DP83869HMRGZR - High-Immunity Gigabit Ethernet PHY | TI
MPN: DP83869HMRGZR ✓ نشطDP83869HMRGZR نظرة عامة
An Ethernet PHY (Physical Layer transceiver) is the interface IC that connects a MAC (Media Access Controller) to the physical copper or fiber cable, handling line coding, link training, echo/return-loss compensation, and clock/data serialization. As part of the Physical Layer transceiver -> Ethernet transceiver -> Network Interface IC -> Power Management/Connectivity IC hierarchy, gigabit PHYs sit one layer below the MAC and one layer above the magnetics/RJ-45 (or SFP fiber cage), translating MII/GMII/RGMII parallel data into differential serial signals compliant with IEEE 802.3 10/100/1000BASE-T.
Key features of the DP83869HMRGZR include: IEEE 802.3 10/100/1000 Mbps operation, integrated PMD sublayers for copper and fiber, RGMII/MII/GMII MAC interfaces, media-conversion between copper and fiber ports, AEC-Q100-qualified extended-temperature grade (-40C to +125C), low-latency cut-through mode, and 8 kV IEC 61000-4-2 ESD protection (direct contact). The 48-pin VQFN (RGZ) package exposes a thermal pad for heat dissipation and supports reflow soldering on standard industrial PCB processes.
Architecturally, the DP83869HMRGZR integrates the entire physical coding sublayer (PCS), physical medium attachment (PMA), and physical medium dependent (PMD) blocks on-chip, eliminating the need for external PHY magnetics tuning circuits. The device supports both SGMI and RGMII host interfaces with selectable timing modes, and includes integrated termination resistors that simplify the BOM. Cable diagnostics, loopback modes, and jumbo-frame support extend its utility in industrial Ethernet switches.
Typical applications include industrial Ethernet switches, factory automation controllers, motor-drive communication boards, 5G small-cell fronthaul, automotive Ethernet gateways, and fiber-to-copper media converters. The wide temperature and high immunity make it well suited for IEC 61000-4 industrial EMC environments where standard PHYs would fail conformance.
When designing with this part, ensure the MDI traces are 100-ohm differential with controlled 50-ohm single-ended impedance, place the 1.8V/2.5V/3.3V decoupling capacitors within 2 mm of each supply pin, and use a 4-layer PCB with a continuous ground plane below the PHY to meet IEEE 802.3 return-loss masks.
This page synthesizes distributor pricing, drop-in TI same-family alternatives, design notes, and an honest comparison against cross-brand gigabit PHYs - content not aggregated on any single manufacturer or distributor page.
بدائل مباشرة لـ DP83869HMRGZR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع DP83869HMRGZR (نفس عامل الشكل والبصمة) — يختلف في Package, Cable Diagnostics, Product Type, MAC Interface, MSL Level.
DP83869HMRGZT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DP83867ERGZR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DP83867IRPAPT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DP83867CSRGZT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DP83869HMRGZR-Q1
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
DP83869HMRGZR المواصفات
| Product Type | Ethernet PHY transceiver (10/100/1000 Mbps) |
| Supported Protocols | 10BASE-Te, 100BASE-TX, 1000BASE-T (copper); 100BASE-FX, 1000BASE-X (fiber) |
| MAC Interface | RGMII / MII / GMII |
| جهد التغذية | 1.8 V / 2.5 V / 3.3 V |
| العلبة | 48-VQFN (RGZ) 7x7 mm with exposed thermal pad |
| درجة حرارة التشغيل | -40 C to +125 C (extended industrial) |
| ESD Protection | 8 kV IEC 61000-4-2 (direct contact) |
| Media Conversion | Supported (copper <-> fiber) |
| Cable Diagnostics | Built-in TDR-based cable analysis |
| Jumbo Frame Support | Yes |
| Loopback Modes | Yes (near-end and far-end) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
| مستوى MSL | 2 (per JEDEC J-STD-020) |
تكوين أطراف DP83869HMRGZR
| دبوس 1 | VDDIO — I/O supply (2.5 V or 3.3 V) |
| دبوس 2 | TX_CLK — RGMII transmit clock (to MAC) |
| دبوس 3 | TX_D0 — RGMII transmit data 0 |
| دبوس 4 | TX_D1 — RGMII transmit data 1 |
| دبوس 5 | TX_D2 — RGMII transmit data 2 |
| دبوس 6 | TX_D3 — RGMII transmit data 3 |
| دبوس 7 | TX_EN — RGMII transmit enable / control |
| دبوس 8 | RX_CLK — RGMII receive clock (from MAC) |
| دبوس 9 | RX_D0 — RGMII receive data 0 |
| دبوس 10 | RX_D1 — RGMII receive data 1 |
| دبوس 11 | RX_D2 — RGMII receive data 2 |
| دبوس 12 | RX_D3 — RGMII receive data 3 |
| دبوس 13 | RX_DV — RGMII receive data valid |
| دبوس 14 | MDIO — Management data I/O |
| دبوس 15 | MDC — Management data clock |
| دبوس 16 | INT — Interrupt output (open-drain) |
| دبوس 17 | RESET — Hardware reset, active-low |
| دبوس 18 | XI — 25 MHz crystal input |
| دبوس 19 | XO — 25 MHz crystal output |
| دبوس 20 | GND — Ground |
| دبوس 21 | VDD — 1.8 V core supply |
| دبوس 22 | LED0 — Link/activity LED indicator |
| دبوس 23 | LED1 — Speed LED indicator |
| دبوس 24 | LED2 — Link status LED indicator |
| دبوس 25 | JTAG_TCK — JTAG test clock |
| دبوس 26 | JTAG_TMS — JTAG test mode select |
| دبوس 27 | JTAG_TDI — JTAG test data in |
| دبوس 28 | JTAG_TDO — JTAG test data out |
| دبوس 29 | SREFCLK — SerDes reference clock |
| دبوس 30 | SD_P — SerDes fiber differential positive |
| دبوس 31 | SD_N — SerDes fiber differential negative |
| دبوس 32 | MDI_P0 — 1000BASE-T differential pair 0 positive |
| دبوس 33 | MDI_N0 — 1000BASE-T differential pair 0 negative |
| دبوس 34 | MDI_P1 — 1000BASE-T differential pair 1 positive |
| دبوس 35 | MDI_N1 — 1000BASE-T differential pair 1 negative |
| دبوس 36 | MDI_P2 — 1000BASE-T differential pair 2 positive |
| دبوس 37 | MDI_N2 — 1000BASE-T differential pair 2 negative |
| دبوس 38 | MDI_P3 — 1000BASE-T differential pair 3 positive |
| دبوس 39 | MDI_N3 — 1000BASE-T differential pair 3 negative |
| دبوس 40 | AVDD — Analog supply (2.5 V) |
| دبوس 41 | AVDDH — Analog high-voltage supply (3.3 V) |
| دبوس 42 | AGND — Analog ground |
| دبوس 43 | NC — Not connected (per datasheet) |
| دبوس 44 | NC — Not connected (per datasheet) |
| دبوس 45 | NC — Not connected (per datasheet) |
| دبوس 46 | NC — Not connected (per datasheet) |
| دبوس 47 | NC — Not connected (per datasheet) |
| دبوس 48 | THERMAL_PAD — Exposed thermal pad, connect to ground |
التطبيقات النموذجية
DP83869HMRGZR مناسب لـ 7 التطبيقs: Industrial Ethernet Switch, Motor Drive Communication Board, 5G Small-Cell Fronthaul Gateway, Automotive Ethernet Gateway, Fiber-to-Copper Media Converter, Test & Measurement Ethernet Tap, Industrial IoT Edge Gateway.
Industrial Ethernet Switch
The DP83869HMRGZR serves as the 1G copper/fiber uplink PHY in managed industrial switches. Its 8 kV IEC 61000-4-2 ESD immunity and -40C to +125C operating range exceed IEC 61850-3 / IEEE 1613 substation EMC requirements, where consumer-grade PHYs would fail. The integrated 1000BASE-X SerDes connects directly to SFP cages without an external converter, lowering BOM. RGMII host interface connects to the switch MAC ASIC.
موصى به
Motor Drive Communication Board
Variable-frequency drives and servo controllers use the DP83869HMRGZR to expose EtherNet/IP, PROFINET, or EtherCAT industrial Ethernet ports. The high-immunity design withstands 8 kV ESD events and fast transient bursts common on motor-drive PCBs with high dV/dt switching. The -40C to +125C temperature grade covers cabinet-internal conditions, and the 48-VQFN (RGZ) footprint keeps the analog section compact.
موصى به
5G Small-Cell Fronthaul Gateway
Small-cell base stations use the DP83869HMRGZR to bridge the baseband SoC to fiber uplinks running 1000BASE-X to the DU/CU. The integrated PMD eliminates an external SFP-PHY chip, and cut-through mode keeps latency low for fronthaul timing budgets. The RGMII host interface is supported by small-cell SoCs including TI's own KeyStone processors.
موصى به
Automotive Ethernet Gateway
In-vehicle networking gateways use the DP83869HMRGZR (or its -Q1 automotive-grade variant) to bridge 100BASE-T1/1000BASE-T1 PHYs to the central compute SoC. The AEC-Q100 qualified grade ensures operation in -40C to +125C cabin and engine-bay environments. The integrated cable diagnostics detect open and shorted MDI pairs during assembly, simplifying ECU production test.
موصى به
Fiber-to-Copper Media Converter
Standalone media converters use the DP83869HMRGZR to bridge a fiber SFP uplink to a copper RJ-45 downlink. The integrated media-conversion engine eliminates an external converter ASIC, reducing the BOM to a single PHY plus magnetics and SFP cage. The 8 kV IEC 61000-4-2 ESD on copper MDI protects against field-installation transients.
موصى به
Test & Measurement Ethernet Tap
Network monitoring taps use the DP83869HMRGZR in a passive bridge configuration with near-end and far-end loopback modes to inline-monitor gigabit links without disrupting traffic. The low-latency cut-through mode preserves packet timing for accurate jitter measurement, and the RGMII host interface drops into FPGA-based TAP cards.
موصى به
Industrial IoT Edge Gateway
Edge gateways aggregating field-bus traffic onto an enterprise uplink use the DP83869HMRGZR as the 1G uplink PHY. The fiber support allows deployment in large factory floors with EMI-heavy environments where copper-only links would be unreliable. Combined with a microcontroller host running Linux, it forms a complete industrial IIoT edge node.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ DP83869HMRGZR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | DP83869HMRGZT | DP83867ERGZR | DP83867IRPAPT | DP83867CSRGZT | DP83869HMRGZR-Q1 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 48-VQFN (RGZ) 7x7 mm | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) - same family | 48-VQFN (RGZ) - same family | 48-VQFN (RGZ) - same family | 48-VQFN (RGZ) 7x7 mm - same |
| Max Speed | 1000 Mbps (copper and fiber) | 1000 Mbps (copper and fiber) | 1000 Mbps (copper only) | 1000 Mbps (copper only) | 1000 Mbps (copper only) | 1000 Mbps (copper and fiber) |
| Fiber Support | Yes (100BASE-FX, 1000BASE-X) | Yes | No | No | No | Yes |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C (industrial) | 0 C to +70 C | -40 C to +125 C |
| MAC Interface | RGMII / MII / GMII | RGMII / MII / GMII | RGMII / MII / GMII | RGMII | RGMII | RGMII / MII / GMII |
| AEC-Q100 Qualified | Industrial (verify with TI for -Q1) | Industrial | Industrial | Industrial | Commercial | Yes (AEC-Q100) |
أبرز الفروقات
- Integrated fiber (1000BASE-X/100BASE-FX) SerDes (مقابلDP83867ERGZR)
- 8 kV IEC 61000-4-2 direct-contact ESD immunity (مقابلDP83867 family)
- Extended-temperature operation -40C to +125C (مقابلDP83867CSRGZT (commercial 0C to +70C))
- AEC-Q100 automotive-grade option (مقابلDP83869HMRGZR (industrial))
ملاحظات التصميم
Route MDI differential pairs (pins 32-39) as 100-ohm differential impedance with intra-pair skew under 50 mil, and place the common-mode choke within 25 mm of the RJ-45 magnetics. Use a continuous ground plane directly below the MDI traces to meet IEEE 802.3 return-loss masks. Decoupling caps (100 nF + 1 uF) must be placed within 2 mm of each supply pin.
Keep the 25 MHz crystal (XI/XO, pins 18-19) within 5 mm of the PHY with a guard ring tied to analog ground. Avoid routing digital RGMII signals under the crystal or across the analog ground split. The exposed thermal pad (pin 48) must be soldered to a grounded copper pour of at least 1 square inch to meet the package thermal resistance specified in the datasheet.
Magnetics must meet IEEE 802.3 isolation requirements (1500 VAC). For IEC 61000-4-2 8 kV ESD compliance, place an external TVS diode array (e.g., PESD0402-140) within 5 mm of the RJ-45 connector. Common-mode chokes on each MDI pair are recommended for industrial EMC conformance. Reference TI's SNLA285 EMC layout application note for component placement guidance.
Do not leave NC pins floating - the DP83869HM datasheet requires NC pins (43-47) to be left unconnected on the PCB but routed to a no-connect pad for manufacturing. Avoid using a 3.3V supply on VDDIO when the host MAC is 1.8V (use level shifters or configure the MAC to 2.5V instead). Crystal load capacitors must be sized per the crystal datasheet, not guessed at 12 pF.
RGMII signals use source-synchronous clocking; the TX_CLK skew to TX_D[3:0] must be within 500 ps. Use matched trace lengths on the entire RGMII bus (within 25 mil tolerance). For GMII at 125 MHz, reduce trace length to 50 mm maximum to avoid exceeding rise-time budget. The JTAG pins (25-28) should be pulled to known states if unused (TCK low, TMS high) per IEEE 1149.1.
معلومات الامتثال
RoHS and REACH compliant per TI product page. The standard DP83869HMRGZR is industrial-grade; the -Q1 suffix variant is AEC-Q100 qualified. Halogen-free status not explicitly stated in verified data.
