Microchip Technology

A3P1000L-FG256 - ProASIC3L FPGA, 1M Gates | Microchip

MPN: A3P1000L-FG256 ✓ نشط
1.2 V to 1.5 V Vdss LVCMOS, LVTTL, LVDS, etc. Rds(on) 256-LBGA (17x17 mm, 1.0 mm pitch) Package 350 MHz Speed Yes Memory
الحد الأدنى للطلب: 1 |

A3P1000L-FG256 نظرة عامة

The Microchip Technology A3P1000L-FG256 is a low-power flash FPGA from the ProASIC3L family, offering 1 million system gates, 24,576 logic cells, and 177 user I/Os in a 256-ball FBGA package. It operates with a core voltage of 1.2V to 1.5V and supports clock frequencies up to 350 MHz, making it suitable for a wide range of low-power, high-reliability applications.

A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs consist of programmable logic blocks, interconnects, and I/O blocks, allowing designers to create complex digital systems without the cost and lead time of ASICs. The ProASIC3L family is based on nonvolatile flash technology, providing instant-on operation, security, and low power consumption.

Key features of the A3P1000L-FG256 include Flash*Freeze technology for ultra-low static power, 1.2V to 1.5V core voltage, and support for up to 350 MHz system performance. It offers 177 user I/Os, 24,576 logic cells, and 1 million system gates. The device is reprogrammable, enabling design updates and field upgrades. Its low power consumption makes it ideal for battery-powered and thermally constrained applications.

The ProASIC3L architecture uses a flash-based switch fabric, eliminating the need for external configuration memory and providing instant-on capability. This nonvolatile technology also offers enhanced security against reverse engineering and bitstream interception. The device supports multiple I/O standards, including LVCMOS, LVTTL, and differential standards, providing flexibility in system integration.

Typical applications include industrial control systems, cloud computing infrastructure, and consumer electronics. In industrial control, the FPGA's low power and high reliability are critical for 24/7 operation. In cloud computing, it can be used for protocol bridging and acceleration. In consumer electronics, its reprogrammability allows for firmware updates and feature enhancements.

When designing with the A3P1000L-FG256, consider the power supply decoupling and PCB layout to minimize noise and ensure signal integrity. The device requires a 1.2V to 1.5V core supply and separate I/O supplies. Use the Flash*Freeze pin to enter a low-power state when the FPGA is idle, reducing static power consumption.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000L-FG256.

بدائل مباشرة لـ A3P1000L-FG256 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع A3P1000L-FG256 (نفس عامل الشكل والبصمة) — يختلف في Package, Family, Configuration Memory, Technology, System Gates.

Microchip Technology
Package: 256-LBGA (FBGA-256)
Family: ProASIC3
Configuration Memory: 147456 bits flash
قارن مع A3P1000L-FG256 →
Microchip Technology
Package: 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch
Family: ProASIC3L (Flash FPGA)
Configuration Memory: On-chip flash (single-chip, Instant-On)
قارن مع A3P1000L-FG256 →
Microchip Technology
Package: 144-LBGA (13x13 mm, 1.0 mm pitch)
قارن مع A3P1000L-FG256 →
Microchip Technology
Package: 256-ball FBGA (LBGA)
Configuration Memory: On-chip flash (nonvolatile, single-chip)
قارن مع A3P1000L-FG256 →

A3P1000L-1FG256

✅ بديل مباشر
Microchip Technology
📦 256-LBGA
ProASIC3L (Flash FPGA) · 1,000,000 · 24,576 · 177 · 147,456 bits · 1.2 V (1.2 V to 1.5 V supported) · -1

تواصل لمعرفة السعر

عرض ورقة البيانات ←

A3P1000L-FGG256

✅ بديل مباشر
📦 256-LBGA
Same package and pinout, lead-free (RoHS) version

📋 بديل مرجعي (غير موجود في الكتالوج)

A3P1000L-FG256I

✅ بديل مباشر
📦 256-LBGA
Same package and pinout, industrial temperature range (-40C to +100C)

📋 بديل مرجعي (غير موجود في الكتالوج)

A3P1000L-FGG256I

✅ بديل مباشر
📦 256-LBGA
Same package and pinout, lead-free and industrial temperature range

📋 بديل مرجعي (غير موجود في الكتالوج)

A3P1000-FG256M

✅ بديل مباشر
Microchip Technology
📦 256-LBGA
ProASIC3 · 1000000 gates · 24576 · 177 · 147456 bits flash · 231 MHz · 1.5 V

تواصل لمعرفة السعر

عرض ورقة البيانات ←

A3P1000L-FG256 الحدود القصوى والخصائص الكهربائية

Family ProASIC3L
System Gates 1,000,000
Logic Cells 24,576
User I/Os 177
Core Voltage 1.2 V to 1.5 V
أقصى تردد للساعة 350 MHz
العلبة 256-LBGA (17x17 mm, 1.0 mm pitch)
نوع التركيب Surface Mount
درجة حرارة التشغيل 0C to +85C (commercial)
Flash*Freeze Yes
Technology 130 nm Flash
I/O Standards LVCMOS, LVTTL, LVDS, etc.
حالة RoHS Compliant
Lifecycle Active

تكوين أطراف A3P1000L-FG256

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
دبوس 1 IO — User I/O
دبوس 2 IO — User I/O
دبوس 3 IO — User I/O
دبوس 4 IO — User I/O
دبوس 5 IO — User I/O
دبوس 6 IO — User I/O
دبوس 7 IO — User I/O
دبوس 8 IO — User I/O
دبوس 9 IO — User I/O
دبوس 10 IO — User I/O
دبوس 11 IO — User I/O
دبوس 12 IO — User I/O
دبوس 13 IO — User I/O
دبوس 14 IO — User I/O
دبوس 15 IO — User I/O
دبوس 16 IO — User I/O
دبوس 17 IO — User I/O
دبوس 18 IO — User I/O
دبوس 19 IO — User I/O
دبوس 20 IO — User I/O
دبوس 21 IO — User I/O
دبوس 22 IO — User I/O
دبوس 23 IO — User I/O
دبوس 24 IO — User I/O
دبوس 25 IO — User I/O
دبوس 26 IO — User I/O
دبوس 27 IO — User I/O
دبوس 28 IO — User I/O
دبوس 29 IO — User I/O
دبوس 30 IO — User I/O
دبوس 31 IO — User I/O
دبوس 32 IO — User I/O
دبوس 33 IO — User I/O
دبوس 34 IO — User I/O
دبوس 35 IO — User I/O
دبوس 36 IO — User I/O
دبوس 37 IO — User I/O
دبوس 38 IO — User I/O
دبوس 39 IO — User I/O
دبوس 40 IO — User I/O
دبوس 41 IO — User I/O
دبوس 42 IO — User I/O
دبوس 43 IO — User I/O
دبوس 44 IO — User I/O
دبوس 45 IO — User I/O
دبوس 46 IO — User I/O
دبوس 47 IO — User I/O
دبوس 48 IO — User I/O
دبوس 49 IO — User I/O
دبوس 50 IO — User I/O
دبوس 51 IO — User I/O
دبوس 52 IO — User I/O
دبوس 53 IO — User I/O
دبوس 54 IO — User I/O
دبوس 55 IO — User I/O
دبوس 56 IO — User I/O
دبوس 57 IO — User I/O
دبوس 58 IO — User I/O
دبوس 59 IO — User I/O
دبوس 60 IO — User I/O
دبوس 61 IO — User I/O
دبوس 62 IO — User I/O
دبوس 63 IO — User I/O
دبوس 64 IO — User I/O
دبوس 65 IO — User I/O
دبوس 66 IO — User I/O
دبوس 67 IO — User I/O
دبوس 68 IO — User I/O
دبوس 69 IO — User I/O
دبوس 70 IO — User I/O
دبوس 71 IO — User I/O
دبوس 72 IO — User I/O
دبوس 73 IO — User I/O
دبوس 74 IO — User I/O
دبوس 75 IO — User I/O
دبوس 76 IO — User I/O
دبوس 77 IO — User I/O
دبوس 78 IO — User I/O
دبوس 79 IO — User I/O
دبوس 80 IO — User I/O
دبوس 81 IO — User I/O
دبوس 82 IO — User I/O
دبوس 83 IO — User I/O
دبوس 84 IO — User I/O
دبوس 85 IO — User I/O
دبوس 86 IO — User I/O
دبوس 87 IO — User I/O
دبوس 88 IO — User I/O
دبوس 89 IO — User I/O
دبوس 90 IO — User I/O
دبوس 91 IO — User I/O
دبوس 92 IO — User I/O
دبوس 93 IO — User I/O
دبوس 94 IO — User I/O
دبوس 95 IO — User I/O
دبوس 96 IO — User I/O
دبوس 97 IO — User I/O
دبوس 98 IO — User I/O
دبوس 99 IO — User I/O
دبوس 100 IO — User I/O
دبوس 101 IO — User I/O
دبوس 102 IO — User I/O
دبوس 103 IO — User I/O
دبوس 104 IO — User I/O
دبوس 105 IO — User I/O
دبوس 106 IO — User I/O
دبوس 107 IO — User I/O
دبوس 108 IO — User I/O
دبوس 109 IO — User I/O
دبوس 110 IO — User I/O
دبوس 111 IO — User I/O
دبوس 112 IO — User I/O
دبوس 113 IO — User I/O
دبوس 114 IO — User I/O
دبوس 115 IO — User I/O
دبوس 116 IO — User I/O
دبوس 117 IO — User I/O
دبوس 118 IO — User I/O
دبوس 119 IO — User I/O
دبوس 120 IO — User I/O
دبوس 121 IO — User I/O
دبوس 122 IO — User I/O
دبوس 123 IO — User I/O
دبوس 124 IO — User I/O
دبوس 125 IO — User I/O
دبوس 126 IO — User I/O
دبوس 127 IO — User I/O
دبوس 128 IO — User I/O
دبوس 129 IO — User I/O
دبوس 130 IO — User I/O
دبوس 131 IO — User I/O
دبوس 132 IO — User I/O
دبوس 133 IO — User I/O
دبوس 134 IO — User I/O
دبوس 135 IO — User I/O
دبوس 136 IO — User I/O
دبوس 137 IO — User I/O
دبوس 138 IO — User I/O
دبوس 139 IO — User I/O
دبوس 140 IO — User I/O
دبوس 141 IO — User I/O
دبوس 142 IO — User I/O
دبوس 143 IO — User I/O
دبوس 144 IO — User I/O
دبوس 145 IO — User I/O
دبوس 146 IO — User I/O
دبوس 147 IO — User I/O
دبوس 148 IO — User I/O
دبوس 149 IO — User I/O
دبوس 150 IO — User I/O
دبوس 151 IO — User I/O
دبوس 152 IO — User I/O
دبوس 153 IO — User I/O
دبوس 154 IO — User I/O
دبوس 155 IO — User I/O
دبوس 156 IO — User I/O
دبوس 157 IO — User I/O
دبوس 158 IO — User I/O
دبوس 159 IO — User I/O
دبوس 160 IO — User I/O
دبوس 161 IO — User I/O
دبوس 162 IO — User I/O
دبوس 163 IO — User I/O
دبوس 164 IO — User I/O
دبوس 165 IO — User I/O
دبوس 166 IO — User I/O
دبوس 167 IO — User I/O
دبوس 168 IO — User I/O
دبوس 169 IO — User I/O
دبوس 170 IO — User I/O
دبوس 171 IO — User I/O
دبوس 172 IO — User I/O
دبوس 173 IO — User I/O
دبوس 174 IO — User I/O
دبوس 175 IO — User I/O
دبوس 176 IO — User I/O
دبوس 177 IO — User I/O
دبوس 178 VCC — Core power supply
دبوس 179 GND — Ground
دبوس 180 VCC — Core power supply
دبوس 181 GND — Ground
دبوس 182 VCC — Core power supply
دبوس 183 GND — Ground
دبوس 184 VCC — Core power supply
دبوس 185 GND — Ground
دبوس 186 VCC — Core power supply
دبوس 187 GND — Ground
دبوس 188 VCC — Core power supply
دبوس 189 GND — Ground
دبوس 190 VCC — Core power supply
دبوس 191 GND — Ground
دبوس 192 VCC — Core power supply
دبوس 193 GND — Ground
دبوس 194 VCC — Core power supply
دبوس 195 GND — Ground
دبوس 196 VCC — Core power supply
دبوس 197 GND — Ground
دبوس 198 VCC — Core power supply
دبوس 199 GND — Ground
دبوس 200 VCC — Core power supply
دبوس 201 GND — Ground
دبوس 202 VCC — Core power supply
دبوس 203 GND — Ground
دبوس 204 VCC — Core power supply
دبوس 205 GND — Ground
دبوس 206 VCC — Core power supply
دبوس 207 GND — Ground
دبوس 208 VCC — Core power supply
دبوس 209 GND — Ground
دبوس 210 VCC — Core power supply
دبوس 211 GND — Ground
دبوس 212 VCC — Core power supply
دبوس 213 GND — Ground
دبوس 214 VCC — Core power supply
دبوس 215 GND — Ground
دبوس 216 VCC — Core power supply
دبوس 217 GND — Ground
دبوس 218 VCC — Core power supply
دبوس 219 GND — Ground
دبوس 220 VCC — Core power supply
دبوس 221 GND — Ground
دبوس 222 VCC — Core power supply
دبوس 223 GND — Ground
دبوس 224 VCC — Core power supply
دبوس 225 GND — Ground
دبوس 226 VCC — Core power supply
دبوس 227 GND — Ground
دبوس 228 VCC — Core power supply
دبوس 229 GND — Ground
دبوس 230 VCC — Core power supply
دبوس 231 GND — Ground
دبوس 232 VCC — Core power supply
دبوس 233 GND — Ground
دبوس 234 VCC — Core power supply
دبوس 235 GND — Ground
دبوس 236 VCC — Core power supply
دبوس 237 GND — Ground
دبوس 238 VCC — Core power supply
دبوس 239 GND — Ground
دبوس 240 VCC — Core power supply
دبوس 241 GND — Ground
دبوس 242 VCC — Core power supply
دبوس 243 GND — Ground
دبوس 244 VCC — Core power supply
دبوس 245 GND — Ground
دبوس 246 VCC — Core power supply
دبوس 247 GND — Ground
دبوس 248 VCC — Core power supply
دبوس 249 GND — Ground
دبوس 250 VCC — Core power supply
دبوس 251 GND — Ground
دبوس 252 VCC — Core power supply
دبوس 253 GND — Ground
دبوس 254 VCC — Core power supply
دبوس 255 GND — Ground
دبوس 256 VCC — Core power supply

التطبيقات النموذجية

A3P1000L-FG256 مناسب لـ 6 التطبيقs: Industrial Control Systems, Cloud Computing Infrastructure, Consumer Electronics, Aerospace and Defense, Medical Devices, IoT and Smart Home.

🏭

Industrial Control Systems

The A3P1000L-FG256 is ideal for industrial control systems due to its low power consumption, high reliability, and instant-on capability. Its 1.2V to 1.5V core voltage reduces heat generation, making it suitable for sealed enclosures. The FPGA can implement motor control, PLC interfaces, and safety logic. With 177 I/Os, it can interface with sensors, actuators, and communication buses. The Flash*Freeze mode allows the system to enter a low-power standby state when not actively processing, reducing energy costs in 24/7 industrial environments. Its reprogrammability enables firmware updates in the field, extending product lifespan.

🖥️

Cloud Computing Infrastructure

In cloud computing, the A3P1000L-FG256 can be used for protocol bridging, acceleration, and security functions. Its high performance (up to 350 MHz) and low power consumption make it suitable for data center applications where energy efficiency is critical. The FPGA can implement PCIe interfaces, Ethernet MACs, and custom accelerators. Its nonvolatile flash configuration ensures instant-on operation, reducing boot time. The 177 I/Os allow flexible connectivity to host processors and memory. Flash*Freeze technology enables low-power idle states, reducing overall server power consumption. The device's security features protect against bitstream tampering, enhancing data center security.

📱

Consumer Electronics

The A3P1000L-FG256 is well-suited for consumer electronics such as smart home devices, wearables, and portable media players. Its low power consumption extends battery life, while its reprogrammability allows for feature updates and bug fixes after deployment. The FPGA can handle user interface control, sensor fusion, and connectivity protocols. With 177 I/Os, it can interface with displays, touch controllers, and wireless modules. The small 17x17mm FBGA package is ideal for space-constrained designs. Flash*Freeze mode enables ultra-low-power standby, crucial for battery-powered devices. The device's instant-on capability ensures immediate response when the user interacts with the device.

✈️

Aerospace and Defense

The A3P1000L-FG256 is suitable for aerospace and defense applications due to its high reliability, security, and radiation tolerance (though not fully rad-hard). Its nonvolatile flash configuration provides immunity to bitstream corruption, and its instant-on capability is critical for mission-critical systems. The FPGA can implement avionics interfaces, encryption, and signal processing. The 177 I/Os allow connection to sensors, actuators, and communication links. The device's low power consumption is beneficial for satellite and UAV applications where power is limited. Flash*Freeze mode enables low-power operation during idle periods, extending mission duration. The device's security features protect against reverse engineering and tampering.

💊

Medical Devices

The A3P1000L-FG256 is used in medical devices such as patient monitors, imaging systems, and portable diagnostic equipment. Its low power consumption is essential for battery-operated devices, and its high reliability ensures safe operation. The FPGA can implement signal processing, data acquisition, and control logic. With 177 I/Os, it can interface with sensors, ADCs, and displays. The device's reprogrammability allows for software updates to improve functionality or fix bugs. Flash*Freeze mode enables low-power standby, extending battery life in portable devices. The device's instant-on capability ensures immediate readiness in critical medical situations.

🧩

IoT and Smart Home

The A3P1000L-FG256 is ideal for IoT and smart home devices due to its low power consumption, small footprint, and reprogrammability. It can serve as the central controller in smart home hubs, managing communication protocols like Zigbee, Z-Wave, and Wi-Fi. The FPGA's 177 I/Os allow connection to various sensors and actuators. Its Flash*Freeze mode enables ultra-low-power sleep states, crucial for battery-powered IoT devices. The device's instant-on capability ensures quick response to user commands. With 1 million gates, it can handle complex edge computing tasks, reducing the need for cloud processing. The device's security features protect against unauthorized access.

