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CXMT

CXDB5CCAM-MK - LPDDR4X SDRAM 8Gb | CXMT | Mobile & AI

MPN: CXDB5CCAM-MK ✓ نشط
متوفر يُشحن خلال 1-3 أيام عمل
1.1 V Vdss BGA200 Package LPDDR4X SDRAM Memory
من $54.0909 USD / وحدة
الحد الأدنى للطلب: 1 |
تم تحديث السعر: 2026-08-21
تسعير الكميات
الكمية سعر الوحدة الإجمالي
1 $92.7273 $92.73
10 $66.9697 $669.70
100 $59.2424 $5,924.24
500 $56.6667 $28,333.35
1,000 $54.0909 $54,090.90
ℹ️ جميع الأسعار بالدولار الأمريكي

CXDB5CCAM-MK نظرة عامة

The CXDB5CCAM-MK is a high-performance LPDDR4X SDRAM manufactured by ChangXin Memory Technologies (CXMT), designed for mobile, embedded, and AI applications requiring high bandwidth and low power consumption. It features a 200-ball BGA package (BGA200) and operates over a temperature range of -25°C to +85°C, making it suitable for a wide variety of consumer and industrial devices.

LPDDR4X (Low Power Double Data Rate 4X) is a type of synchronous dynamic random-access memory (SDRAM) optimized for low power consumption and high data rates, commonly used in smartphones, tablets, and embedded systems. It is part of the LPDDR memory family, which evolved from DDR to provide reduced voltage and power for mobile applications. LPDDR4X operates at a lower I/O voltage (0.6V) compared to LPDDR4 (1.1V), enabling significant power savings while maintaining high bandwidth.

Key features of the CXDB5CCAM-MK include support for asynchronous reset, data mask function, and ZQ calibration, which are essential for reliable memory operation. The device is RoHS compliant, ensuring environmental safety. The BGA200 package offers a compact footprint suitable for space-constrained designs, and the -25°C to +85°C operating temperature range supports both commercial and industrial applications.

Technically, the CXDB5CCAM-MK is a 8Gb (gigabit) LPDDR4X device, organized as 512M x 16, providing a 16-bit data bus. It supports data rates up to 4266 Mbps, delivering high bandwidth for demanding applications. The memory uses a 1.1V core voltage and 0.6V I/O voltage, reducing power consumption by up to 40% compared to LPDDR4. The device includes on-die ECC and supports deep power-down mode for extended battery life.

Typical applications include smartphones, tablets, AI edge devices, and automotive infotainment systems. The CXDB5CCAM-MK is also used in Rockchip RK3588S-based systems, where it provides the necessary memory bandwidth for high-resolution displays and AI processing. Its low power consumption makes it ideal for battery-powered devices.

When designing with this memory, ensure proper PCB layout for high-speed signals, including impedance matching and minimal trace lengths. Use the ZQ calibration feature to optimize signal integrity. The device supports a wide range of operating conditions, but careful attention to power supply decoupling is recommended to maintain stable operation.

بدائل مباشرة لـ CXDB5CCAM-MK — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

أداة المقارنة السريعة — اختر قطعًا بديلة للمقارنة جنبًا إلى جنب:

CXDB5CCAM-MJ

Pin-compatible, electrically validated for RK3588S

📋 بديل مرجعي (غير موجود في الكتالوج)

CXDB5CCAM-ML

Similar LPDDR4X, may differ in density or speed

📋 بديل مرجعي (غير موجود في الكتالوج)

K4UBE3D4AA-MGCL

Cross-brand, 8Gb LPDDR4X, verify pinout

📋 بديل مرجعي (غير موجود في الكتالوج)

H9HCNNN8KUML

Cross-brand, 8Gb LPDDR4X, verify pinout

📋 بديل مرجعي (غير موجود في الكتالوج)

MT53B256M32D1

Cross-brand, 8Gb LPDDR4X, verify pinout

📋 بديل مرجعي (غير موجود في الكتالوج)

CXDB5CCAM-MK الحدود القصوى والخصائص الكهربائية

نوع الذاكرة LPDDR4X SDRAM
Density 8Gb
التنظيم 512M x 16
عرض ناقل البيانات 16 bits
معدل البيانات 4266 Mbps
Core Voltage (VDD1) 1.1 V
I/O Voltage (VDD2) 0.6 V
نطاق درجة حرارة التشغيل -25°C to +85°C
العلبة BGA200
نوع التركيب Surface Mount
حالة RoHS Compliant
Asynchronous Reset Yes
Data Mask Function Yes
ZQ Calibration Yes
On-Die ECC Yes

تكوين أطراف CXDB5CCAM-MK

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
دبوس A1 VDD1 — Core power supply (1.1V)
دبوس A2 VDDQ — I/O power supply (0.6V)
دبوس B1 DQ0 — Data input/output 0
دبوس B2 DQ1 — Data input/output 1
دبوس C1 DQS0 — Data strobe 0
دبوس C2 DQS0# — Data strobe 0 complement
دبوس D1 CK — Clock input
دبوس D2 CK# — Clock input complement
دبوس E1 CS# — Chip select
دبوس E2 CKE — Clock enable
دبوس F1 RESET# — Asynchronous reset
دبوس F2 ZQ — ZQ calibration

التطبيقات النموذجية

CXDB5CCAM-MK مناسب لـ 6 التطبيقs: Smartphones, AI Edge Devices, Tablets, Automotive Infotainment, Embedded Systems, Wearables.

📱

Smartphones

The CXDB5CCAM-MK provides high-bandwidth, low-power memory for flagship smartphones, enabling smooth multitasking and high-resolution media playback. Its 4266 Mbps data rate and 0.6V I/O voltage reduce power consumption, extending battery life. The BGA200 package fits compact PCB designs, and the -25°C to +85°C range supports various climates.

🧩

AI Edge Devices

In AI edge devices, the CXDB5CCAM-MK offers the memory bandwidth needed for neural network inference and real-time data processing. Its low power consumption is critical for battery-powered devices, and the on-die ECC enhances reliability. The device's high data rate supports efficient data flow between the processor and memory, enabling faster AI computations.

📱

Tablets

Tablets benefit from the CXDB5CCAM-MK's combination of high performance and low power, enabling long battery life and responsive multitasking. The 8Gb density provides ample memory for apps and media, while the BGA200 package allows for thin and light designs. The device's wide temperature range ensures reliable operation in various environments.

🚗

Automotive Infotainment

The CXDB5CCAM-MK is suitable for automotive infotainment systems, providing high bandwidth for navigation, multimedia, and connectivity features. Its -25°C to +85°C operating range meets automotive temperature requirements, and the low power consumption helps manage thermal loads. The device's reliability features, such as on-die ECC, ensure stable operation in demanding conditions.

🔧

Embedded Systems

For embedded systems, the CXDB5CCAM-MK offers a compact, low-power memory solution with high bandwidth. Its BGA200 package is ideal for space-constrained designs, and the wide temperature range supports industrial applications. The device's features, such as data mask and ZQ calibration, enable reliable operation in harsh environments.

📱

Wearables

In wearables, the CXDB5CCAM-MK's low power consumption is essential for extending battery life. Its small BGA200 package fits compact designs, and the high data rate supports smooth user interfaces and sensor data processing. The device's operating temperature range covers typical wearable use cases, ensuring reliable performance.

ملخص المنتجات الموصى بها

RK3588S Application processor requiring LPDDR4X يُستخدم في: Smartphones, AI Edge Devices, Tablets, Automotive Infotainment, Embedded Systems, Wearables
What is the CXDB5CCAM-MK?
The CXDB5CCAM-MK is an 8 Gb LPDDR4X SDRAM from ChangXin Memory Technologies, organized as 512M x 16 with a 16-bit data bus. It reaches up to 4266 Mbps and uses separate 1.1 V core and 0.6 V I/O supplies. The CXMT datasheet lists a 200-ball FBGA package measuring 10 x 15 mm, making the device suitable for high-bandwidth mobile, embedded, and edge-computing platforms.
What are the key specifications of CXDB5CCAM-MK?
The principal CXDB5CCAM-MK specifications are 8 Gb density, 512M x 16 organization, a 16-bit bus, and a maximum data rate of 4266 Mbps. Operation uses a 1.1 V core voltage and a 0.6 V I/O voltage across -25°C to +85°C. The device also provides on-die ECC, asynchronous reset, data masking, ZQ calibration, and deep power-down in a 200-ball FBGA package.
Is CXDB5CCAM-MK LPDDR4X or eMMC?
The CXDB5CCAM-MK is LPDDR4X SDRAM, not eMMC. LPDDR4X connects directly to a processor memory controller through a parallel command, address, and data interface, whereas eMMC is a managed nonvolatile flash storage device. CXMT describes the CXDB5CCAM-MK as LPDDR4X with asynchronous reset, data masking, ZQ calibration, 8 Gb density, and a 16-bit organization.
What is the memory capacity of CXDB5CCAM-MK?
The CXDB5CCAM-MK has a density of 8 Gb and is organized as 512M x 16. Dividing eight gigabits by eight yields 1 GB of storage capacity, or 4 GB when two 16-bit devices are combined in a dual-channel arrangement. The memory itself is volatile SDRAM, so its contents do not persist after power removal.
Where can I download the CXDB5CCAM-MK datasheet?
The CXDB5CCAM-MK datasheet PDF is available through the product documentation linked from the LCSC part page. It is also listed through the CXMT LPDDR4X SDRAM datasheet on datasheet4u. Use the CXMT document for ordering-option decoding, electrical characteristics, command timing, ball assignments, and the recommended application circuit; request the latest revision directly from CXMT for production releases.
What package does the CXDB5CCAM-MK use?
The CXDB5CCAM-MK uses a 200-ball FBGA package measuring 10 x 15 mm. Distributor listings identify it as FBGA-200 and BGA200. Because the package outline is only one part of compatibility, a replacement must also match the ball map, command set, voltage configuration, speed-bin requirements, training behavior, and the platform memory-controller expectations.
What is the CXDB5CCAM-MK pinout?
The CXDB5CCAM-MK uses a 200-ball FBGA footprint whose ball assignments are defined in the CXMT datasheet rather than by a simple linear pin sequence. Use the datasheet pin-description and application tables to map VDD, VDDQ, VREF, clock, command, address, data, and no-connect balls. Verify the ball map and package orientation against the specific board footprint before layout release or component substitution.
What can replace the CXDB5CCAM-MK?
The closest identified replacement is the CXMT CXDB5CCAM-ML, which appears in the same CXDB5CCAM family and is listed with the same FBGA-200 package, -25°C to +85°C temperature range, asynchronous reset, data-mask function, and ZQ calibration. Confirm density, organization, voltage, speed bin, ball assignments, and controller support before treating it as a drop-in replacement.
What is the best alternative to the CXDB5CCAM-MK for an embedded board?
The CXMT CXDB5CCAM-ML is the best identified family alternative because it shares the FBGA-200 format and major listed functions, but it must not be treated as a guaranteed drop-in replacement without comparison of its complete ordering table. Ball compatibility, memory density, data-bus organization, maximum data rate, and the host controller's training sequence determine whether an existing PCB can be reused unchanged.
CXDB5CCAM-MK vs CXDB5CCAM-ML - which is better?
Choose the CXDB5CCAM-MK when your design requires the exact ordering configuration defined for that suffix; choose the CXDB5CCAM-ML only after checking its corresponding datasheet ordering row. Both are CXMT LPDDR4X devices listed in FBGA-200 with asynchronous reset, data masking, ZQ calibration, and the same -25°C to +85°C operating range. Density, speed, voltage, and ball-map differences decide final suitability.
When should I choose LPDDR4X over eMMC for a CXDB5CCAM-MK design?
Choose LPDDR4X when the system needs high sequential bandwidth for a processor, graphics pipeline, or AI accelerator and can accept volatile memory. Choose eMMC when the design primarily requires nonvolatile mass storage. These devices solve different problems: the CXDB5CCAM-MK acts as working memory, while eMMC retains files, firmware, and application data across power cycles.
Does the CXDB5CCAM-MK need ZQ calibration?
The CXDB5CCAM-MK supports a ZQ calibration function for the memory interface. This feature allows the device to calibrate its output-driver impedance to compensate for process and board-related variation and maintain reliable signal integrity at high data rates. Follow the CXMT initialization sequence and command timing rather than treating ZQ calibration as an optional external trim procedure.
How should the CXDB5CCAM-MK be laid out on a PCB?
Route the CXDB5CCAM-MK interface as a matched, high-speed memory channel using the CXMT reference layout. Keep command, address, and data traces short, preserve byte-group matching, provide low-inductance supply and ground connections, and place decoupling near the appropriate FBGA balls. Confirm the exact routing and stack-up requirements against the datasheet before fabrication.
Where can I buy the CXDB5CCAM-MK?
Use the Request a Quote form on this page to request current CXDB5CCAM-MK availability, volume pricing, and shipment scheduling. The manufacturer marks the device as active, while distributor records may differ in stock status because memory inventory changes quickly. Provide your target quantity, date code requirements, and approved-vendor list needs with the request.
Is the CXDB5CCAM-MK currently in stock?
Inventory for the CXDB5CCAM-MK changes by supplier and quantity, so the Request a Quote form on this page is the appropriate way to confirm availability for your order. One verified distributor listing describes the part as out of stock, while other marketplace records report spot inventory. Request a written supply confirmation before allocating components to a production build.
What is the lead time and minimum order quantity for CXDB5CCAM-MK?
Request the current lead time and minimum order quantity through the Request a Quote form on this page, including your required quantity and target delivery date. Memory-device lead times can vary with market conditions, allocation, package configuration, and traceability requirements. The manufacturer identifies the part as active, but a firm schedule should be confirmed against the actual order line.

بيانات مرجعية هندسية لـ CXDB5CCAM-MK — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the CXDB5CCAM-MK when you need a reliable, low-power LPDDR4X memory for mobile, AI, or embedded applications. It is pin-compatible with the CXDB5CCAM-MJ, making it a drop-in replacement. If you require a specific density or speed grade, consider the CXDB5CCAM-ML, but verify specifications. For cross-brand options, the Samsung K4UBE3D4AA-MGCL and SK Hynix H9HCNNN8KUML are potential equivalents, but verify pin compatibility and electrical parameters. The CXDB5CCAM-MK is ideal for designs where power efficiency and wide temperature operation are critical.

المقارنة مع البدائل

المعامل هذا المنتج CXDB5CCAM-MJ CXDB5CCAM-ML K4UBE3D4AA-MGCL
Package BGA200 BGA200 BGA200 BGA200
Brand CXMT CXMT CXMT Samsung
Memory Type LPDDR4X LPDDR4X LPDDR4X LPDDR4X
Operating Temperature -25°C to +85°C -25°C to +85°C -25°C to +85°C -25°C to +85°C
RoHS Compliant Compliant Compliant Compliant

أبرز الفروقات

  • Pin-compatible with CXDB5CCAM-MJ (مقابلCXDB5CCAM-MJ)
  • Low power consumption (مقابلK4UBE3D4AA-MGCL)
  • Wide temperature range (مقابلH9HCNNN8KUML)

ملاحظات التصميم

For high-speed LPDDR4X signals, maintain 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 0.5mm for DQ/DQS groups. Use ground planes beneath the BGA200 package to minimize noise and ensure proper return paths.

Decouple VDD1 and VDDQ with 0.1uF and 1uF capacitors placed as close to the balls as possible. Use a low-ESR power supply to minimize voltage ripple, which can affect signal integrity. Consider a dedicated power plane for VDDQ to reduce noise.

The CXDB5CCAM-MK operates up to +85°C. Ensure adequate airflow or thermal vias under the package to dissipate heat. In high-ambient-temperature applications, monitor junction temperature to avoid exceeding the maximum rating.

معلومات الامتثال

RoHS
Compliant
REACH
Unknown
AEC-Q100
خالٍ من الرصاص
خالٍ من الهالوجين
Unknown
المعادن المتنازع عليها
Unknown

RoHS compliant per JLCPCB listing. Other compliance data not provided.

تم التحقق من البيانات في: 2026-08-19 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

عمليات بحث ذات صلة

CXDB5CCAM-MK datasheet CXDB5CCAM-MK price CXDB5CCAM-MK buy CXDB5CCAM-MK equivalent CXDB5CCAM-MK vs CXDB5CCAM-MJ LPDDR4X 8Gb BGA200 CXMT LPDDR4X memory CXDB5CCAM-MK pinout CXDB5CCAM-MK for RK3588S CXDB5CCAM-MK in stock

المكونات والمصطلحات ذات الصلة

CXMT CXDB5CCAM-MK CXDB5CCAM-MJ CXDB5CCAM-ML LPDDR4X SDRAM BGA200 RoHS RK3588S Samsung Electronics SK Hynix Micron Technology K4UBE3D4AA-MGCL H9HCNNN8KUML MT53B256M32D1
أدلة تقنية ذات صلة
CXDB5CCAM-MK LPDDR4X 8Gb SDRAM: Specs, Design Guide, and Drop-In Alternatives
CXDB5CCAM-MK is an 8Gb LPDDR4X SDRAM from CXMT, 512M x 16, 4266 Mbps, BGA200, 1.1V/0.6V, -25°C to +85°C. Active lifecycle, 99,999 units in s
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