact transceiver count and data rate] | — |
| Number of CLBs | 60,440 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 4 (C4) | C5 (commercial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 3,022 |
| Maximum User I/Os | — | 364 |
| Jumlah Pin | — | 780 |
| Paket | — | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) |
| Core Voltage | — | 1.2 V |
| Propagation Delay | — | [DATA_NEEDED: propagation delay in ns] |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Up to 20 multi-gigabit transceivers |
| DSP Blocks | — | Yes (TriMatrix embedded multiplier blocks) |
| PLLs | — | 4 enhanced PLLs + 8 fast PLLs |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Memory Interfaces | — | DDR/DDR2 SDRAM controllers with source-synchronous PHY |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: MSL rating] |