XC7Z100-1FF900I vs XC7Z100-2FFG900I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ XC7Z100-1FF900I بواسطة AMD و XC7Z100-2FFG900I بواسطة AMD. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | XC7Z100-1FF900I | XC7Z100-2FFG900I |
|---|---|---|
| العلامة التجارية | AMD | AMD |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Product Type | Zynq-7000 system on chip | — |
| Processor Configuration | Dual Arm Cortex-A9 MPCore | — |
| Processor Operating Frequency | 667 MHz | — |
| FPGA Logic Cells | 444K logic cells | — |
| FPGA Architecture | Kintex-7 | — |
| Debug and Trace | CoreSight | — |
| Package Type | 900-FCBGA | — |
| Package Dimensions | 31 x 31 mm | — |
| Package Ball Count | 900 balls | — |
| Device Family | Zynq-7000 | Zynq-7000 All Programmable SoC |
| Architecture | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic | ARM Cortex-A9 dual-core MPCore + Kintex-7 FPGA |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Maximum I/O Count | [DATA_NEEDED: maximum I/O count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| حالة RoHS | RoHS | — |
| نوع التركيب | Surface mount | — |
| Manufacturer Qualification | [DATA_NEEDED: industrial or automotive qualification] | — |
| Logic Cells (PL) | — | 444K |
| Block RAM | — | 26.5 Mb |
| DSP Slices | — | 1540 (DSP48E1) |
| Processor Cores | — | 2x ARM Cortex-A9 MPCore with CoreSight |
| Max Processor Frequency | — | 800 MHz (up to 1 GHz with -3 speed grade) |
| Transceivers | — | 16x GTX up to 6.25 Gb/s |
| PCIe Hard Blocks | — | 4x Gen2 (Root Complex or Endpoint) |
| Memory Interfaces | — | DDR3, DDR3L, DDR2, LPDDR2 (16-bit and 32-bit; ECC on PS side) |
| Ethernet MACs | — | 2x 10/100/1000 Mbps GEM |
| USB | — | 2x USB 2.0 OTG |
| Security | — | AES, SHA-256, RSA, secure boot, JTAG disable |
| ADC | — | Dual 12-bit 1 MSPS XADC |
| درجة حرارة التشغيل | — | -40C to +100C (Industrial) |
| العلبة | — | 900-ball FCBGA (FFG) 31x31 mm |
| Speed Grade | — | -2 (mid-performance) |
| Temperature Grade | — | I (Industrial) |