ADC0808S125HW-C18 - 8-bit 125 MSPS ADC | Renesas
MPN: ADC0808S125HW-C18 ✓ نشطADC0808S125HW-C18 نظرة عامة
An ADC (Analog-to-Digital Converter) is a mixed-signal integrated circuit that quantizes a continuous-time analog waveform into discrete digital codes. High-speed 8-bit ADCs sit at the entry point of the high-speed converter hierarchy: pipeline ADCs -> flash ADCs -> 8-bit ADCs -> data converters -> mixed-signal ICs -> semiconductor. The 8-bit/125 MSPS class is typically used as the capture stage before downstream digital signal processing in demodulators, equalizers, and oversampling decimators.
Key features of the ADC0808S125HW-C18 include 7.2 ENOB (effective number of bits) at Nyquist, 1 Vp-p differential full-scale input range, 1.8 V CMOS or LVDS selectable clock input, on-chip 1.25 V reference, and a 3.3 V analog supply with 1.8 V digital I/O supply. The output interface can be configured as CMOS or LVDS DDR data, giving the designer a flexible handoff to an FPGA. The exposed-pad HTQFP package keeps the die-to-ambient thermal resistance low enough for continuous 125 MSPS operation in industrial temperature environments.
The architecture is a differential pipeline converter optimized for low-latency sampling. Differential analog inputs reject common-mode noise from the PCB environment, and the integrated reference eliminates an external reference IC. The pipelined architecture introduces a fixed conversion latency that is consistent and deterministic, simplifying synchronization with downstream FPGA logic.
Typical applications include telecommunication transmission control systems, tape drive read channels, digital oscilloscope front-ends, and general-purpose high-speed data acquisition systems. The combination of selectable clock and output interfaces allows the ADC to bridge cleanly into either legacy CMOS ASIC/FPGA logic or modern LVDS-serdes-based FPGA designs.
When designing with this device, pay attention to the analog input common-mode voltage and the input bandwidth: the input must be AC- or DC-coupled into the specified common-mode voltage for full-scale accuracy, and the analog input bandwidth should exceed 250 MHz to preserve the 125 MSPS Nyquist performance. The exposed pad must be soldered to a continuous ground plane for thermal dissipation and ground reference integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page, giving engineers a single source for sourcing, replacement, and design-in decisions.
بدائل مباشرة لـ ADC0808S125HW-C18 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ADC0808S125HW-C18 (نفس عامل الشكل والبصمة) — يختلف في Package, Architecture, Sampling Rate, Input Type, Data Interface.
ADC0808S125HW-C1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ADC0808S250HW-C18
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ADC0808S250HW-C1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ADC0808S125HW/C1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ADC0808S125HW
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
ADC0808S125HW-C18 الحدود القصوى والخصائص الكهربائية
| الدقة | 8 bits |
| Number of Channels | 1 |
| معدل أخذ العينات | 125 MSPS (max 250 MHz clock) |
| Input Type | Differential |
| Full-Scale Input Range | 1 Vp-p |
| Effective Number of Bits (ENOB) | 7.2 bits at Nyquist |
| Analog Supply Voltage | 3.3 V |
| Digital I/O Supply Voltage | 1.8 V |
| Clock Input | Selectable 1.8 V CMOS or LVDS |
| Data Output Interface | CMOS or LVDS DDR |
| Internal Reference Voltage | 1.25 V |
| Power Dissipation | Approx. 400 mW at 125 MSPS |
| العلبة | 48-HTQFP Exposed Pad (HTQFP-48) |
| درجة حرارة التشغيل | -40 C to +85 C |
| نوع التركيب | Surface Mount |
| Packaging | Tape & Reel |
تكوين أطراف ADC0808S125HW-C18
| دبوس 1 | AIN+ — Differential analog input, positive |
| دبوس 2 | AIN- — Differential analog input, negative |
| دبوس 3 | VCM — Common-mode voltage bypass |
| دبوس 4 | REFT — Reference top, bypass with capacitor |
| دبوس 5 | REFB — Reference bottom, bypass with capacitor |
| دبوس 6 | VREF — Internal 1.25 V reference output / bypass |
| دبوس 7 | AVDD — Analog 3.3 V supply |
| دبوس 8 | AGND — Analog ground |
| دبوس 9 | CLK+ — Differential clock input, positive (CMOS or LVDS) |
| دبوس 10 | CLK- — Differential clock input, negative |
| دبوس 11 | CLKSEL — Clock mode select (CMOS or LVDS) |
| دبوس 12 | OUTSEL — Output mode select (CMOS or LVDS DDR) |
| دبوس 13 | DRVDD — Digital output driver 1.8 V supply |
| دبوس 14 | DRGND — Digital output driver ground |
| دبوس 15 | D0 — Data output bit 0 (LSB) |
| دبوس 16 | D1 — Data output bit 1 |
| دبوس 17 | D2 — Data output bit 2 |
| دبوس 18 | D3 — Data output bit 3 |
| دبوس 19 | D4 — Data output bit 4 |
| دبوس 20 | D5 — Data output bit 5 |
| دبوس 21 | D6 — Data output bit 6 |
| دبوس 22 | D7 — Data output bit 7 (MSB) |
| دبوس 23 | DCLK — Data clock output (DDR strobe) |
| دبوس 24 | OE — Output enable (active low) |
| دبوس 25 | PD — Power-down (active high) |
| دبوس 26 | NC — Not connected (per datasheet) |
| دبوس 27 | NC — Not connected (per datasheet) |
| دبوس 28 | NC — Not connected (per datasheet) |
| دبوس 29 | NC — Not connected (per datasheet) |
| دبوس 30 | DVDD — Digital core 1.8 V supply |
| دبوس 31 | DGND — Digital core ground |
| دبوس 32 | TEST — Test mode (tie to DGND in normal operation) |
| دبوس 33 | NC — Not connected (per datasheet) |
| دبوس 34 | NC — Not connected (per datasheet) |
| دبوس 35 | NC — Not connected (per datasheet) |
| دبوس 36 | NC — Not connected (per datasheet) |
| دبوس 37 | NC — Not connected (per datasheet) |
| دبوس 38 | NC — Not connected (per datasheet) |
| دبوس 39 | NC — Not connected (per datasheet) |
| دبوس 40 | NC — Not connected (per datasheet) |
| دبوس 41 | NC — Not connected (per datasheet) |
| دبوس 42 | NC — Not connected (per datasheet) |
| دبوس 43 | NC — Not connected (per datasheet) |
| دبوس 44 | NC — Not connected (per datasheet) |
| دبوس 45 | NC — Not connected (per datasheet) |
| دبوس 46 | NC — Not connected (per datasheet) |
| دبوس 47 | NC — Not connected (per datasheet) |
| دبوس 48 | NC — Not connected (per datasheet) |
التطبيقات النموذجية
ADC0808S125HW-C18 مناسب لـ 6 التطبيقs: Telecommunication Transmission Control Systems, Tape Drive Read Channels, Digital Oscilloscope Front-End, High-Speed Data Acquisition Systems, Radar and Lidar Signal Processing, Medical Imaging Front-End.
Telecommunication Transmission Control Systems
The ADC0808S125HW-C18's 125 MSPS sampling rate and 7.2 ENOB make it a fit for telecom transmission control system front-ends. Differential 1 Vp-p inputs reject common-mode noise from backplane traces, while the 1.8 V CMOS / LVDS clock input lets the part interface directly with telecom ASIC or FPGA clock trees without level translation. In a typical application, the ADC samples the demodulated baseband I/Q stream at 125 MSPS and outputs LVDS DDR data to a downstream DSP or FPGA for symbol recovery. The exposed-pad HTQFP-48 provides the thermal headroom needed for continuous 125 MSPS operation in industrial telecom environments, where ambient temperatures can reach +85 C.
موصى به
Tape Drive Read Channels
The ADC0808S125HW-C18 was originally designed for tape drive read-channel applications, where high-speed 8-bit sampling captures the analog playback signal for downstream equalization. The 125 MSPS rate exceeds the Nyquist requirement for LTO or DLT tape read channels, and the 1 Vp-p differential input range matches typical tape-head preamplifier outputs. The integrated 1.25 V reference eliminates an external reference IC, simplifying the read-channel BOM. The selectable CMOS or LVDS data output interfaces allow the design to bridge cleanly into either legacy ASIC read channels or modern FPGA-based read-channel controllers.
موصى به
Digital Oscilloscope Front-End
The ADC0808S125HW-C18's 125 MSPS sampling and 7.2 ENOB enable a low-cost digitizer front-end for entry-level digital oscilloscopes or data acquisition modules. The differential 1 Vp-p input range accommodates probe-attenuator outputs directly, and the LVDS DDR data output streams 1 Gbps into an FPGA for real-time display or storage. The exposed-pad HTQFP package maintains thermal stability during continuous acquisition at 125 MSPS. Compared to higher-bit ADCs, the 8-bit resolution is well suited to general-purpose scope measurements where vertical resolution is not the primary requirement.
موصى به
High-Speed Data Acquisition Systems
The ADC0808S125HW-C18 is well suited to general-purpose high-speed data acquisition systems where 8-bit resolution is sufficient. The 125 MSPS rate captures signals up to 62.5 MHz Nyquist, which is adequate for many industrial and scientific instrumentation applications. Differential inputs reject common-mode noise in electrically noisy environments, while the integrated 1.25 V reference simplifies the analog front-end BOM. The 3.3 V analog and 1.8 V digital supplies separate analog and digital domains, reducing switching-noise coupling into the analog input.
موصى به
Radar and Lidar Signal Processing
The ADC0808S125HW-C18's 125 MSPS sampling rate can digitize intermediate-frequency radar or lidar return signals in entry-level automotive and industrial sensing systems. Differential analog inputs reject common-mode noise from motor drives and switching power converters, while the LVDS DDR data output streams samples directly into an FPGA for matched-filter detection. The 1 Vp-p full-scale input range matches typical IF-stage gain. The exposed-pad HTQFP-48 package provides thermal performance for continuous sampling at 125 MSPS in -40 C to +85 C environments.
موصى به
Medical Imaging Front-End
The ADC0808S125HW-C18 can serve as the front-end digitizer in entry-level ultrasound or medical imaging systems where 8-bit vertical resolution is acceptable. The 125 MSPS sampling rate handles intermediate-frequency signal bands from transducer arrays, and the LVDS DDR output interfaces cleanly with FPGA-based beamforming pipelines. The differential analog input rejects common-mode noise from switching power supplies, which is critical in medical environments where leakage currents must be minimized. The exposed-pad package maintains thermal stability in continuous-operation imaging systems.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ADC0808S125HW-C18 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ADC0808S125HW-C1 | ADC0808S250HW-C18 | ADC0808S250HW-C1 | ADC0808S125HW/C1 | ADC0808S125HW |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | NXP Semiconductors | Renesas Electronics |
| Package | 48-HTQFP Exposed Pad | 48-HTQFP Exposed Pad - same | 48-HTQFP Exposed Pad - same | 48-HTQFP Exposed Pad - same | 48-HTQFP Exposed Pad - same | 48-HTQFP Exposed Pad - same |
| Resolution | 8 bits | 8 bits | 8 bits | 8 bits | 8 bits | 8 bits |
| Sampling Rate | 125 MSPS | 125 MSPS | 250 MSPS (+100%) | 250 MSPS (+100%) | 125 MSPS | 125 MSPS |
| Differential Input Range | 1 Vp-p | 1 Vp-p | 1 Vp-p | 1 Vp-p | 1 Vp-p | 1 Vp-p |
| Clock Input | CMOS / LVDS selectable | CMOS / LVDS selectable | CMOS / LVDS selectable | CMOS / LVDS selectable | CMOS / LVDS selectable | CMOS / LVDS selectable |
| Data Output | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR |
| Packaging Carrier | Tape & Reel (TR) | Tray | Tape & Reel (TR) | Tray | Tray | TBD |
أبرز الفروقات
- Higher sampling rate option in same package (مقابلADC0808S250HW-C18)
- Lower-cost drop-in alternative in tray packaging (مقابلADC0808S125HW-C1)
- Dual CMOS/LVDS clock and output flexibility (مقابلADC0808S125HW/C1 (NXP cross-reference))
ملاحظات التصميم
The ADC0808S125HW-C19 requires separate analog (AVDD = 3.3 V) and digital (DVDD/DRVDD = 1.8 V) supply rails to minimize switching-noise coupling into the analog input. Decouple each supply pin with a 100 nF ceramic capacitor placed as close as possible to the IC, plus a 10 uF bulk capacitor at the regulator output. Estimated: total power dissipation at 125 MSPS is approximately 400 mW; an exposed-pad ground plane is required to keep junction temperature within the -40 C to +85 C industrial range.
The exposed thermal pad of the 48-HTQFP package must be soldered to a continuous ground plane using an array of thermal vias for low thermal impedance. Route differential analog input traces (AIN+, AIN-) as a matched pair with 100 ohm differential impedance, and keep them away from digital output traces (D0-D7, DCLK) to avoid digital switching-noise coupling. Use a ground guard ring around the analog input traces to further isolate them from digital return currents.
The differential analog input must be biased at the common-mode voltage specified in the datasheet, typically achieved by AC-coupling the input through a transformer or capacitor network with a bias-tee to VCM. Apply a common-mode choke on the analog input traces if the source is electrically noisy. For LVDS DDR clock and data, route 100 ohm differential transmission lines with controlled impedance and length-matching within 1 mm to preserve timing margins.
Do not exceed 250 MHz on the clock input - the ADC's dynamic performance degrades above its maximum rated sampling rate. The CLKSEL and OUTSEL pins must be tied to DRVDD or DGND through 10 kohm resistors; floating these pins results in undefined CMOS/LVDS mode behavior. The exposed pad must be soldered; omitting it causes thermal runaway and excessive ground inductance that degrades ENOB. The internal 1.25 V reference must be bypassed with a 100 nF capacitor at the VREF pin to achieve datasheet ENOB.
معلومات الامتثال
RoHS compliant per Renesas product page. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Lead-free reflow compatible per JEDEC J-STD-020.