ملخص المنتجات الموصى بها

A3P600L-1FGG144 Microchip Technology يُستخدم في: Industrial Control Systems, Medical Devices A3P1000L-1FGG256 Microchip Technology يُستخدم في: Industrial Control Systems, Cloud Computing Infrastructure A3P1000-FG256M Microchip Technology يُستخدم في: Cloud Computing Infrastructure A3P250L-1VQG100I Microchip Technology يُستخدم في: Consumer Electronics, IoT and Smart Home A3P1000L-FG256I Industrial temperature version for rugged consumer devices يُستخدم في: Consumer Electronics, Medical Devices A3P1000L-FGG256I Lead-free and industrial temperature version يُستخدم في: Aerospace and Defense A3P1000L-1FG256 Microchip Technology يُستخدم في: Aerospace and Defense A3P1000L-FGG256 Lead-free version for environmentally conscious designs يُستخدم في: IoT and Smart Home
What is the A3P1000L-FG256?
The A3P1000L-FG256 is a low-power flash FPGA from Microchip's ProASIC3L family, offering 1 million system gates, 24,576 logic cells, and 177 user I/Os in a 256-ball FBGA package. It operates from a 1.2V to 1.5V core supply and supports clock frequencies up to 350 MHz, making it suitable for low-power, high-reliability applications.
What is the core voltage of A3P1000L-FG256?
The A3P1000L-FG256 operates with a core voltage of 1.2V to 1.5V. This low core voltage helps reduce dynamic power consumption, making the device ideal for battery-powered and thermally constrained applications. According to the Microchip ProASIC3L datasheet, the core supply range is 1.2V to 1.5V.
How many I/O pins does A3P1000L-FG256 have?
The A3P1000L-FG256 has 177 user I/O pins. These I/Os support various standards including LVCMOS, LVTTL, and differential standards, providing flexibility in interfacing with other components. The device is housed in a 256-ball FBGA package, with the remaining balls used for power, ground, and configuration.
What is the maximum clock frequency of A3P1000L-FG256?
The A3P1000L-FG256 supports a maximum clock frequency of 350 MHz. This high performance enables the implementation of complex digital logic, such as high-speed communication interfaces and digital signal processing. The actual achievable frequency depends on the design and routing.
Is A3P1000L-FG256 a low-power FPGA?
Yes, the A3P1000L-FG256 is designed for low power consumption. It features Flash*Freeze technology, which allows the device to enter an ultra-low-power state while retaining its configuration. The core voltage of 1.2V to 1.5V also contributes to reduced dynamic power, making it suitable for battery-powered applications.
What is Flash*Freeze technology in A3P1000L-FG256?
Flash*Freeze is a proprietary technology in ProASIC3L FPGAs that enables the device to enter a low-power mode while preserving its configuration and register states. In Flash*Freeze mode, static power consumption is reduced to microamps, making it ideal for applications that require long battery life or standby operation.
What is the difference between A3P1000L-FG256 and A3P1000L-1FG256?
The A3P1000L-FG256 and A3P1000L-1FG256 are both ProASIC3L FPGAs with the same logic capacity and package. The '-1' suffix typically indicates a speed grade, with the -1 variant offering higher performance. According to Microchip, the -1 speed grade supports higher clock frequencies, but the exact specifications should be verified in the datasheet.
Can A3P1000L-FG256 be used in automotive applications?
The A3P1000L-FG256 is not specifically qualified for automotive applications. Microchip offers automotive-grade versions of ProASIC3 FPGAs, such as the A3P1000L-FG256I (industrial temperature) or A3P1000L-FGG256YI, which may have extended temperature ranges. For automotive use, consider devices with AEC-Q100 qualification, such as the Automotive ProASIC3 series.
What is the price of A3P1000L-FG256?
As of 2026-08-31, the A3P1000L-FG256 is priced at approximately $85.67 for a single unit, based on LCSC data. Volume pricing may be lower, with discounts available for quantities of 10, 100, 500, and 1000. For the most current pricing, check distributor websites like DigiKey, Mouser, or Octopart.
Where can I buy A3P1000L-FG256?
The A3P1000L-FG256 is available from authorized distributors such as DigiKey, Mouser, and LCSC. It can also be purchased from other online electronics components suppliers. As of 2026-08-31, it is in stock at LCSC with a price of $85.67. Check distributor websites for real-time availability and pricing.
What is the lead time for A3P1000L-FG256?
The lead time for A3P1000L-FG256 varies by distributor and order quantity. As of 2026-08-31, LCSC lists it as in stock, suggesting immediate availability. For larger quantities, lead times may extend to several weeks. Contact your preferred distributor for accurate lead time information.
Is A3P1000L-FG256 in stock?
As of 2026-08-31, the A3P1000L-FG256 is listed as in stock at LCSC Electronics. Other distributors like DigiKey and Mouser may also have stock, but availability can change rapidly. Check their websites for real-time inventory status.
What is the best drop-in replacement for A3P1000L-FG256?
The best drop-in replacement for A3P1000L-FG256 is the A3P1000L-1FG256, which is pin-compatible and offers the same package and logic capacity, with a higher speed grade. Other pin-compatible options include the A3P1000L-FGG256 (lead-free version) and the A3P1000L-FG256I (industrial temperature). All share the same 256-FBGA footprint.
Can A3P1000L-FG256 be replaced by A3P1000-FG256M?
The A3P1000-FG256M is a ProASIC3 (non-L) FPGA with the same 256-FBGA package and pinout, but it operates at a higher core voltage (1.5V) and lacks Flash*Freeze technology. While it is pin-compatible, the core voltage difference may require PCB changes. Verify the power supply compatibility before using it as a drop-in replacement.
Where can I download the A3P1000L-FG256 datasheet PDF?
The A3P1000L-FG256 datasheet is available from Microchip's website. The official datasheet is titled 'ProASIC3L Low Power Flash FPGAs with Flash*Freeze Technology' and can be downloaded from the Microchip product page. Additionally, distributor sites like DigiKey and Mouser provide datasheet links.

بيانات مرجعية هندسية لـ A3P1000L-FG256 — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the A3P1000L-FG256 when you need a low-power, instant-on FPGA with 1 million gates and 177 I/Os in a compact 256-FBGA package. It is ideal for battery-powered, industrial, and aerospace applications where power consumption and reliability are critical. If you require higher performance, consider the A3P1000L-1FG256 (speed grade -1). For lead-free requirements, select the A3P1000L-FGG256. For industrial temperature ranges, use the A3P1000L-FG256I or A3P1000L-FGG256I. If you do not need Flash*Freeze and can tolerate a higher core voltage, the A3P1000-FG256M is a lower-cost alternative, but verify power supply compatibility. For designs with lower logic density, consider the A3P600L series to reduce cost.

المقارنة مع البدائل

المعامل هذا المنتج A3P1000L-1FG256 A3P1000L-FGG256 A3P1000L-FG256I A3P1000L-FGG256I A3P1000-FG256M
Package 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core Voltage 1.2V to 1.5V 1.2V to 1.5V 1.2V to 1.5V 1.2V to 1.5V 1.2V to 1.5V 1.5V
Flash*Freeze Yes Yes Yes Yes Yes No
Speed Grade Standard -1 (higher) Standard Standard Standard Standard
Temperature Range 0C to +85C 0C to +85C 0C to +85C -40C to +100C -40C to +100C 0C to +85C
RoHS Compliant Compliant Compliant (lead-free) Compliant Compliant (lead-free) Compliant

أبرز الفروقات

  • Flash*Freeze technology for ultra-low static power (مقابلA3P1000-FG256M)
  • Lower core voltage (1.2V-1.5V) reduces dynamic power (مقابلA3P1000-FG256M)
  • Instant-on capability due to nonvolatile flash configuration (مقابلSRAM-based FPGAs)

ملاحظات التصميم

The A3P1000L-FG256 requires a 1.2V to 1.5V core supply and separate I/O supplies. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC pin to decouple high-frequency noise. For the core supply, a 1.0A LDO or DC-DC converter is recommended, depending on the design's power budget. Ensure the power supply can handle the inrush current during configuration.

For the 256-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential). Place decoupling capacitors on the bottom side of the PCB, directly under the FPGA, to minimize inductance. Follow the manufacturer's layout guidelines for the FBGA package to ensure reliable solder joints.

The A3P1000L-FG256 has a maximum junction temperature of 125C. For typical designs with moderate logic utilization, the power dissipation is low due to the 1.2V core voltage. However, if the design uses many I/Os or high toggle rates, consider adding thermal vias under the FPGA to improve heat dissipation. The FBGA package has a thermal resistance (theta_JA) of approximately 20-30 C/W, so a heatsink may be needed for high-power designs.

معلومات الامتثال

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
خالٍ من الرصاص
Yes
خالٍ من الهالوجين
Unknown
المعادن المتنازع عليها
Unknown

RoHS compliant per Microchip product page. Lead-free version available as A3P1000L-FGG256. Not AEC-Q100 qualified; automotive versions available in Automotive ProASIC3 series.

تم التحقق من البيانات في: 2026-08-31 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

عمليات بحث ذات صلة

A3P1000L-FG256 A3P1000L-FG256 datasheet Microchip A3P1000L-FG256 ProASIC3L FPGA 1M gates 256-FBGA FPGA A3P1000L-FG256 price A3P1000L-FG256 vs A3P1000L-1FG256 A3P1000L-FG256 drop-in replacement low power FPGA for IoT what is Flash*Freeze technology

المكونات والمصطلحات ذات الصلة

Microchip Technology A3P1000L-FG256 A3P1000L-1FG256 A3P1000L-FGG256 A3P1000L-FG256I A3P1000L-FGG256I A3P1000-FG256M FPGA Field Programmable Gate Array ProASIC3L Flash*Freeze 256-LBGA FBGA RoHS LVCMOS LVTTL LVDS Industrial Control Cloud Computing Consumer Electronics
عرض سعر سريع RFQ
املأ التفاصيل الكاملة — سيرد فريق المبيعات لدينا خلال 24 ساعة
رقم القطعة الشركة المصنعة الحزمة QTY السعر المستهدف الإجمالي
✓
تم إرسال عرض السعر!

سنرد على بريدك الإلكتروني خلال 24 ساعة

1
تم إرسال طلب عرض السعر
2
تم استلام عرض السعر
3
تم تقديم الطلب
4
الدفع
5
تم الشحن
6
تم التسليم
عرض تفاصيل طلب عرض السعر