EP3SL50F484I4 vs EP3SE50F484I3N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3SL50F484I4 بواسطة Intel و EP3SE50F484I3N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3SL50F484I4 | EP3SE50F484I3N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Device Family | Stratix III L | — |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 bits | — |
| Maximum User I/O | 296 | 296 |
| Process Technology | 65 nm CMOS | 65 nm |
| Internal Frequency | 800 MHz (max, per digchip datasheet summary) | — |
| Core Supply Voltage | 1.1 V | — |
| العلبة | 484-ball FC-FBGA (FCBGA, 1.0 mm pitch) | 484-pin FC-FBGA (flip-chip BGA) |
| درجة حرارة التشغيل | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Grade Suffix | I4 = Industrial, speed grade 4 | — |
| Configuration Modes | JTAG, Passive Serial, FPP, PPA | — |
| MultiTrack Interconnect | Yes | — |
| TriMatrix Embedded Memory | MLAB, M9K, M144K blocks | — |
| نوع التركيب | Surface Mount (BGA) | Surface Mount (BGA) |
| مستوى MSL | 3 (168 hours) | — |
| حالة RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Family | — | Stratix III E |
| Logic Elements | — | 47,500 |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Speed Grade | — | I3 (industrial, bin 3) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |