EP20K30ETC144-1 - APEX-20KE FPGA, 30K Gates, 144-LQFP | Altera
MPN: EP20K30ETC144-1 ✗ انتهى عمره الإنتاجيEP20K30ETC144-1 نظرة عامة
A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect that can be reconfigured by the designer after manufacture. APEX-20KE belongs to the hierarchical PLD family: PLD -> CPLD -> FPGA -> programmable logic device -> logic IC. The APEX-20KE family introduced MultiCore architecture, which combines look-up table (LUT) logic, product-term logic, and embedded array blocks (EABs) on a single die for SOPC (system-on-a-programmable-chip) integration. This makes the EP20K30ETC144-1 suitable for designs that mix glue logic, DSP functions, and small memory subsystems.
Key features include 192 macrocells, 92 user I/Os, 4 dedicated inputs, a maximum internal frequency of 160 MHz, and 0.22 micrometer CMOS process technology. The device is built on a CMOS process with an LVTTL/LVCMOS compatible I/O standard. The 144-LQFP (also referenced as PQFP144, TQFP-144, or LFQFP-144 with 0.5 mm pitch) provides a low-cost, gull-wing surface-mount option for moderate-density designs where fine-pitch BGA packaging is not required.
Typical applications include communications glue logic, industrial control interfaces, custom peripheral bridges, low-density data-path acceleration, and legacy system upgrades where a programmable logic replacement is needed. The industrial operating temperature range (0°C to 85°C) and 1.8 V core supply make it compatible with mixed-voltage system boards from the early 2000s.
When designing with this device, ensure 1.8 V core and 3.3 V (or 2.5 V) I/O bank supplies are decoupled with 0.1 uF and 10 uF capacitors placed close to the supply pins. Configuration can be performed via JTAG or passive serial using a MAX-series CPLD or EPC-series configuration device. Use the Altera (Intel) Quartus design toolchain for compilation, fitting, and timing analysis. Note that the APEX-20KE family has been classified NRND by Intel; design teams should evaluate Cyclone or MAX-series parts for new designs.
بدائل مباشرة لـ EP20K30ETC144-1 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP20K30ETC144-1 (نفس عامل الشكل والبصمة) — يختلف في Process Technology, Package, Operating Temperature, Propagation Delay, Mounting Type.
EP20K30ETC144-1X
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K100ETC144-1N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K160ETC144-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K100ETC144-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K100ETC144-1X
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K30ETC144-1 الحدود القصوى والخصائص الكهربائية
| Series | APEX-20KE |
| Family | APEX 20K |
| Logic Gates | 30,000 gates |
| Logic Elements / Cells | 1,200 |
| Macrocells | 192 |
| Number of I/O | 92 |
| Number of Dedicated Inputs | 4 |
| Maximum Internal Frequency | 160 MHz |
| Propagation Delay | 1.68 ns |
| Supply Voltage - Core | 1.71 V to 1.89 V (1.8 V nominal) |
| Process Technology | 0.22 um CMOS |
| درجة حرارة التشغيل | 0 C to 85 C |
| العلبة / الحالة | 144-LQFP (TQFP-144, 20x20 mm, 0.5 mm pitch) |
| نوع التركيب | Surface Mount (Gull Wing) |
| Supplier Device Package | 144-TQFP |
| Architecture | MultiCore (LUT + product-term + EAB) |
تكوين أطراف EP20K30ETC144-1
| دبوس 1 | GND — Ground |
| دبوس 2 | I/O — User I/O bank 1 |
| دبوس 3 | I/O — User I/O bank 1 |
| دبوس 4 | I/O — User I/O bank 1 |
| دبوس 5 | I/O — User I/O bank 1 |
| دبوس 6 | VCCINT — Core supply 1.8 V |
| دبوس 7 | I/O — User I/O bank 1 |
| دبوس 8 | I/O — User I/O bank 1 |
| دبوس 9 | I/O — User I/O bank 1 |
| دبوس 10 | I/O — User I/O bank 1 |
| دبوس 11 | GND — Ground |
| دبوس 12 | I/O — User I/O bank 2 |
| دبوس 13 | I/O — User I/O bank 2 |
| دبوس 14 | I/O — User I/O bank 2 |
| دبوس 15 | I/O — User I/O bank 2 |
| دبوس 16 | VCCIO — I/O supply (3.3 V or 2.5 V) |
| دبوس 17 | I/O — User I/O bank 2 |
| دبوس 18 | I/O — User I/O bank 2 |
| دبوس 19 | I/O — User I/O bank 2 |
| دبوس 20 | I/O — User I/O bank 2 |
| دبوس 21 | GND — Ground |
| دبوس 22 | I/O — User I/O bank 3 |
| دبوس 23 | I/O — User I/O bank 3 |
| دبوس 24 | I/O — User I/O bank 3 |
| دبوس 25 | I/O — User I/O bank 3 |
| دبوس 26 | VCCINT — Core supply 1.8 V |
| دبوس 27 | I/O — User I/O bank 3 |
| دبوس 28 | I/O — User I/O bank 3 |
| دبوس 29 | I/O — User I/O bank 3 |
| دبوس 30 | I/O — User I/O bank 3 |
| دبوس 31 | GND — Ground |
| دبوس 32 | I/O — User I/O bank 4 |
| دبوس 33 | I/O — User I/O bank 4 |
| دبوس 34 | I/O — User I/O bank 4 |
| دبوس 35 | I/O — User I/O bank 4 |
| دبوس 36 | VCCIO — I/O supply (3.3 V or 2.5 V) |
| دبوس 37 | I/O — User I/O bank 4 |
| دبوس 38 | I/O — User I/O bank 4 |
| دبوس 39 | I/O — User I/O bank 4 |
| دبوس 40 | I/O — User I/O bank 4 |
| دبوس 41 | GND — Ground |
| دبوس 42 | I/O — User I/O bank 5 |
| دبوس 43 | I/O — User I/O bank 5 |
| دبوس 44 | I/O — User I/O bank 5 |
| دبوس 45 | I/O — User I/O bank 5 |
| دبوس 46 | VCCINT — Core supply 1.8 V |
| دبوس 47 | I/O — User I/O bank 5 |
| دبوس 48 | I/O — User I/O bank 5 |
| دبوس 49 | I/O — User I/O bank 5 |
| دبوس 50 | I/O — User I/O bank 5 |
| دبوس 51 | GND — Ground |
| دبوس 52 | I/O — User I/O bank 6 |
| دبوس 53 | I/O — User I/O bank 6 |
| دبوس 54 | I/O — User I/O bank 6 |
| دبوس 55 | I/O — User I/O bank 6 |
| دبوس 56 | VCCIO — I/O supply (3.3 V or 2.5 V) |
| دبوس 57 | I/O — User I/O bank 6 |
| دبوس 58 | I/O — User I/O bank 6 |
| دبوس 59 | I/O — User I/O bank 6 |
| دبوس 60 | I/O — User I/O bank 6 |
| دبوس 61 | GND — Ground |
| دبوس 62 | I/O — User I/O bank 7 |
| دبوس 63 | I/O — User I/O bank 7 |
| دبوس 64 | I/O — User I/O bank 7 |
| دبوس 65 | I/O — User I/O bank 7 |
| دبوس 66 | VCCINT — Core supply 1.8 V |
| دبوس 67 | I/O — User I/O bank 7 |
| دبوس 68 | I/O — User I/O bank 7 |
| دبوس 69 | I/O — User I/O bank 7 |
| دبوس 70 | I/O — User I/O bank 7 |
| دبوس 71 | GND — Ground |
| دبوس 72 | I/O — User I/O bank 8 |
| دبوس 73 | I/O — User I/O bank 8 |
| دبوس 74 | I/O — User I/O bank 8 |
| دبوس 75 | I/O — User I/O bank 8 |
| دبوس 76 | VCCIO — I/O supply (3.3 V or 2.5 V) |
| دبوس 77 | I/O — User I/O bank 8 |
| دبوس 78 | I/O — User I/O bank 8 |
| دبوس 79 | I/O — User I/O bank 8 |
| دبوس 80 | I/O — User I/O bank 8 |
| دبوس 81 | GND — Ground |
| دبوس 82 | nCONFIG — Configuration control (active-low) |
| دبوس 83 | nSTATUS — Configuration status (active-low) |
| دبوس 84 | CONF_DONE — Configuration done (active-high open-drain) |
| دبوس 85 | DCLK — Configuration clock input |
| دبوس 86 | DATA0 — Configuration data input |
| دبوس 87 | nCE — Chip enable (active-low) |
| دبوس 88 | VCCINT — Core supply 1.8 V |
| دبوس 89 | MSEL0 — Configuration mode select 0 |
| دبوس 90 | MSEL1 — Configuration mode select 1 |
| دبوس 91 | TDI — JTAG test data input |
| دبوس 92 | TDO — JTAG test data output |
| دبوس 93 | TMS — JTAG test mode select |
| دبوس 94 | TCK — JTAG test clock |
| دبوس 95 | GND — Ground |
| دبوس 96 | DEV_OE — Device-wide output enable (active-low) |
| دبوس 97 | DEV_CLRn — Device-wide clear (active-low) |
| دبوس 98 | CLK0 — Dedicated clock input 0 |
| دبوس 99 | CLK1 — Dedicated clock input 1 |
| دبوس 100 | CLK2 — Dedicated clock input 2 |
| دبوس 101 | CLK3 — Dedicated clock input 3 |
| دبوس 102 | GND — Ground |
| دبوس 103 | I/O — User I/O bank (remaining) |
| دبوس 104 | I/O — User I/O bank (remaining) |
| دبوس 105 | I/O — User I/O bank (remaining) |
| دبوس 106 | I/O — User I/O bank (remaining) |
| دبوس 107 | VCCIO — I/O supply (3.3 V or 2.5 V) |
| دبوس 108 | I/O — User I/O bank (remaining) |
| دبوس 109 | I/O — User I/O bank (remaining) |
| دبوس 110 | I/O — User I/O bank (remaining) |
| دبوس 111 | I/O — User I/O bank (remaining) |
| دبوس 112 | GND — Ground |
| دبوس 113 | I/O — User I/O bank (remaining) |
| دبوس 114 | I/O — User I/O bank (remaining) |
| دبوس 115 | I/O — User I/O bank (remaining) |
| دبوس 116 | I/O — User I/O bank (remaining) |
| دبوس 117 | VCCINT — Core supply 1.8 V |
| دبوس 118 | I/O — User I/O bank (remaining) |
| دبوس 119 | I/O — User I/O bank (remaining) |
| دبوس 120 | I/O — User I/O bank (remaining) |
| دبوس 121 | I/O — User I/O bank (remaining) |
| دبوس 122 | GND — Ground |
| دبوس 123 | I/O — User I/O bank (remaining) |
| دبوس 124 | I/O — User I/O bank (remaining) |
| دبوس 125 | I/O — User I/O bank (remaining) |
| دبوس 126 | I/O — User I/O bank (remaining) |
| دبوس 127 | VCCIO — I/O supply (3.3 V or 2.5 V) |
| دبوس 128 | I/O — User I/O bank (remaining) |
| دبوس 129 | I/O — User I/O bank (remaining) |
| دبوس 130 | I/O — User I/O bank (remaining) |
| دبوس 131 | I/O — User I/O bank (remaining) |
| دبوس 132 | GND — Ground |
| دبوس 133 | I/O — User I/O bank (remaining) |
| دبوس 134 | I/O — User I/O bank (remaining) |
| دبوس 135 | I/O — User I/O bank (remaining) |
| دبوس 136 | I/O — User I/O bank (remaining) |
| دبوس 137 | VCCINT — Core supply 1.8 V |
| دبوس 138 | I/O — User I/O bank (remaining) |
| دبوس 139 | I/O — User I/O bank (remaining) |
| دبوس 140 | I/O — User I/O bank (remaining) |
| دبوس 141 | I/O — User I/O bank (remaining) |
| دبوس 142 | GND — Ground |
| دبوس 143 | I/O — User I/O bank (remaining) |
| دبوس 144 | I/O — User I/O bank (remaining) |
التطبيقات النموذجية
EP20K30ETC144-1 مناسب لـ 6 التطبيقs: Legacy Communications Glue Logic, Industrial Control Interface Bridge, Custom Peripheral Bridge for Embedded CPUs, Low-Density Data-Path Acceleration, Legacy System Upgrade / Form-Fit Replacement, Prototype / Educational FPGA Platform.
Legacy Communications Glue Logic
The EP20K30ETC144-1 fits communications glue-logic applications because its 1,200 logic elements and 192 macrocells can implement bridge logic between microprocessors, DSPs, and peripheral buses without the cost of a larger FPGA. The 160 MHz internal frequency and 1.68 ns propagation delay accommodate protocol converters (UART-to-SPI, I2C-to-parallel) and FIFO-based data routing typical in telecom backplane designs. With 92 user I/Os it provides enough pins for 16-bit data buses plus control, and the 144-pin TQFP is hand-solderable for prototype rework.
موصى به
Industrial Control Interface Bridge
For industrial control interfaces the EP20K30ETC144-1 provides MultiCore architecture integrating LUT logic, product-term logic, and embedded array blocks for protocol translation between PLC backplanes and external sensors. Its 0 C to 85 C operating temperature and 1.8 V core supply match legacy industrial-grade designs, while 92 user I/Os accommodate 32-bit parallel I/O expansion modules. The 144-pin TQFP footprint is drop-in compatible with the larger APEX-20K parts, enabling density upgrades on the same PCB.
موصى به
Custom Peripheral Bridge for Embedded CPUs
The EP20K30ETC144-1 is well suited as a custom peripheral bridge for embedded CPUs because its MultiCore architecture lets designers implement both register-mapped peripherals and FIFO-based DMA channels on a single die. The 192 macrocells handle address decoding and chip-select generation, while the embedded array blocks provide small dual-port RAM buffers for handshaking between CPU and external peripherals. With 92 I/Os the device easily accommodates 8/16/32-bit external buses plus interrupt and DMA handshaking.
موصى به
Low-Density Data-Path Acceleration
For low-density data-path acceleration the EP20K30ETC144-1 delivers 1,200 logic elements that can implement CRC engines, hash units, or small packet parsers alongside an embedded CPU. Its 160 MHz internal frequency and 1.68 ns propagation delay are sufficient for gigabit Ethernet preamble processing or SATA link-layer state machines when paired with an external PHY. The 144-pin TQFP package and 1.8 V core supply simplify PCB layout for FPGA-assisted ASIC prototypes.
موصى به
Legacy System Upgrade / Form-Fit Replacement
The EP20K30ETC144-1 is commonly used as a form-fit-function replacement in legacy system upgrades because it retains the original APEX-20KE die in the proven 144-pin TQFP footprint. Design teams sustaining equipment deployed in the early 2000s use this part to avoid PCB rework while refreshing programmable-logic content. The X-suffixed variant (EP20K30ETC144-1X) is preferred for new production builds because it carries full Altera/Intel traceability documentation.
موصى به
Prototype / Educational FPGA Platform
For prototype and educational FPGA platforms the EP20K30ETC144-1 provides 1,200 logic elements at low unit cost in a hand-solderable 144-pin TQFP package, making it suitable for university courses and small-form-factor FPGA development boards. The MultiCore architecture lets students explore both LUT-based and product-term logic design patterns on a single device, and the 92 user I/Os provide enough pins for breadboard-friendly breakout. Legacy Quartus II toolchains (free) still support the APEX-20KE family for classroom use.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP20K30ETC144-1 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP20K30ETC144-1X | EP20K100ETC144-1N | EP20K160ETC144-2N | EP20K100ETC144-2N | EP20K100ETC144-1X |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Series / Family | APEX-20KE | APEX-20KE | APEX-20K | APEX-20K | APEX-20K | APEX-20K |
| Logic Gates | 30,000 | 30,000 (same die) | 100,000 (+233%) | 160,000 (+433%) | 100,000 (+233%) | 100,000 (+233%) |
| Logic Elements | 1,200 | 1,200 (same die) | 4,160 (+247%) | 6,400 (+433%) | 4,160 (+247%) | 4,160 (+247%) |
| User I/Os | 92 | 92 (same) | 92 (same) | 92 (same) | 92 (same) | 92 (same) |
| Core Voltage | 1.71 V to 1.89 V (1.8 V) | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) |
| Speed Grade | -1 (fastest) | -1 (same) | -1 (same) | -2 (slightly slower) | -2 (slightly slower) | -1 (same) |
| Lifecycle Status | NRND | Active (Rochester franchise) | NRND | NRND | NRND | NRND |
أبرز الفروقات
- MultiCore architecture combines LUT, product-term logic, and EABs (مقابلEP20K100ETC144-1N)
- Lowest unit cost within the APEX-20KE family (مقابلEP20K160ETC144-2N)
- Hand-solderable TQFP-144 footprint for prototype rework (مقابلEP20K30EFC144-1N)
ملاحظات التصميم
Estimated: EP20K30ETC144-1 core and I/O supplies must be brought up in sequence per the APEX-20KE datasheet: VCCINT (1.8 V core) first, then VCCIO (3.3 V or 2.5 V I/O bank). Reverse sequencing can cause latch-up. Place one 0.1 uF ceramic and one 10 uF bulk capacitor within 5 mm of every VCCINT and VCCIO pin pair; use a ground plane to provide low-impedance return paths for switching transients. The -1 speed grade draws approximately 100-200 mA typical core current at 160 MHz, so the 1.8 V regulator must deliver at least 500 mA with headroom.
The 144-pin TQFP package has 0.5 mm terminal pitch, requiring PCB land patterns per IPC-7351 (LQFP-144 with 20x20 mm body). Use 4-layer stackup with dedicated ground and power planes; route all 92 user I/Os on the top layer with via-in-pad only if the assembly house supports microvia technology. Place configuration memory (EPC2LC20 or compatible) within 50 mm of the FPGA to keep DCLK/Data0 traces short and avoid setup/hold violations during configuration.
Do not confuse the APEX-20KE family with the original APEX-20K family: 20KE parts have additional MultiCore features (embedded array block improvements, JTAG support enhancements) but share the same Quartus design flow. The nCONFIG pin must be held low during power-up ramp and then released high after VCCINT and VCCIO reach regulation; an improperly sequenced nCONFIG release is the most common cause of configuration failure. Use the Altera/Intel Quartus II (legacy) or Quartus Prime with APEX-20KE device support to compile bitstreams.
معلومات الامتثال
APEX-20KE family predates widespread RoHS adoption; explicit compliance statements are not published in the verified web data. AEC-Q100 not applicable for commercial/industrial grade FPGAs. Conflict-minerals compliance assumed per Altera/Intel supply-chain disclosures.
