A3P1000L-FG256 - ProASIC3L FPGA, 1M Gates | Microchip
MPN: A3P1000L-FG256 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.67 | $85.67 |
| 10 | $78.5 | $785.00 |
| 100 | $70 | $7,000.00 |
| 500 | $62 | $31,000.00 |
| 1,000 | $55 | $55,000.00 |
Drop-in alternatives for A3P1000L-FG256 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P1000L-1FG256
β Drop-Inβ In Stock
$38.9 / Unit
View Datasheet βA3P1000L-FGG256
β Drop-Inπ Reference alternative (not in catalog)
A3P1000L-FG256I
β Drop-Inπ Reference alternative (not in catalog)
A3P1000L-FGG256I
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-FG256M
β Drop-Inβ In Stock
$50.87 / Unit
View Datasheet βA3P1000L-FG256 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| System Gates | 1,000,000 |
| Logic Cells | 24,576 |
| User I/Os | 177 |
| Core Voltage | 1.2 V to 1.5 V |
| Maximum Clock Frequency | 350 MHz |
| Package | 256-LBGA (17x17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Flash*Freeze | Yes |
| Technology | 130 nm Flash |
| I/O Standards | LVCMOS, LVTTL, LVDS, etc. |
| RoHS Status | Compliant |
| Lifecycle | Active |
A3P1000L-FG256 Pin Configuration
| Pin 1 | IO β User I/O |
| Pin 2 | IO β User I/O |
| Pin 3 | IO β User I/O |
| Pin 4 | IO β User I/O |
| Pin 5 | IO β User I/O |
| Pin 6 | IO β User I/O |
| Pin 7 | IO β User I/O |
| Pin 8 | IO β User I/O |
| Pin 9 | IO β User I/O |
| Pin 10 | IO β User I/O |
| Pin 11 | IO β User I/O |
| Pin 12 | IO β User I/O |
| Pin 13 | IO β User I/O |
| Pin 14 | IO β User I/O |
| Pin 15 | IO β User I/O |
| Pin 16 | IO β User I/O |
| Pin 17 | IO β User I/O |
| Pin 18 | IO β User I/O |
| Pin 19 | IO β User I/O |
| Pin 20 | IO β User I/O |
| Pin 21 | IO β User I/O |
| Pin 22 | IO β User I/O |
| Pin 23 | IO β User I/O |
| Pin 24 | IO β User I/O |
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| Pin 30 | IO β User I/O |
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| Pin 33 | IO β User I/O |
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| Pin 51 | IO β User I/O |
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| Pin 70 | IO β User I/O |
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| Pin 99 | IO β User I/O |
| Pin 100 | IO β User I/O |
| Pin 101 | IO β User I/O |
| Pin 102 | IO β User I/O |
| Pin 103 | IO β User I/O |
| Pin 104 | IO β User I/O |
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| Pin 106 | IO β User I/O |
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| Pin 174 | IO β User I/O |
| Pin 175 | IO β User I/O |
| Pin 176 | IO β User I/O |
| Pin 177 | IO β User I/O |
| Pin 178 | VCC β Core power supply |
| Pin 179 | GND β Ground |
| Pin 180 | VCC β Core power supply |
| Pin 181 | GND β Ground |
| Pin 182 | VCC β Core power supply |
| Pin 183 | GND β Ground |
| Pin 184 | VCC β Core power supply |
| Pin 185 | GND β Ground |
| Pin 186 | VCC β Core power supply |
| Pin 187 | GND β Ground |
| Pin 188 | VCC β Core power supply |
| Pin 189 | GND β Ground |
| Pin 190 | VCC β Core power supply |
| Pin 191 | GND β Ground |
| Pin 192 | VCC β Core power supply |
| Pin 193 | GND β Ground |
| Pin 194 | VCC β Core power supply |
| Pin 195 | GND β Ground |
| Pin 196 | VCC β Core power supply |
| Pin 197 | GND β Ground |
| Pin 198 | VCC β Core power supply |
| Pin 199 | GND β Ground |
| Pin 200 | VCC β Core power supply |
| Pin 201 | GND β Ground |
| Pin 202 | VCC β Core power supply |
| Pin 203 | GND β Ground |
| Pin 204 | VCC β Core power supply |
| Pin 205 | GND β Ground |
| Pin 206 | VCC β Core power supply |
| Pin 207 | GND β Ground |
| Pin 208 | VCC β Core power supply |
| Pin 209 | GND β Ground |
| Pin 210 | VCC β Core power supply |
| Pin 211 | GND β Ground |
| Pin 212 | VCC β Core power supply |
| Pin 213 | GND β Ground |
| Pin 214 | VCC β Core power supply |
| Pin 215 | GND β Ground |
| Pin 216 | VCC β Core power supply |
| Pin 217 | GND β Ground |
| Pin 218 | VCC β Core power supply |
| Pin 219 | GND β Ground |
| Pin 220 | VCC β Core power supply |
| Pin 221 | GND β Ground |
| Pin 222 | VCC β Core power supply |
| Pin 223 | GND β Ground |
| Pin 224 | VCC β Core power supply |
| Pin 225 | GND β Ground |
| Pin 226 | VCC β Core power supply |
| Pin 227 | GND β Ground |
| Pin 228 | VCC β Core power supply |
| Pin 229 | GND β Ground |
| Pin 230 | VCC β Core power supply |
| Pin 231 | GND β Ground |
| Pin 232 | VCC β Core power supply |
| Pin 233 | GND β Ground |
| Pin 234 | VCC β Core power supply |
| Pin 235 | GND β Ground |
| Pin 236 | VCC β Core power supply |
| Pin 237 | GND β Ground |
| Pin 238 | VCC β Core power supply |
| Pin 239 | GND β Ground |
| Pin 240 | VCC β Core power supply |
| Pin 241 | GND β Ground |
| Pin 242 | VCC β Core power supply |
| Pin 243 | GND β Ground |
| Pin 244 | VCC β Core power supply |
| Pin 245 | GND β Ground |
| Pin 246 | VCC β Core power supply |
| Pin 247 | GND β Ground |
| Pin 248 | VCC β Core power supply |
| Pin 249 | GND β Ground |
| Pin 250 | VCC β Core power supply |
| Pin 251 | GND β Ground |
| Pin 252 | VCC β Core power supply |
| Pin 253 | GND β Ground |
| Pin 254 | VCC β Core power supply |
| Pin 255 | GND β Ground |
| Pin 256 | VCC β Core power supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000L-FG256 is suitable for 6 applications: Industrial Control Systems, Cloud Computing Infrastructure, Consumer Electronics, Aerospace and Defense, Medical Devices, IoT and Smart Home.
Industrial Control Systems
The A3P1000L-FG256 is ideal for industrial control systems due to its low power consumption, high reliability, and instant-on capability. Its 1.2V to 1.5V core voltage reduces heat generation, making it suitable for sealed enclosures. The FPGA can implement motor control, PLC interfaces, and safety logic. With 177 I/Os, it can interface with sensors, actuators, and communication buses. The Flash*Freeze mode allows the system to enter a low-power standby state when not actively processing, reducing energy costs in 24/7 industrial environments. Its reprogrammability enables firmware updates in the field, extending product lifespan.
Recommended
Cloud Computing Infrastructure
In cloud computing, the A3P1000L-FG256 can be used for protocol bridging, acceleration, and security functions. Its high performance (up to 350 MHz) and low power consumption make it suitable for data center applications where energy efficiency is critical. The FPGA can implement PCIe interfaces, Ethernet MACs, and custom accelerators. Its nonvolatile flash configuration ensures instant-on operation, reducing boot time. The 177 I/Os allow flexible connectivity to host processors and memory. Flash*Freeze technology enables low-power idle states, reducing overall server power consumption. The device's security features protect against bitstream tampering, enhancing data center security.
Recommended
Consumer Electronics
The A3P1000L-FG256 is well-suited for consumer electronics such as smart home devices, wearables, and portable media players. Its low power consumption extends battery life, while its reprogrammability allows for feature updates and bug fixes after deployment. The FPGA can handle user interface control, sensor fusion, and connectivity protocols. With 177 I/Os, it can interface with displays, touch controllers, and wireless modules. The small 17x17mm FBGA package is ideal for space-constrained designs. Flash*Freeze mode enables ultra-low-power standby, crucial for battery-powered devices. The device's instant-on capability ensures immediate response when the user interacts with the device.
