MD7IC2050NR1 vs MD7IC2050NBR1 Perbandingan
Perbandingan bersamaan detil MD7IC2050NR1 dari NXP Semiconductors dan MD7IC2050NBR1 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP
MD7IC2050NBR1 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MD7IC2050NR1 | MD7IC2050NBR1 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | RF Amplifiers | RF Amplifiers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MD7IC2050NR1 | — |
| Device Type | RF LDMOS Integrated Power Amplifier | — |
| RF Type / Modulation | W-CDMA / 3GPP | — |
| Frequency Range (datasheet typical) | 1.88 GHz to 2.1 GHz | — |
| Frequency Range (broadband match) | 1.75 GHz to 2.05 GHz | — |
| Output Power (Average, W-CDMA) | 10 W | — |
| Supply Voltage (Vdd) | 28 V | — |
| Supply Voltage Range | 26 V to 32 V | — |
| Quiescent Supply Current | 230 mA | — |
| Power Gain (Gp) | 30.5 dB at 2.14 GHz | — |
| Architecture | Two-stage, on-chip matched | Multi-stage RF LDMOS integrated power amplifier |
| Maximum Input Power (CW) | 28 dBm | — |
| Paket / Case | TO-270-14 Variant, Flat Leads (TO-270 WB-14) | — |
| Tipe Mounting | Surface Mount | Surface Mount (flanged lead) |
| Packaging | Tape & Reel | — |
| Status RoHS | [DATA_NEEDED: current RoHS status] | — |
| RF Type | — | W-CDMA |
| Frequency Range | — | 1.88 GHz to 2.1 GHz |
| Operating Bandwidth (broader usability) | — | 1750 MHz to 2050 MHz |
| Tegangan Pemuat | — | 28 V |
| Supply Current (quiescent) | — | 230 mA |
| Gain | — | 30.5 dB |
| Output Power (P3dB class, datasheet) | — | [DATA_NEEDED: P3dB output power] |
| Average Output Power (W-CDMA) | — | 10 W average |
| Input Matching | — | On-chip, 50 ohm, DC blocked |
| Output Matching | — | On-chip, >5 ohm nominal |
| Enable / Disable | — | Integrated (with quiescent current temperature compensation) |
| ESD Protection | — | Integrated |
| Paket | — | TO-272 WB-14 (CASE 1618-02, plastic overmold) |
| Maximum Junction / Package Temperature | — | 225 C capable plastic |
| RoHS Compliance | — | Compliant (per manufacturer datasheet) |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |