A3P1000L-1FG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
MPN: A3P1000L-1FG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $55.33 | $55.33 |
| 10 | $51.2 | $512.00 |
| 100 | $46.8 | $4,680.00 |
| 500 | $42.5 | $21,250.00 |
| 1,000 | $38.9 | $38,900.00 |
Drop-in alternatives for A3P1000L-1FG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P1000L-1FGG256
✅ Drop-In✓ In Stock
$55.33 / Unit
View Datasheet →A3P1000L-1FG256Y
✅ Drop-In📋 Reference alternative (not in catalog)
A3P1000-1FG256T
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$89.64 / Unit
View Datasheet →A3P1000-1FGG256T
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$112.06 / Unit
View Datasheet →A3P1000-FGG256M
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$27.85 / Unit
View Datasheet →A3P1000-FG256M
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$50.87 / Unit
View Datasheet →A3P1000L-1FG256 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 1,000,000 |
| Logic Elements (VersaTiles) | 24,576 |
| User I/Os | 177 |
| Embedded SRAM | 147,456 bits |
| Core Voltage (L grade) | 1.2 V (1.2 V to 1.5 V supported) |
| Speed Grade | -1 |
| Technology | Nonvolatile flash, CMOS |
| Configuration Memory | On-chip flash (single-chip, Instant-On) |
| Low Power Feature | Flash*Freeze technology |
| Package | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch |
| Package Height | 1.6 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
A3P1000L-1FG256 1.6 mm Pin Configuration Guide
Complete pinout information for A3P1000L-1FG256 (1.6 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000L-1FG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000L-1FG256 is suitable for 6 applications: Battery-Powered Portable Instrumentation, Industrial Control and Automation, Secure Single-Chip System Control, Glue Logic Consolidation, Medical and Diagnostic Equipment, Aerospace and Defense Embedded Logic.
Battery-Powered Portable Instrumentation
The A3P1000L-1FG256 fits portable instruments because its 1.2 V L-grade core cuts dynamic power and Flash*Freeze technology collapses the device into an ultra-low static state while retaining every register and SRAM bit. In a handheld data logger, the FPGA handles sensor front-end glue logic, timing generation, and display interfaces, then enters Flash*Freeze between measurement cycles and wakes in a single clock cycle. The single-chip flash configuration also removes the external boot ROM, saving board area and its associated leakage. With 24,576 logic elements and 177 user I/Os, one device typically consolidates the functions of several discrete ICs, further reducing the total battery-load budget in compact enclosures.
Recommended
Industrial Control and Automation
In industrial control panels, the A3P1000L-1FG256 implements deterministic state machines, encoder interfaces, safety interlock logic, and communication bridges with Instant-On behavior that matters at machine power-up: the flash fabric is functional within microseconds, so I/O are controlled before a soft MCU finishes booting. The 1,000,000-gate capacity and 24,576 VersaTiles absorb protocol translation between legacy field signals and modern serial links, while 177 I/Os interface PLC backplanes directly. Because configuration is stored in on-chip flash, vibration-prone factory environments avoid socketed configuration devices. The FG256 17 x 17 mm FBGA also withstands industrial temperature profiles when the appropriate grade suffix is selected.
Recommended
Secure Single-Chip System Control
Flash-based FPGAs are preferred where the bitstream must never leave the chip: the A3P1000L-1FG256 stores its configuration in on-chip nonvolatile flash, eliminating the configuration-readout attacks that SRAM FPGAs are exposed to at boot. In secure controllers for access systems, defense electronics, and licensed equipment, this single-chip property plus the secure ProASIC3 programming chain protects proprietary logic. The device implements cryptographic helpers, tamper-response logic, and board-level sequencing in the 24,576-element fabric while the Flash*Freeze mode preserves keys held in registers during idle. Instant-On operation also enforces security policy from the first microsecond of power application.
Recommended
Glue Logic Consolidation
Many boards accumulate aging PLD, FIFO, bus-bridge, and address-decoder devices that become sourcing liabilities. The A3P1000L-1FG256 replaces such clusters with one flash FPGA: 24,576 VersaTiles comfortably absorb multiple 22V10-class CPLDs plus buffers, and 147,456 bits of embedded SRAM implement FIFOs that once needed dedicated parts. Instant-On flash configuration preserves the power-up behavior of the original PLDs, which matters for reset trees and enable sequencing. Consolidation reduces BOM lines, board area, and qualification effort; with 177 user I/Os in a 1.0 mm-pitch FBGA, dense legacy buses map directly without fanout adapters.
Recommended
Medical and Diagnostic Equipment
Medical monitors and diagnostic devices benefit from the A3P1000L-1FG256's combination of deterministic Instant-On I/O control and low standby power. The FPGA manages sensor timing, filter logic, and alarm chains with fixed latency, while Flash*Freeze holds patient-session state during idle periods between measurements. The single-chip flash configuration supports equipment integrity requirements because no external bitstream can be substituted. With 1,000,000 gates, the device also implements the processing glue between analog front ends and a host processor in portable ultrasound, ECG, and lab instruments, where the 17 x 17 mm FBGA keeps the electronics compact.
Recommended
Aerospace and Defense Embedded Logic
Microsemi (now Microchip) flash FPGAs have a long heritage in defense and aerospace subsystems, and the A3P1000L-1FG256 continues that role for rad-tolerant-adjacent, high-reliability board designs that need reprogrammability without configuration PROMs. Instant-On operation satisfies stringent power-up sequencing requirements in avionics; the flash fabric resists configuration disturbance, and Flash*Freeze supports duty-cycled payloads on constrained power budgets. The 1M-gate fabric implements bus interfaces, telemetry formatting, and safe-state controllers, while single-chip configuration reduces connector count and failure modes. Designers typically pair it with rugged power and supervisor components from the same reliability-qualified ecosystem.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000L-1FG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000L-1FGG256 | A3P1000-1FG256T | A3P1000-FGG256M |
|---|---|---|---|---|
| Package | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FGG256), 17 x 17 mm - same footprint | 256-ball FBGA (FG256) - same footprint | 256-ball FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 24,576 VersaTiles | 24,576 | 24,576 | 24,576 |
| User I/Os | 177 | 177 | 177 | 177 |
| Core Voltage | 1.2 V (L grade) | 1.2 V (L grade) | 1.5 V (standard) | 1.5 V (standard) |
| Flash*Freeze Technology | Yes | Yes | No (standard ProASIC3) | No (standard ProASIC3) |
| Embedded SRAM | 147,456 bits | 147,456 bits | 147,456 bits | 147,456 bits |
| Configuration | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On |
| Quantity-1 Price (as of 2026-08-31) | $55.33 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Low-power 1.2 V core with Flash*Freeze (vs A3P1000-1FG256T)
- Same-die same-package FGG variant for sourcing flexibility (vs A3P1000L-1FGG256)
- Single-chip flash configuration (vs SRAM FPGAs of similar density (Xilinx/Artix class))
Design Notes
Supply the core at 1.2 V for the L-grade low-power operating point; the family supports 1.2 V to 1.5 V core per the Microchip product page, but timing closure in Libero SoC is valid only for the voltage you analyzed. Provide separate I/O bank supplies matched to the interface standards of each bank, and decouple every VCC ball with a local capacitor plus bulk capacitance at the board level. Follow the datasheet power-up ramp and sequencing requirements so the flash fabric initializes cleanly and I/O are tristated during ramp.
Estimated: with a 1.2 V core and mostly static logic, dynamic power in the 24,576-tile fabric is typically modest, but verify with Libero SmartPower using your actual toggle rates. The 256-ball FBGA dissipates heat mainly through the board, so provide solid ground/via farms under the package. For designs held in Flash*Freeze for most of the duty cycle, thermal design is rarely limiting; continuous high-toggle designs at elevated ambient deserve a junction-temperature calculation before layout freeze.
Do not assume the FG256 and FGG256 ball maps are interchangeable without checking the datasheet package table - the two 256-ball variants differ in ball assignment despite the same 17 mm body. Also remember that designs closed on the non-L A3P1000 at 1.5 V are not timing-valid on the A3P1000L at 1.2 V without re-running place-and-route. Finally, use the Flash*Freeze pin correctly: I/O must be in a defined state when entering the mode to guarantee state retention per the ProASIC3L datasheet.
Compliance Information
Distributor listings present the part as RoHS-compliant lead-free. Formal REACH/halogen declarations must be pulled from the official Microchip product page.
