MPC8245LZU300D vs MPC8245LZU266D مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPC8245LZU300D بواسطة NXP Semiconductors و MPC8245LZU266D بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MPC8245LZU300D - PowerQUICC II 300MHz Integrated Host Processor | NXP
MPC8245LZU300D Nrndمقارنة المواصفات
| المعامل | MPC8245LZU300D | MPC8245LZU266D |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | نشط |
| Processor Type | MPC82xx PowerQUICC II Integrated Host Processor | — |
| Core Architecture | PowerPC 603e (Power Architecture technology) | — |
| Core Frequency | 300 MHz | — |
| Performance | 570 MIPS | 505.4 MIPS |
| Core Supply Voltage | 1.8 V | — |
| Number of Cores | 1 | — |
| Bus Width | 32-bit | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Memory Controller | SDRAM, up to 2 GB, up to 133 MHz | — |
| PCI Interface | 32-bit, up to 66 MHz | 32-bit, 33/66 MHz |
| العلبة | 352-TBGA (35x35 mm) | 352-TBGA (35 mm x 35 mm) |
| درجة حرارة التشغيل | 0C to +105C | 0 C to +105 C (commercial) |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| Lead Status | Contains Lead | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: confirm per lot] |
| Packaging | Tray | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | MPC82xx |
| Part Status | — | Active |
| Core Processor | — | PowerPC 603e |
| Number of Cores / Bus Width | — | 1 Core / 32-bit |
| Speed (Clock Frequency) | — | 266 MHz |
| Co-Processor / DSP | — | None |
| RAM Controllers | — | SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED: display controller details] |
| Ethernet | — | [DATA_NEEDED: integrated Ethernet?] |
| Memory Controller Max Frequency | — | 133 MHz (SDRAM), up to 2 GB |
| Serial I/O | — | I2C, UART, I2O |
| جهد التغذية | — | 3.3 V (typ.) |
| Process Technology | — | 0.25 um CMOS |
| Tray Quantity | — | [DATA_NEEDED: tray qty per manufacturer packing] |
| Lead-Free Status | — | Lead-free (BGA balls, SnAgCu) |