Recommended
Aerospace and Defense
The A3P1000L-FG256 is suitable for aerospace and defense applications due to its high reliability, security, and radiation tolerance (though not fully rad-hard). Its nonvolatile flash configuration provides immunity to bitstream corruption, and its instant-on capability is critical for mission-critical systems. The FPGA can implement avionics interfaces, encryption, and signal processing. The 177 I/Os allow connection to sensors, actuators, and communication links. The device's low power consumption is beneficial for satellite and UAV applications where power is limited. Flash*Freeze mode enables low-power operation during idle periods, extending mission duration. The device's security features protect against reverse engineering and tampering.
Recommended
Medical Devices
The A3P1000L-FG256 is used in medical devices such as patient monitors, imaging systems, and portable diagnostic equipment. Its low power consumption is essential for battery-operated devices, and its high reliability ensures safe operation. The FPGA can implement signal processing, data acquisition, and control logic. With 177 I/Os, it can interface with sensors, ADCs, and displays. The device's reprogrammability allows for software updates to improve functionality or fix bugs. Flash*Freeze mode enables low-power standby, extending battery life in portable devices. The device's instant-on capability ensures immediate readiness in critical medical situations.
Recommended
IoT and Smart Home
The A3P1000L-FG256 is ideal for IoT and smart home devices due to its low power consumption, small footprint, and reprogrammability. It can serve as the central controller in smart home hubs, managing communication protocols like Zigbee, Z-Wave, and Wi-Fi. The FPGA's 177 I/Os allow connection to various sensors and actuators. Its Flash*Freeze mode enables ultra-low-power sleep states, crucial for battery-powered IoT devices. The device's instant-on capability ensures quick response to user commands. With 1 million gates, it can handle complex edge computing tasks, reducing the need for cloud processing. The device's security features protect against unauthorized access.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000L-FG256 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000L-1FG256 | A3P1000L-FGG256 | A3P1000L-FG256I | A3P1000L-FGG256I | A3P1000-FG256M |
|---|---|---|---|---|---|---|
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Voltage | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V | 1.2V to 1.5V | 1.5V |
| Flash*Freeze | Yes | Yes | Yes | Yes | Yes | No |
| Speed Grade | Standard | -1 (higher) | Standard | Standard | Standard | Standard |
| Temperature Range | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C |
| RoHS | Compliant | Compliant | Compliant (lead-free) | Compliant | Compliant (lead-free) | Compliant |
| Price (1pc) | $85.67 | [DATA_NEEDED] | [DATA_NEEDED] | $85.67 | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Flash*Freeze technology for ultra-low static power (vs A3P1000-FG256M)
- Lower core voltage (1.2V-1.5V) reduces dynamic power (vs A3P1000-FG256M)
- Instant-on capability due to nonvolatile flash configuration (vs SRAM-based FPGAs)
Design Notes
The A3P1000L-FG256 requires a 1.2V to 1.5V core supply and separate I/O supplies. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC pin to decouple high-frequency noise. For the core supply, a 1.0A LDO or DC-DC converter is recommended, depending on the design's power budget. Ensure the power supply can handle the inrush current during configuration.
For the 256-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential). Place decoupling capacitors on the bottom side of the PCB, directly under the FPGA, to minimize inductance. Follow the manufacturer's layout guidelines for the FBGA package to ensure reliable solder joints.
The A3P1000L-FG256 has a maximum junction temperature of 125C. For typical designs with moderate logic utilization, the power dissipation is low due to the 1.2V core voltage. However, if the design uses many I/Os or high toggle rates, consider adding thermal vias under the FPGA to improve heat dissipation. The FBGA package has a thermal resistance (theta_JA) of approximately 20-30 C/W, so a heatsink may be needed for high-power designs.
Compliance Information
RoHS compliant per Microchip product page. Lead-free version available as A3P1000L-FGG256. Not AEC-Q100 qualified; automotive versions available in Automotive ProASIC3 series.