ATSAM4SD16CA-CUR - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
MPN: ATSAM4SD16CA-CUR ✓ نشطATSAM4SD16CA-CUR نظرة عامة
What is a Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit RISC processor core designed by ARM for deterministic embedded applications, featuring a single-precision FPU, DSP extensions, and low interrupt latency. It sits within the broader taxonomy of microcontroller -> 32-bit MCU -> ARM Cortex-M family -> Cortex-M4 sub-family, and is widely used in industrial, consumer, and connectivity applications where both signal-processing performance and low power are required.
Key features include 1 MB embedded Flash organised as dual-bank 512 KB for in-application programming, 160 KB SRAM with optional battery backup domain, a high-speed MultiMedia Card Interface (HSMCI) for SD cards, and an Embedded Trace Macrocell (ETM) for real-time instruction trace. The device operates from 1.62 V to 3.6 V and is qualified for the industrial temperature range (-40 °C to +85 °C).
Architecturally, the SAM4SD16 uses a 3-layer AHB/LPB bus matrix that allows simultaneous peripheral and SRAM access without contention, plus a Peripheral DMA controller (PDC) that offloads memory transfers from the CPU. The integrated FPU delivers single-cycle MAC operations, enabling audio codecs, sensor-fusion algorithms, and small FFT workloads to run on the MCU itself.
Typical applications include industrial PLCs and motor-control front ends, USB peripherals and human-interface devices, smart energy and metering, medical instrumentation, and consumer audio products. The dual-bank Flash and bootloader (SAM-BA) support secure field upgrades, which is important for long-life industrial deployments.
When designing with this part, allocate the 100-ball TFBGA footprint carefully: it requires microvia-compatible PCB stack-ups and proper thermal copper under the array. Power-supply decoupling must include a 100 nF cap per VDD pin and a bulk 4.7 µF near the regulator, as recommended in the SAM4S datasheet.
This page synthesises distributor pricing, drop-in same-package alternatives, comparison data, and practical PCB design notes not found in the manufacturer datasheet alone, helping engineers evaluate second-source options and accelerate their design-in decisions.
بدائل مباشرة لـ ATSAM4SD16CA-CUR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ATSAM4SD16CA-CUR (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Operating Temperature, Mounting Type, Core Architecture.
ATSAM4SD16CA-CU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S16CA-CU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SA16CA-AUR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4S8CA-CFUR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SD16BB-MN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SD16BA-MU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAM4SD16CA-CUR الحدود القصوى والخصائص الكهربائية
| Core Architecture | ARM Cortex-M4 with FPU |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| العلبة | 100-TFBGA (9 x 9 mm) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| I/O Voltage | 1.62 V to 3.6 V |
| درجة حرارة التشغيل | -40 °C to +85 °C (Industrial) |
| Communication Interfaces | USB 2.0 Full-Speed, 2 x CAN, USART/UART, SPI, TWI (I²C), HSMCI |
| ADC | 12-bit, up to 24 channels |
| PWM / Timer | 16-bit, multi-channel |
| DMA | Peripheral DMA Controller (PDC) |
| Trace | Embedded Trace Macrocell (ETM) + SWD |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Compliant |
| مستوى MSL | MSL3 (per JEDEC J-STD-020) |
دليل تكوين أطراف ATSAM4SD16CA-CUR 100-tfbga (9 x 9 mm)
تكوين الأطراف لـ ATSAM4SD16CA-CUR (حزمة 100-tfbga (9 x 9 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ ATSAM4SD16CA-CUR.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
ATSAM4SD16CA-CUR مناسب لـ 7 التطبيقs: Industrial Motor Control and PLC Front End, USB Peripherals and HID Devices, Smart Energy and Metering, Medical Instrumentation and Patient Monitors, Consumer Audio and Wireless Headsets, Industrial Gateways and CAN-FD Bridges, Automotive Body and HMI Modules.
Industrial Motor Control and PLC Front End
The ATSAM4SD16CA-CUR fits industrial motor control because it integrates two CAN 2.0B controllers, a 12-bit 1 Msps ADC, and a 16-bit multi-channel PWM block on a single 120 MHz Cortex-M4 die. The FPU executes field-oriented control (FOC) loops in <10 µs, while the dual-bank 1 MB Flash enables safe in-field firmware upgrades without bricking the PLC. Place the device on a 100-TFBGA footprint with a 4-layer FR4 PCB, decouple each VDD pin with 100 nF X7R, and add a 4.7 µF bulk cap; the same part can drive both AC induction and BLDC motors.
موصى به
USB Peripherals and HID Devices
For USB keyboards, mice, custom HID, and CDC-class peripherals, the ATSAM4SD16CA-CUR provides an integrated USB 2.0 Full-Speed (12 Mbps) controller with on-chip transceiver, eliminating the need for an external PHY and saving BOM cost. The 1 MB Flash accommodates USB class drivers plus application code, while 160 KB SRAM buffers USB packets comfortably. Configure D+ with a 1.5 kΩ pull-up to VDDIO to signal full-speed device mode, and use the SAM-BA bootloader on UART or USB for field updates.
موصى به
Smart Energy and Metering
Smart electricity meters and sub-metering gateways require deterministic processing of ADC samples and isolated communication. The ATSAM4SD16CA-CUR's 120 MHz Cortex-M4 with FPU computes RMS power and harmonics on each AC cycle, while the dual-bank Flash supports secure OTA tariff updates from the utility. The two CAN interfaces connect to in-home energy buses (e.g. CANopen), and the HSMCI port accepts an SD card for data logging up to 32 GB.
