MC9S08DN60ACLH vs MC9S08DN60AMLH مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08DN60ACLH بواسطة NXP Semiconductors و MC9S08DN60AMLH بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08DN60ACLH | MC9S08DN60AMLH |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | NRND |
| Core | HCS08 (S08 core) | — |
| عرض ناقل البيانات | 8 bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM Size | 2 KB (2K x 8) | — |
| EEPROM | Embedded (size [DATA_NEEDED: EEPROM size]) | — |
| Number of I/O | 53 | — |
| العلبة / الحالة | 64-LQFP (10x10 mm) | — |
| نوع التركيب | Surface Mount | Surface mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion | 10-bit |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C | — |
| Oscillator Type | External | — |
| Interrupt Sources | Up to 32 | — |
| درجة حرارة التشغيل | -40C to +85C [DATA_NEEDED: confirm automotive grade range] | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| حالة RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Instruction Set | HC08 + BGND instruction | HCS08 instruction set |
| On-Chip Debug | BDM (Background Debug Mode) | — |
| Product Type | — | 8-bit microcontroller |
| CPU Core | — | Enhanced HCS08 core |
| Maximum CPU Frequency | — | 40 MHz |
| System Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB |
| Flash Organization | — | 60K x 8 bits |
| RAM | — | 2 KB |
| Serial Interface | — | Multiple serial interfaces |
| LIN Capability | — | LIN master |
| LCD Support | — | LCD driver |
| العلبة | — | 64-LQFP, 10 x 10 mm |
| Embedded Emulation and Debug | — | Supported by HCS08 family documentation |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |