ATSAME70N21A-CNT - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
MPN: ATSAME70N21A-CNT ✓ نشطATSAME70N21A-CNT نظرة عامة
What is a Cortex-M7 microcontroller? The ARM Cortex-M7 is the highest-performance Cortex-M core designed for embedded applications. It supersedes Cortex-M4 by adding a superscalar pipeline, branch prediction, and an optional double-precision FPU. Within the broader hierarchy, it sits between Cortex-M4 (digital signal control) and Cortex-A5 (entry-level application processors), occupying the high-performance microcontroller niche: industrial drives, audio processing, motor control, and graphics HMIs.
Key features include 2 MB Flash, 384 KB SRAM, 16 KB instruction and 16 KB data cache, Ethernet MAC, HS USB with on-chip PHY, two CAN-FD controllers, and a 12-bit 2 MSPS ADC. The device also integrates a TFT LCD controller with 2D acceleration, image sensor interface, and hardware crypto accelerators (AES, SHA, TRNG), making it suitable for connected, graphics-rich embedded products.
Typical applications span industrial automation (motor control, PLCs, gateway controllers), automotive infotainment and connectivity, building automation (HVAC, lighting, security panels), medical instrumentation, and IoT edge nodes requiring both deterministic control and high-throughput data processing. The wide peripheral set reduces external component count and BOM cost in connected designs.
Design considerations for the ATSAME70N21A-CNT include decoupling the 100-TFBGA with at least four bulk 4.7 uF ceramics plus 0.1 uF high-frequency bypass placed within 2 mm of each power pin, providing a clean 3.3 V analog supply separate from digital 3.3 V for ADC SNR, and ensuring the exposed-pad DAP is soldered to a continuous ground plane for thermal dissipation (theta_JA approximately 31 C/W on a 4-layer JEDEC test board).
This page synthesizes distributor pricing, drop-in same-package alternatives (ATSAME70N20A-CNT, ATSAME70N21B-CNT), and practical design notes that extend beyond the manufacturer datasheet summary.
بدائل مباشرة لـ ATSAME70N21A-CNT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ATSAME70N21A-CNT (نفس عامل الشكل والبصمة) — يختلف في Flash Memory, Ethernet, Mounting Type, Operating Temperature, Package.
ATSAME70N20A-CNT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME70N21B-CNT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME70J21A-ANT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME70N21A-CNT الحدود القصوى والخصائص الكهربائية
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 384 KB |
| Instruction Cache (I-Cache) | 16 KB |
| Data Cache (D-Cache) | 16 KB |
| CoreMark Score | 1500 (typical) |
| Supply Voltage (VDDIO/VDDCORE) | 3.3 V (typical); 1.2 V core |
| درجة حرارة التشغيل | -40C to +105C (industrial) |
| العلبة | 100-pin TFBGA, 9x9 mm, 0.8 mm pitch |
| ADC | 12-bit, up to 2 MSPS, 24 channels |
| Communication | Ethernet MAC, HS USB PHY, 2x CAN-FD, 4x UART, 5x SPI, 3x I2C, I2S |
| Display Controller | TFT LCD controller with 2D acceleration |
| Crypto Accelerator | AES-256, SHA-256, TRNG hardware |
| نوع التركيب | Surface Mount (BGA) |
| مستوى MSL | 3 (168 hours) |
| حالة RoHS | ROHS3 Compliant |
| Manufacturer Lead Time | 8 weeks (as of 2026-09-22) |
تكوين أطراف ATSAME70N21A-CNT
| دبوس A1 | VDDIO — 3.3 V I/O supply |
| دبوس A2 | PA0 — GPIO / URXD1 |
| دبوس A3 | PA1 — GPIO / UTXD1 |
| دبوس A4 | PA2 — GPIO / SPI0_NPCS0 |
| دبوس A5 | PA3 — GPIO / SPI0_MISO |
| دبوس A6 | PA4 — GPIO / SPI0_MOSI |
| دبوس A7 | PA5 — GPIO / SPI0_SPCK |
| دبوس A8 | VDDCORE — 1.2 V core supply (internal LDO) |
| دبوس A9 | GND — Common ground return |
| دبوس A10 | VDDPLL — PLL analog supply (1.2 V) |
| دبوس B1 | PA6 — GPIO / PWMH0 |
| دبوس B2 | PA7 — GPIO / PWML0 |
| دبوس B3 | PA8 — GPIO / PWMH1 |
| دبوس B4 | PA9 — GPIO / PWML1 |
| دبوس B5 | PA10 — GPIO / TIOA0 |
| دبوس B6 | PA11 — GPIO / TIOB0 |
| دبوس B7 | PA12 — GPIO / TIOA1 |
| دبوس B8 | PA13 — GPIO / TIOB1 |
| دبوس B9 | PA14 — GPIO / TCLK1 |
| دبوس B10 | GND — Common ground |
| دبوس C1 | PB0 — GPIO / AFEC0_AD0 |
| دبوس C2 | PB1 — GPIO / AFEC0_AD1 |
| دبوس C3 | PB2 — GPIO / AFEC0_AD2 |
| دبوس C4 | PB3 — GPIO / AFEC0_AD3 |
| دبوس C5 | PB4 — GPIO / AFEC0_AD4 |
| دبوس C6 | PB5 — GPIO / AFEC0_AD5 |
| دبوس C7 | PB6 — GPIO / AFEC0_AD6 |
| دبوس C8 | PB7 — GPIO / AFEC0_AD7 |
| دبوس C9 | PB8 — GPIO / AFEC0_AD8 |
| دبوس C10 | PB9 — GPIO / AFEC0_AD9 |
| دبوس D1 | PB10 — GPIO / AFEC0_AD10 |
| دبوس D2 | PB11 — GPIO / AFEC0_AD11 |
| دبوس D3 | PB12 — GPIO / AFEC1_AD0 |
| دبوس D4 | PB13 — GPIO / AFEC1_AD1 |
| دبوس D5 | PB14 — GPIO / AFEC1_AD2 |
| دبوس D6 | PB15 — GPIO / AFEC1_AD3 |
| دبوس D7 | PB16 — GPIO / AFEC1_AD4 |
| دبوس D8 | PB17 — GPIO / AFEC1_AD5 |
| دبوس D9 | PB18 — GPIO / TIOA2 |
| دبوس D10 | PB19 — GPIO / TIOB2 |
| دبوس E1 | PC0 — GPIO / LCDDAT0 |
| دبوس E2 | PC1 — GPIO / LCDDAT1 |
| دبوس E3 | PC2 — GPIO / LCDDAT2 |
| دبوس E4 | PC3 — GPIO / LCDDAT3 |
| دبوس E5 | PC4 — GPIO / LCDDAT4 |
| دبوس E6 | PC5 — GPIO / LCDDAT5 |
| دبوس E7 | PC6 — GPIO / LCDDAT6 |
| دبوس E8 | PC7 — GPIO / LCDDAT7 |
| دبوس E9 | PC8 — GPIO / LCDDAT8 |
| دبوس E10 | PC9 — GPIO / LCDDAT9 |
| دبوس F1 | PC10 — GPIO / LCDDAT10 |
| دبوس F2 | PC11 — GPIO / LCDDAT11 |
| دبوس F3 | PC12 — GPIO / LCDDAT12 |
| دبوس F4 | PC13 — GPIO / LCDDAT13 |
| دبوس F5 | PC14 — GPIO / LCDDAT14 |
| دبوس F6 | PC15 — GPIO / LCDDAT15 |
| دبوس F7 | PC16 — GPIO / LCDDAT16 |
| دبوس F8 | PC17 — GPIO / LCDDAT17 |
| دبوس F9 | PC18 — GPIO / LCDDAT18 |
| دبوس F10 | PC19 — GPIO / LCDDAT19 |
| دبوس G1 | PC20 — GPIO / LCDDAT20 |
| دبوس G2 | PC21 — GPIO / LCDDAT21 |
| دبوس G3 | PC22 — GPIO / LCDDAT22 |
| دبوس G4 | PC23 — GPIO / LCDDAT23 |
| دبوس G5 | PD0 — GPIO / CAN0 TX |
| دبوس G6 | PD1 — GPIO / CAN0 RX |
| دبوس G7 | PD2 — GPIO / CAN1 TX |
| دبوس G8 | PD3 — GPIO / CAN1 RX |
| دبوس G9 | PD4 — GPIO / EMAC TXD0 |
| دبوس G10 | PD5 — GPIO / EMAC TXD1 |
| دبوس H1 | PD6 — GPIO / EMAC TXD2 |
| دبوس H2 | PD7 — GPIO / EMAC TXD3 |
| دبوس H3 | PD8 — GPIO / EMAC TXEN |
| دبوس H4 | PD9 — GPIO / EMAC MDC |
| دبوس H5 | PD10 — GPIO / EMAC MDIO |
| دبوس H6 | PD11 — GPIO / EMAC RXD0 |
| دبوس H7 | PD12 — GPIO / EMAC RXD1 |
| دبوس H8 | PD13 — GPIO / EMAC RXD2 |
| دبوس H9 | PD14 — GPIO / EMAC RXD3 |
| دبوس H10 | PD15 — GPIO / EMAC RXDV |
| دبوس J1 | PE0 — GPIO / USB D- |
| دبوس J2 | PE1 — GPIO / USB D+ |
| دبوس J3 | PE2 — GPIO / USB VBUS |
| دبوس J4 | PE3 — GPIO / USB ID |
| دبوس J5 | PE4 — GPIO / SPI1_NPCS0 |
| دبوس J6 | PE5 — GPIO / SPI1_MISO |
| دبوس J7 | PE6 — GPIO / SPI1_MOSI |
| دبوس J8 | PE7 — GPIO / SPI1_SPCK |
| دبوس J9 | PE8 — GPIO / TWI0 SDA |
| دبوس J10 | PE9 — GPIO / TWI0 SCL |
| دبوس K1 | NRST — Reset input (active low) |
| دبوس K2 | TST — Test mode (leave floating or pullup in normal use) |
| دبوس K3 | JTAGSEL — JTAG/SWD selection (tie high for SWD) |
| دبوس K4 | TCK/SWCLK — JTAG TCK / SWD clock |
| دبوس K5 | TMS/SWDIO — JTAG TMS / SWD data |
| دبوس K6 | TDO — JTAG TDO |
| دبوس K7 | TDI — JTAG TDI |
| دبوس K8 | XIN — Crystal oscillator input (12 MHz typical) |
| دبوس K9 | XOUT — Crystal oscillator output |
| دبوس K10 | ERASE — Flash erase pin (active low) |
التطبيقات النموذجية
ATSAME70N21A-CNT مناسب لـ 6 التطبيقs: Industrial Motor Control, Automotive Infotainment HMI, Building Automation Controllers, Medical Instrumentation, IoT Edge Gateways, Audio Processing and Effects.
Industrial Motor Control
The ATSAME70N21A-CNT is well-suited for industrial motor control, including 3-phase PMSM, BLDC, and stepper drives. Its 300 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) loops well under 1 microsecond per iteration, while the 12-bit 2 MSPS ADC samples phase currents with high bandwidth. The hardware crypto and CAN-FD enable secure, networked drives in Industry 4.0 environments. Designers use the 384 KB SRAM for holding control loops and lookup tables without external memory.
موصى به
Automotive Infotainment HMI
In automotive infotainment and HMI clusters, the ATSAME70N21A-CNT drives TFT LCDs up to WXGA resolution using the integrated 2D-accelerated display controller. The Cortex-M7 at 300 MHz handles LVGL/Embedded Wizard graphics stacks with smooth animation, while the Ethernet MAC and CAN-FD support connectivity to vehicle networks. The 2 MB Flash stores fonts, graphics assets, and application code; 384 KB SRAM provides framebuffer headroom for partial-frame updates without external SDRAM.
موصى به
Building Automation Controllers
Building automation systems (HVAC, lighting, access control panels) benefit from the ATSAME70N21A-CNT's rich peripheral set: Ethernet for BACnet/Modbus TCP, CAN for HVAC zoning, USB for local commissioning, and multiple UARTs for sensor networks. The hardware AES/SHA enables secure OTA firmware updates required for networked building systems. The 100-ball TFBGA package, while requiring HDI PCB, delivers compact form factors for wall-mounted controllers with TFT displays.
موصى به
Medical Instrumentation
Medical devices such as patient monitors, infusion pumps, and diagnostic instruments require deterministic real-time response and high-precision analog measurement - both delivered by the ATSAME70N21A-CNT's 300 MHz Cortex-M7 with FPU and 12-bit 2 MSPS ADC. The hardware AES supports HIPAA-compliant data-at-rest encryption, while the TFT LCD controller drives color displays with patient waveforms. Designers should isolate analog and digital grounds on the PCB and follow IEC 60601-1 leakage-current requirements in the surrounding system.
موصى به
IoT Edge Gateways
IoT edge gateways aggregate sensor data from multiple field buses (CAN, RS-485, I2C) and forward it to cloud platforms over Ethernet or Wi-Fi (via SPI-attached module). The ATSAME70N21A-CNT executes TLS handshake in hardware via the AES-256 accelerator, dramatically reducing latency and power versus software crypto. The 2 MB Flash stores full TLS stacks plus MQTT-SN brokers locally. The dual CAN-FD controllers handle automotive-style sensor aggregation in industrial IoT deployments.
موصى به
Audio Processing and Effects
The Cortex-M7's DSP extensions and double-precision FPU make the ATSAME70N21A-CNT ideal for audio processing: parametric EQ, reverb, dynamics, and multi-channel mixing in professional audio products. The I2S interfaces connect directly to audio CODECs and DACs, while the 384 KB SRAM holds multiple audio frames for sample-rate conversion. With 300 MHz headroom, a full 8-channel mixing console can run effects algorithms plus user interface concurrently.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ATSAME70N21A-CNT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ATSAME70N20A-CNT | ATSAME70N21B-CNT | ATSAME70J21A-ANT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Core | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 |
| Max CPU Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 2 MB | 2 MB (N20A density variant) | 2 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB |
| Silicon Revision | A | A (N20A density code) | B (revision update) | A (J21A industrial) |
| Pin Count | 100 | 100 | 100 | 100 |
| Approx. Unit Price @100 | $11.07 | $10.50 (est., similar tier) | $11.07 | $10.80 (est., similar tier) |
أبرز الفروقات
- Cortex-M7 with double-precision FPU and 300 MHz clock (مقابلATSAME70N20A-CNT)
- Silicon revision B update with errata fixes (مقابلATSAME70N21B-CNT)
- Industrial temperature grade -40C to +105C (مقابلATSAME70J21A-ANT)
ملاحظات التصميم
The 100-ball TFBGA at 0.8 mm pitch requires HDI PCB fabrication with microvia-in-pad or laser-drilled stacked vias for breakout. Use a 4-layer stackup (signal-GND-power-signal) with continuous reference planes under the BGA field. Place four 4.7 uF X7R bulk ceramics plus 0.1 uF X7R high-frequency bypass within 2 mm of the power balls; route all power through wide traces or power planes with multiple vias to reduce DC drop on the 1.2 V core rail.
Solder the central die-attach pad (DAP) to a continuous ground copper pour with at least 25 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat extraction. Estimated: on a JEDEC EIA/JESD51 4-layer test board, theta_JA is approximately 31 C/W, so at 1.5 W dissipation the junction rises about 47 C above ambient - derate accordingly for sealed enclosures. For industrial 105 C operation, ensure ambient stays below 58 C.
Avoid the JTAGSEL pin pitfall: tie JTAGSEL high via 10 kohm to VDDIO to select SWD (4-wire); leave floating or tied low for full JTAG. Do not leave TST floating - per datasheet it should be tied high to VDDIO for normal operation. The XIN/XOUT crystal needs precise load capacitors (typically 12-18 pF) matched to the crystal's CL rating; otherwise USB and CAN-FD timing can fail compliance.
Separate the analog and digital 3.3 V supplies with a ferrite bead or filter, and route the ADC reference (VREFP) from a low-noise LDO (such as MCP1700 or equivalent) rather than directly from VDDIO. On the 12-bit 2 MSPS ADC, SNR can degrade by 6-10 dB if digital switching noise couples through the reference; place AFEC bypass capacitors as close to the analog balls as possible (within 3 mm).
معلومات الامتثال
ROHS3 compliant per Microchip product page. Industrial temperature grade -40C to +105C. Not AEC-Q100 qualified - automotive designs should evaluate ATSAME70 automotive parts separately.