موصى به
Medical Instrumentation and Patient Monitors
The ATSAM4SD16CA-CUR's Cortex-M4 with FPU runs DSP-style signal-processing algorithms for ECG, SpO2, and pulse-oximetry front ends, while the wide 1.62 V to 3.6 V supply range simplifies battery management on 2x AA or Li-ion packs. Industrial temperature grade (-40 °C to +85 °C) supports equipment deployed in clinical and field environments. Pair with the on-board 12-bit ADC plus an external 24-bit sigma-delta for high-resolution bio-signal acquisition, and use the USB port for data download to a PC.
موصى به
Consumer Audio and Wireless Headsets
Audio applications benefit from the ATSAM4SD16CA-CUR's Cortex-M4 FPU, which can run low-latency codecs such as SBC, AAC, or proprietary DSP voice enhancement in real time. The I²S interface (driven through TWI/SPI peripherals with external codec) connects to Class-D amplifiers, while the 160 KB SRAM holds 44.1 kHz audio buffers with headroom. Power consumption is well controlled through the SAM4S sleep modes (e.g. Wait mode at ~10 µA), extending battery life in portable audio products.
موصى به
Industrial Gateways and CAN-FD Bridges
The ATSAM4SD16CA-CUR is well suited as a CAN-to-Ethernet or CAN-to-USB bridge for industrial gateways, with two independent CAN controllers plus USB and Ethernet MAC available through peripherals. The 1 MB Flash accommodates TCP/IP stacks (e.g. lwIP) and protocol-conversion firmware, while 160 KB SRAM buffers network packets. Place an external Ethernet PHY on RMII for full gateway capability; for smaller bridges, drop in the ATSAM4S8CA-CFUR with 512 KB Flash and 128 KB SRAM (70% parametric match).
موصى به
Automotive Body and HMI Modules
Although the ATSAM4SD16CA-CUR is industrial-grade rather than AEC-Q100 qualified, it is widely used in non-safety automotive body modules such as climate-control HMI, lighting controllers, and seat-adjustment keypads. The dual CAN interfaces connect to vehicle body networks, while the 12-bit ADC reads potentiometers and thermistors. Pair with external CAN transceivers (e.g. MCP2551) and a switching regulator for 12V battery operation; choose the ATSAM4S16CA-CU single-bank variant for cost-sensitive HMI nodes.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ATSAM4SD16CA-CUR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ATSAM4SD16CA-CU | ATSAM4S16CA-CU | ATSAM4SA16CA-AUR | ATSAM4S8CA-CFUR | ATSAM4SD16BB-MN |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Max CPU Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB (2 x 512 KB dual-bank) | 1 MB (2 x 512 KB dual-bank) | 1 MB (single-bank) | 1 MB (single-bank) | 512 KB (single-bank) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB | 160 KB | 128 KB | 128 KB | 128 KB | 160 KB |
| CAN Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| USB 2.0 Interface | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host | Full-Speed Device/Host |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Silicon Revision | A | A | A | A | A | B (recommended for new designs) |
أبرز الفروقات
- Dual-bank 1 MB Flash for in-application firmware updates (مقابلATSAM4S16CA-CU)
- Higher SRAM (160 KB vs 128 KB) for data buffers and stacks (مقابلATSAM4SA16CA-AUR)
- Revision B silicon available as drop-in upgrade (مقابلATSAM4SD16BB-MN)
ملاحظات التصميم
The 100-TFBGA package at 9x9 mm requires a PCB stack-up with microvias (0.1 mm laser-drilled) or via-in-pad to escape the inner rows of balls. Recommended: 4-layer FR4 with 0.5 oz copper, 0.2 mm via pitch, and a continuous GND plane under the BGA for both thermal dissipation and return-path integrity. Place 100 nF X7R decoupling caps on every VDD pin within 2 mm of the ball, plus one 4.7 µF bulk capacitor near the voltage regulator output (per SAM4S datasheet power-supply section).
Power the ATSAM4SD16CA-CUR from a low-noise LDO such as MCP1700 or a small DC-DC followed by an LDO, especially when the analog peripherals (12-bit ADC) are used. The internal 1.2 V core LDO requires that VDDIN and VDDCORE pins both be supplied; connect a 1 µF + 100 nF pair on VDDCORE. Avoid switching-noise on VDDIN exceeding 50 mV ripple, as it can degrade ADC SNR by 3-5 dB.
Do not assume the boot mode after reset defaults to Flash execution; the ATSAM4SD16CA-CUR samples the BMS (Boot Mode Select) pin at NRST release. Tie BMS to GND for normal Flash boot, or pull high to enter SAM-BA bootloader on USB or UART0. Also, on dual-bank parts, the GPNVM bits control whether the second bank is visible - configure them in the startup code, otherwise firmware linking may exceed 512 KB and overflow silently.
Estimated: At full CPU load (120 MHz, all peripherals active, 3.3 V VDD), the ATSAM4SD16CA-CUR consumes approximately 100 mW. With the 100-TFBGA theta_JA of ~35 °C/W on a 4-layer JEDEC test board, junction temperature rise above ambient is ~3.5 °C - well within the -40 °C to +85 °C industrial range. For sealed enclosures with no airflow, derate by 20% to keep Tj below 110 °C.
معلومات الامتثال
RoHS compliant per Microchip product page; industrial temperature grade -40 °C to +85 °C. NOT AEC-Q100 qualified - this is an industrial-grade part; for automotive safety applications use SAM V71/SAM S70 or similar AEC-Q100 qualified variants.
