ATSAME70N21B-CNT - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
MPN: ATSAME70N21B-CNT ✓ نشطATSAME70N21B-CNT نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for code and SRAM for data), peripherals, and I/O into one package. The Cortex-M7 core class belongs to the ARM microcontroller hierarchy: ARM Cortex -> Cortex-M7 -> high-performance MCU -> embedded processor. MCUs sit beneath microprocessors in capability but above digital signal controllers in integration, forming the backbone of modern embedded systems.
Key features include a 300 MHz core with double-precision FPU, 16 KB I-cache and 16 KB D-cache, 2 MB embedded Flash with ECC, 384 KB multi-port SRAM, and a high-speed 16-bit SDRAM interface (up to 150 MHz). Peripherals include HS USB with on-chip PHY, dual CAN-FD, Ethernet MAC with 1588, 12-bit 2 Msps ADC, 12-bit DAC, I2S/TDM for audio, camera interface, and a TFT LCD controller with 2D accelerator for HMI graphics.
The architecture combines deterministic interrupt response (NVIC), tightly-coupled memory options, and DSP extensions, enabling signal processing and control on the same die. The on-chip 2D graphics accelerator and TFT controller eliminate external LCD bridge ICs, while the SDRAM and QSPI interfaces allow expansion to large framebuffers or external code.
Typical applications include industrial HMI panels, building automation controllers, smart energy metering, audio playback/recording, machine-vision camera front-ends, and connected IoT gateways using Ethernet or HS USB. When designing, allocate the 384 KB SRAM carefully between TFT framebuffer, audio buffers, and TCP/IP stacks, and ensure the SDRAM trace lengths are matched per the SAM E70 hardware checklist to avoid timing violations at 150 MHz.
بدائل مباشرة لـ ATSAME70N21B-CNT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ATSAME70N21B-CNT (نفس عامل الشكل والبصمة) — يختلف في Package, Mounting Type, SRAM, Ethernet, USB.
ATSAME70N21B-CN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME70N21A-CNT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME70N20A-CNT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAMS70N21B-CNT
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
ATSAME70N21B-ANT
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
ATSAMV71N21B-CNT
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
ATSAME70J21A-ANT
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME70N21B-CNT الحدود القصوى والخصائص الكهربائية
| Core Architecture | ARM Cortex-M7 with FPU |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 384 KB multi-port |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| العلبة | 100-pin TFBGA (9x9 mm) |
| Operating Voltage | 1.62 V to 3.6 V |
| Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| درجة حرارة التشغيل | -40C to +105C (industrial) |
| ADC | 12-bit, up to 2 Msps |
| DAC | 12-bit, dual-channel |
| USB | USB 2.0 High-Speed with on-chip PHY |
| Ethernet | 10/100 MAC with IEEE 1588 |
| CAN | 2x CAN-FD controllers |
| External Bus Interface | 16-bit SDRAM up to 150 MHz |
| Display Controller | TFT LCD with 2D graphics accelerator |
| حالة RoHS | Compliant |
تكوين أطراف ATSAME70N21B-CNT
| دبوس A1 | VDDIO — Digital I/O supply voltage |
| دبوس A2 | PB0 — GPIO / CAN0 RX |
| دبوس A3 | PB1 — GPIO / CAN0 TX |
| دبوس A4 | PB2 — GPIO / CAN1 RX |
| دبوس A5 | PB3 — GPIO / CAN1 TX |
| دبوس A6 | VDDCORE — Core voltage (1.2 V typical) |
| دبوس A7 | VSS — Ground |
| دبوس A8 | PA0 — GPIO / WKUP0 |
| دبوس A9 | PA1 — GPIO / WKUP1 |
| دبوس A10 | PA2 — GPIO |
| دبوس B1 | VDDIO — Digital I/O supply voltage |
| دبوس B2 | PB4 — GPIO / TC0 channel 0 |
| دبوس B3 | PB5 — GPIO / TC0 channel 1 |
| دبوس B4 | PB6 — GPIO / TC1 channel 0 |
| دبوس B5 | PB7 — GPIO / TC1 channel 1 |
| دبوس B6 | PB8 — GPIO |
| دبوس B7 | PB9 — GPIO |
| دبوس B8 | PA3 — GPIO |
| دبوس B9 | PA4 — GPIO |
| دبوس B10 | PA5 — GPIO |
| دبوس C1 | VSS — Ground |
| دبوس C2 | PC0 — GPIO / LCD VSYNC |
| دبوس C3 | PC1 — GPIO / LCD HSYNC |
| دبوس C4 | PC2 — GPIO / LCD DOTCLK |
| دبوس C5 | PC3 — GPIO / LCD DEN |
| دبوس C6 | PC4 — GPIO / LCD DATA0 |
| دبوس C7 | PC5 — GPIO / LCD DATA1 |
| دبوس C8 | PA6 — GPIO |
| دبوس C9 | PA7 — GPIO |
| دبوس C10 | PA8 — GPIO |
| دبوس D1 | VDDIO — Digital I/O supply voltage |
| دبوس D2 | PC6 — GPIO / LCD DATA2 |
| دبوس D3 | PC7 — GPIO / LCD DATA3 |
| دبوس D4 | PC8 — GPIO / LCD DATA4 |
| دبوس D5 | PC9 — GPIO / LCD DATA5 |
| دبوس D6 | PC10 — GPIO / LCD DATA6 |
| دبوس D7 | PC11 — GPIO / LCD DATA7 |
| دبوس D8 | PC12 — GPIO / LCD DATA8 |
| دبوس D9 | PA9 — GPIO / URXD0 |
| دبوس D10 | PA10 — GPIO / UTXD0 |
| دبوس E1 | VSS — Ground |
| دبوس E2 | PC13 — GPIO / LCD DATA9 |
| دبوس E3 | PC14 — GPIO / LCD DATA10 |
| دبوس E4 | PC15 — GPIO / LCD DATA11 |
| دبوس E5 | PC16 — GPIO / LCD DATA12 |
| دبوس E6 | PC17 — GPIO / LCD DATA13 |
| دبوس E7 | PC18 — GPIO / LCD DATA14 |
| دبوس E8 | PC19 — GPIO / LCD DATA15 |
| دبوس E9 | PA11 — GPIO / UOTG_ID |
| دبوس E10 | PA12 — GPIO / UOTG_VBUS |
| دبوس F1 | VDDIO — Digital I/O supply voltage |
| دبوس F2 | PC20 — GPIO / LCD DATA16 |
| دبوس F3 | PC21 — GPIO / LCD DATA17 |
| دبوس F4 | PC22 — GPIO / LCD DATA18 |
| دبوس F5 | PC23 — GPIO / LCD DATA19 |
| دبوس F6 | PC24 — GPIO / LCD DATA20 |
| دبوس F7 | PC25 — GPIO / LCD DATA21 |
| دبوس F8 | PC26 — GPIO / LCD DATA22 |
| دبوس F9 | PC27 — GPIO / LCD DATA23 |
| دبوس F10 | PA13 — GPIO / UOTG_DP |
| دبوس G1 | VSS — Ground |
| دبوس G2 | PC28 — GPIO |
| دبوس G3 | PC29 — GPIO |
| دبوس G4 | PC30 — GPIO |
| دبوس G5 | PC31 — GPIO |
| دبوس G6 | PD0 — GPIO |
| دبوس G7 | PD1 — GPIO |
| دبوس G8 | PD2 — GPIO |
| دبوس G9 | PD3 — GPIO |
| دبوس G10 | PA14 — GPIO / UOTG_DM |
| دبوس H1 | VDDIO — Digital I/O supply voltage |
| دبوس H2 | PD4 — GPIO |
| دبوس H3 | PD5 — GPIO |
| دبوس H4 | PD6 — GPIO |
| دبوس H5 | PD7 — GPIO |
| دبوس H6 | PD8 — GPIO |
| دبوس H7 | PD9 — GPIO |
| دبوس H8 | PD10 — GPIO |
| دبوس H9 | PA15 — GPIO |
| دبوس H10 | PA16 — GPIO |
| دبوس J1 | VSS — Ground |
| دبوس J2 | PD11 — GPIO |
| دبوس J3 | PD12 — GPIO |
| دبوس J4 | PD13 — GPIO |
| دبوس J5 | PD14 — GPIO |
| دبوس J6 | PD15 — GPIO |
| دبوس J7 | PD16 — GPIO |
| دبوس J8 | PD17 — GPIO |
| دبوس J9 | PD18 — GPIO |
| دبوس J10 | PA17 — GPIO |
| دبوس K1 | VDDIO — Digital I/O supply voltage |
| دبوس K2 | PD19 — GPIO |
| دبوس K3 | PD20 — GPIO |
| دبوس K4 | PD21 — GPIO |
| دبوس K5 | PD22 — GPIO |
| دبوس K6 | PD23 — GPIO |
| دبوس K7 | PD24 — GPIO |
| دبوس K8 | PD25 — GPIO |
| دبوس K9 | PD26 — GPIO |
| دبوس K10 | PA18 — GPIO |
التطبيقات النموذجية
ATSAME70N21B-CNT مناسب لـ 6 التطبيقs: Industrial HMI Control Panels, Building Automation Controllers, Smart Energy Metering, Audio Playback and Recording Systems, Machine Vision Camera Front-Ends, Connected IoT Gateways.
Industrial HMI Control Panels
The ATSAME70N21B-CNT's 300 MHz Cortex-M7 core, 384 KB multi-port SRAM, and integrated TFT LCD controller with 2D graphics accelerator make it an excellent fit for industrial HMI panels up to 5-7 inch WVGA. The hardware 2D accelerator offloads fill, copy, blending, and chroma-key operations from the CPU, freeing the Cortex-M7 for control loop and protocol processing. The 16-bit SDRAM interface at 150 MHz provides ample bandwidth for double-buffered framebuffers without CPU intervention. Compared to adding an external LCD bridge IC, the integrated solution reduces BOM cost, PCB area, and BOM risk. The 1.62 V to 3.6 V supply range tolerates industrial 24 V->5 V->3.3 V power trees typical in factory automation panels.
موصى به
Building Automation Controllers
The ATSAME70N21B-CNT suits BACnet, Modbus TCP, and KNX building automation controllers because of its 10/100 Ethernet MAC with IEEE 1588 hardware timestamping, dual CAN-FD for HVAC and lighting subnets, and HS USB for commissioning. The IEEE 1588 timestamp unit delivers sub-microsecond synchronization accuracy without software compensation, meeting strict building automation timing requirements. The 384 KB SRAM accommodates TCP/IP stacks plus BACnet/IP object libraries without external memory, reducing BOM. Operating from -40C to +105C, the part handles unheated equipment rooms and rooftop enclosures. The dual-bank Flash enables safe OTA firmware updates required for 24/7 building systems where downtime is unacceptable.
موصى به
Smart Energy Metering
The ATSAME70N21B-CNT's dual 12-bit 2 Msps ADC paired with the Cortex-M7's DSP extensions enables accurate single-phase or three-phase energy metering with Class 0.5 or better accuracy. The FPU accelerates real-time FFT, RMS, and harmonic analysis computations that are essential for power-quality monitoring. The on-chip 12-bit DAC supports calibration and analog signal generation. With 384 KB SRAM and 2 MB Flash, the device can host metering firmware, communication stacks (DLMS/COSEM, Modbus), and a TFT display driver for in-home display units. The wide 1.62 V to 3.6 V supply tolerates direct connection to battery-backed metering rails, simplifying the analog front-end power tree.
موصى به
Audio Playback and Recording Systems
The ATSAME70N21B-CNT's I2S/TDM interface, dual 12-bit DAC, and 12-bit ADC at 2 Msps make it suitable for networked audio playback appliances, professional intercoms, and audio recording front-ends. The Cortex-M7 DSP extensions accelerate audio codecs such as MP3, AAC, and Opus without external DSP silicon, while the 384 KB SRAM holds multi-buffered audio streams. The HS USB with on-chip PHY and Ethernet MAC enable streaming from USB sticks or networked sources. Operating from a single 3.3 V supply and integrating a PLL, the device reduces external component count in audio products where PCB space is at a premium, such as ceiling-mount speakers and rack-mount recording gear.
موصى به
Machine Vision Camera Front-Ends
The ATSAMV71N21B-CNT (V71 variant) and ATSAME70N21B-CNT together support machine-vision camera front-ends requiring high-throughput image capture, preprocessing, and network transmission. The Cortex-M7 at 300 MHz executes image preprocessing kernels in software thanks to its DSP extensions and FPU, while the dedicated image sensor interface (V71) or HS USB (E70) handles pixel streaming. The 2 MB Flash stores reference patterns and calibration tables, and the 384 KB SRAM buffers intermediate image data. The Ethernet MAC with IEEE 1588 enables PTP-synchronized multi-camera arrays, critical for industrial inspection lines. The wide operating temperature range supports factory floor deployment without additional thermal management.
موصى به
Connected IoT Gateways
The ATSAME70N21B-CNT serves as the main processor in industrial IoT gateways that aggregate sensor data over CAN-FD, RS-485, I2C, or SPI and forward it via Ethernet, Wi-Fi, or cellular modems over HS USB. The dual CAN-FD controllers connect directly to vehicle, solar, or motor networks, while the 16-bit SDRAM interface supports protocol buffer pools for MQTT, OPC-UA, or custom TCP stacks. The Cortex-M7's deterministic interrupt response guarantees protocol timing even under heavy network load. With 384 KB SRAM, the device runs a real-time OS such as FreeRTOS or Zephyr with full networking stacks, and the 2 MB dual-bank Flash supports secure OTA firmware updates for remote-managed deployments.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ATSAME70N21B-CNT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ATSAME70N21B-CN | ATSAME70N21A-CNT | ATSAME70N20A-CNT | ATSAMS70N21B-CNT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) |
| Core | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Max Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | 10/100 with IEEE 1588 | Not present |
| TFT LCD Controller | Yes with 2D accelerator | Yes with 2D accelerator | Yes with 2D accelerator | Yes with 2D accelerator | Not present |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
أبرز الفروقات
- Largest Flash in SAM E70 family in 100-TFBGA package (مقابلATSAME70N20A-CNT)
- Adds Ethernet MAC and TFT LCD controller versus SAM S70 (مقابلATSAMS70N21B-CNT)
- Pin-to-pin compatible silicon revisions for migration (مقابلATSAME70N21A-CNT)
ملاحظات التصميم
The ATSAME70N21B-CNT requires separate VDDCORE and VDDIO rails: VDDCORE is typically 1.2 V supplied by the internal regulator from a single 3.3 V source, or externally regulated for best noise performance. Place 100 nF decoupling capacitors adjacent to every VDD/VSS pair on the 100-pin TFBGA, and add 4.7 uF bulk capacitors near the VDDCORE and VDDIO balls. The analog supply VDDANA must be filtered with a ferrite bead from VDDIO to keep ADC SNR above 70 dB. Estimated: based on 300 MHz operation across the full -40C to +105C range, core current peaks around 80 mA; provide at least 150 mA headroom in the regulator selection.
The 100-ball TFBGA 9x9 mm package requires a 4-layer PCB minimum with continuous ground and power planes under the BGA for thermal dissipation and signal integrity. Route SDRAM signals on the top layer with matched trace lengths per the SAM E70 hardware checklist; length matching within +/- 25 mils is required for the 150 MHz 16-bit SDRAM interface. Place the 32.768 kHz crystal within 5 mm of the XIN32/XOUT32 pins and guard it with a ground ring to reduce RTC jitter. Estimated: SDRAM trace length matching tolerance is derived from the SAM E70 datasheet section on EBI timing.
Do not enable both Ethernet and HS USB PHYs simultaneously without verifying PCB stackup and decoupling; both high-speed interfaces share analog supply rails and require a solid ground plane to prevent crosstalk. Ensure the NRST pin has a 10 kohm pull-up and a 100 nF capacitor to ground per the reference design - missing reset components cause intermittent boot failures. Avoid routing any high-frequency signal (SDRAM, USB) across the BGA diagonally, as the via stubs degrade signal integrity at 150 MHz. Always program the GPNVM bits for Flash plane selection during initial firmware bring-up to avoid boot-mode lockouts.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the SAM E70 family targets industrial and consumer markets, not automotive. For AEC-Q100 alternatives consult Microchip's automotive MCU families.