MC9S08DN60ACLH vs MC9S08DN60AMLH 比較

詳細並排比較 MC9S08DN60ACLH 由 NXP Semiconductors 與 MC9S08DN60AMLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd
NXP Semiconductors
MC9S08DN60AMLH MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH Nrnd

規格比較

參數 MC9S08DN60ACLH MC9S08DN60AMLH
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Core HCS08 (S08 core) —
資料匯流排寬度 8 bit —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 60 KB (60K x 8) —
RAM Size 2 KB (2K x 8) —
EEPROM Embedded (size [DATA_NEEDED: EEPROM size]) —
Number of I/O 53 —
封裝 / 外殼 64-LQFP (10x10 mm) —
安裝類型 Surface Mount Surface mount
ADC 16-channel, 12-bit, 2.5 us conversion 10-bit
Communication Interfaces CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C —
Oscillator Type External —
Interrupt Sources Up to 32 —
工作溫度 -40C to +85C [DATA_NEEDED: confirm automotive grade range] [DATA_NEEDED: operating temperature range]
Packaging Tray —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Instruction Set HC08 + BGND instruction HCS08 instruction set
On-Chip Debug BDM (Background Debug Mode) —
Product Type — 8-bit microcontroller
CPU Core — Enhanced HCS08 core
Maximum CPU Frequency — 40 MHz
System Bus Frequency — 20 MHz
Flash Memory — 60 KB
Flash Organization — 60K x 8 bits
RAM — 2 KB
Serial Interface — Multiple serial interfaces
LIN Capability — LIN master
LCD Support — LCD driver
封裝 — 64-LQFP, 10 x 10 mm
Embedded Emulation and Debug — Supported by HCS08 family documentation
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

資料表與資源

瀏覽所有產品 建立 BOM 索取報價