MD7IC2050NR1 vs MD7IC2050NBR1 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MD7IC2050NR1 بواسطة NXP Semiconductors و MD7IC2050NBR1 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP
MD7IC2050NBR1 ✓ نشطمقارنة المواصفات
| المعامل | MD7IC2050NR1 | MD7IC2050NBR1 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | RF Amplifiers | RF Amplifiers |
| حالة دورة الحياة | نشط | نشط |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MD7IC2050NR1 | — |
| Device Type | RF LDMOS Integrated Power Amplifier | — |
| RF Type / Modulation | W-CDMA / 3GPP | — |
| Frequency Range (datasheet typical) | 1.88 GHz to 2.1 GHz | — |
| Frequency Range (broadband match) | 1.75 GHz to 2.05 GHz | — |
| Output Power (Average, W-CDMA) | 10 W | — |
| Supply Voltage (Vdd) | 28 V | — |
| Supply Voltage Range | 26 V to 32 V | — |
| Quiescent Supply Current | 230 mA | — |
| Power Gain (Gp) | 30.5 dB at 2.14 GHz | — |
| Architecture | Two-stage, on-chip matched | Multi-stage RF LDMOS integrated power amplifier |
| Maximum Input Power (CW) | 28 dBm | — |
| العلبة / الحالة | TO-270-14 Variant, Flat Leads (TO-270 WB-14) | — |
| نوع التركيب | Surface Mount | Surface Mount (flanged lead) |
| Packaging | Tape & Reel | — |
| حالة RoHS | [DATA_NEEDED: current RoHS status] | — |
| RF Type | — | W-CDMA |
| Frequency Range | — | 1.88 GHz to 2.1 GHz |
| Operating Bandwidth (broader usability) | — | 1750 MHz to 2050 MHz |
| جهد التغذية | — | 28 V |
| Supply Current (quiescent) | — | 230 mA |
| Gain | — | 30.5 dB |
| Output Power (P3dB class, datasheet) | — | [DATA_NEEDED: P3dB output power] |
| Average Output Power (W-CDMA) | — | 10 W average |
| Input Matching | — | On-chip, 50 ohm, DC blocked |
| Output Matching | — | On-chip, >5 ohm nominal |
| Enable / Disable | — | Integrated (with quiescent current temperature compensation) |
| ESD Protection | — | Integrated |
| العلبة | — | TO-272 WB-14 (CASE 1618-02, plastic overmold) |
| Maximum Junction / Package Temperature | — | 225 C capable plastic |
| RoHS Compliance | — | Compliant (per manufacturer datasheet) |
| درجة حرارة التشغيل | — | [DATA_NEEDED: operating temperature range] |