M1AFS250-2FGG256 vs M1AFS250-1FGG256I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ M1AFS250-2FGG256 بواسطة Microchip Technology و M1AFS250-1FGG256I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
M1AFS250-2FGG256 - Fusion FPGA 250K Gates ARM M1 | Microchip
M1AFS250-2FGG256 ✓ نشطMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ نشطمقارنة المواصفات
| المعامل | M1AFS250-2FGG256 | M1AFS250-1FGG256I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Fusion (M1 series) Mixed-Signal FPGA | — |
| System Gates | 250000 gates | 250,000 gates |
| Registers (D-Flip-Flops) | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | Flash (in-system programmable, instant-on) | Nonvolatile flash (Live at Power-Up, LAPU) |
| Analog Features | Configurable analog block, voltage monitoring | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| العلبة | 256-LBGA (FGG256) | — |
| نوع التركيب | Surface Mount | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| Speed Grade | -2 | — |
| Total RAM | [DATA_NEEDED: embedded flash memory capacity] | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| مستوى MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| جهد التغذية التشغيلي | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| العلبة / الحالة | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| نمط التركيب | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |