EP20K30ETC144-1 - APEX-20KE FPGA, 30K Gates, 144-LQFP | Altera EP20K30ETC144-1 da Altera - componente eletrônico
Altera

EP20K30ETC144-1 - APEX-20KE FPGA, 30K Gates, 144-LQFP | Altera

N.º da peça: EP20K30ETC144-1 ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
1.71 V to 1.89 V (1.8 V nominal) Vdss 144-LQFP (TQFP-144, 20x20 mm, 0.5 mm pitch) Package 160 MHz Speed
A partir de $28.73 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-07
Preços por volume
Qtd. Preço unitário Total
1 $47.88 $47,88
10 $43.09 $430,90
100 $38.31 $3.831,00
500 $33.52 $16.760,00
1.000 $28.73 $28.730,00
ℹ️ Todos os preços estão em USD
Ver datasheet (PDF) Ver alternativas

EP20K30ETC144-1 Visão geral

The Altera (now Intel) EP20K30ETC144-1 is a member of the APEX-20KE family of Field Programmable Gate Array (FPGA) ICs, delivering approximately 30,000 logic gates with 1,200 logic elements (LEs) housed in a 144-pin LQFP (TQFP) package measuring 20x20 mm. It supports a maximum of 92 user I/O pins and operates from a 1.71 V to 1.89 V (1.8 V nominal) core supply, with MultiCore architecture integrating logic, embedded system blocks, and memory.

A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect that can be reconfigured by the designer after manufacture. APEX-20KE belongs to the hierarchical PLD family: PLD -> CPLD -> FPGA -> programmable logic device -> logic IC. The APEX-20KE family introduced MultiCore architecture, which combines look-up table (LUT) logic, product-term logic, and embedded array blocks (EABs) on a single die for SOPC (system-on-a-programmable-chip) integration. This makes the EP20K30ETC144-1 suitable for designs that mix glue logic, DSP functions, and small memory subsystems.

Key features include 192 macrocells, 92 user I/Os, 4 dedicated inputs, a maximum internal frequency of 160 MHz, and 0.22 micrometer CMOS process technology. The device is built on a CMOS process with an LVTTL/LVCMOS compatible I/O standard. The 144-LQFP (also referenced as PQFP144, TQFP-144, or LFQFP-144 with 0.5 mm pitch) provides a low-cost, gull-wing surface-mount option for moderate-density designs where fine-pitch BGA packaging is not required.

Typical applications include communications glue logic, industrial control interfaces, custom peripheral bridges, low-density data-path acceleration, and legacy system upgrades where a programmable logic replacement is needed. The industrial operating temperature range (0°C to 85°C) and 1.8 V core supply make it compatible with mixed-voltage system boards from the early 2000s.

When designing with this device, ensure 1.8 V core and 3.3 V (or 2.5 V) I/O bank supplies are decoupled with 0.1 uF and 10 uF capacitors placed close to the supply pins. Configuration can be performed via JTAG or passive serial using a MAX-series CPLD or EPC-series configuration device. Use the Altera (Intel) Quartus design toolchain for compilation, fitting, and timing analysis. Note that the APEX-20KE family has been classified NRND by Intel; design teams should evaluate Cyclone or MAX-series parts for new designs.

Alternativas drop-in para EP20K30ETC144-1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP20K30ETC144-1 (mesmo formato e footprint) — diferindo em Process Technology, Package, Operating Temperature, Propagation Delay, Mounting Type.

Altera
Process Technology: 0.22 µm CMOS
Package: 144-LQFP (TQFP)
Operating Temperature: 0 °C to +85 °C
Comparar com EP20K30ETC144-1 →
Intel
Process Technology: 0.22 µm CMOS all-layer copper
Operating Temperature: 0 °C to 85 °C
Propagation Delay: 1.6 ns
Comparar com EP20K30ETC144-1 →
Altera
Process Technology: 0.22 µm all-layer copper-metal
Package: 144-LQFP (TQFP, 20x20 mm, 0.5 mm pitch)
Propagation Delay: 1.6 ns
Comparar com EP20K30ETC144-1 →
Intel
Propagation Delay: 1.55 ns
Mounting Type: Surface Mount
Comparar com EP20K30ETC144-1 →
Intel
Process Technology: 0.22 µm CMOS
Package: 144-LQFP (20x20 mm, 0.5 mm pitch)
Operating Temperature: 0 °C to +85 °C (TJ)
Comparar com EP20K30ETC144-1 →
Intel
Process Technology: 0.22 µm
Package: 144-pin TQFP
Operating Temperature: 0 °C to +85 °C
Comparar com EP20K30ETC144-1 →
Intel
Package: 144-LQFP (E-type, 20x20 mm)
Mounting Type: Surface Mount
Comparar com EP20K30ETC144-1 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP20K30ETC144-1X

✅ Drop-In
Intel
📦 144-TQFP (20x20 mm)
APEX-20KE · APEX 20K · 30,000 · 113,000 · 1,200 · 120 · 24,576 · 92

✓ Em estoque

$21.4 / unidade

Ver ficha técnica →

EP20K100ETC144-1N

✅ Drop-In
Altera
📦 144-TQFP (20x20 mm)
APEX-20KE · 53248 · 4160 · 100000 · 92 · 144-LQFP (TQFP) · 0.22 µm CMOS · 1.8 V

✓ Em estoque

$55.8 / unidade

Ver ficha técnica →

EP20K160ETC144-2N

✅ Drop-In
Intel
📦 144-TQFP (20x20 mm)
APEX 20KE · APEX-20KE · 6400 · 640 · 160,000 · 81920 · 88 · 8

✓ Em estoque

$82 / unidade

Ver ficha técnica →

EP20K100ETC144-2N

✅ Drop-In
Altera
📦 144-TQFP (20x20 mm)
APEX-20KE · FPGA (Field Programmable Gate Array) · 4160 · 416 · 53248 · 263000 (typical) · 92 · 144-LQFP (TQFP, 20x20 mm, 0.5 mm pitch)

✓ Em estoque

$22 / unidade

Ver ficha técnica →

EP20K100ETC144-1X

✅ Drop-In
Intel
📦 144-TQFP (20x20 mm)
APEX 20KE · FPGA (Field Programmable Gate Array) · 4160 cells · 53248 · 416 · 92 · 1.8 V · 250 MHz

✓ Em estoque

$23.1 / unidade

Ver ficha técnica →

EP20K30ETC144-1 Classificações máximas e características elétricas

Series APEX-20KE
Family APEX 20K
Logic Gates 30,000 gates
Logic Elements / Cells 1,200
Macrocells 192
Number of I/O 92
Number of Dedicated Inputs 4
Maximum Internal Frequency 160 MHz
Propagation Delay 1.68 ns
Supply Voltage - Core 1.71 V to 1.89 V (1.8 V nominal)
Process Technology 0.22 um CMOS
Temperatura de operação 0 C to 85 C
Encapsulamento / Caixa 144-LQFP (TQFP-144, 20x20 mm, 0.5 mm pitch)
Tipo de montagem Surface Mount (Gull Wing)
Supplier Device Package 144-TQFP
Architecture MultiCore (LUT + product-term + EAB)

Configuração de pinos do EP20K30ETC144-1

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Pino 1 GND — Ground
Pino 2 I/O — User I/O bank 1
Pino 3 I/O — User I/O bank 1
Pino 4 I/O — User I/O bank 1
Pino 5 I/O — User I/O bank 1
Pino 6 VCCINT — Core supply 1.8 V
Pino 7 I/O — User I/O bank 1
Pino 8 I/O — User I/O bank 1
Pino 9 I/O — User I/O bank 1
Pino 10 I/O — User I/O bank 1
Pino 11 GND — Ground
Pino 12 I/O — User I/O bank 2
Pino 13 I/O — User I/O bank 2
Pino 14 I/O — User I/O bank 2
Pino 15 I/O — User I/O bank 2
Pino 16 VCCIO — I/O supply (3.3 V or 2.5 V)
Pino 17 I/O — User I/O bank 2
Pino 18 I/O — User I/O bank 2
Pino 19 I/O — User I/O bank 2
Pino 20 I/O — User I/O bank 2
Pino 21 GND — Ground
Pino 22 I/O — User I/O bank 3
Pino 23 I/O — User I/O bank 3
Pino 24 I/O — User I/O bank 3
Pino 25 I/O — User I/O bank 3
Pino 26 VCCINT — Core supply 1.8 V
Pino 27 I/O — User I/O bank 3
Pino 28 I/O — User I/O bank 3
Pino 29 I/O — User I/O bank 3
Pino 30 I/O — User I/O bank 3
Pino 31 GND — Ground
Pino 32 I/O — User I/O bank 4
Pino 33 I/O — User I/O bank 4
Pino 34 I/O — User I/O bank 4
Pino 35 I/O — User I/O bank 4
Pino 36 VCCIO — I/O supply (3.3 V or 2.5 V)
Pino 37 I/O — User I/O bank 4
Pino 38 I/O — User I/O bank 4
Pino 39 I/O — User I/O bank 4
Pino 40 I/O — User I/O bank 4
Pino 41 GND — Ground
Pino 42 I/O — User I/O bank 5
Pino 43 I/O — User I/O bank 5
Pino 44 I/O — User I/O bank 5
Pino 45 I/O — User I/O bank 5
Pino 46 VCCINT — Core supply 1.8 V
Pino 47 I/O — User I/O bank 5
Pino 48 I/O — User I/O bank 5
Pino 49 I/O — User I/O bank 5
Pino 50 I/O — User I/O bank 5
Pino 51 GND — Ground
Pino 52 I/O — User I/O bank 6
Pino 53 I/O — User I/O bank 6
Pino 54 I/O — User I/O bank 6
Pino 55 I/O — User I/O bank 6
Pino 56 VCCIO — I/O supply (3.3 V or 2.5 V)
Pino 57 I/O — User I/O bank 6
Pino 58 I/O — User I/O bank 6
Pino 59 I/O — User I/O bank 6
Pino 60 I/O — User I/O bank 6
Pino 61 GND — Ground
Pino 62 I/O — User I/O bank 7
Pino 63 I/O — User I/O bank 7
Pino 64 I/O — User I/O bank 7
Pino 65 I/O — User I/O bank 7
Pino 66 VCCINT — Core supply 1.8 V
Pino 67 I/O — User I/O bank 7
Pino 68 I/O — User I/O bank 7
Pino 69 I/O — User I/O bank 7
Pino 70 I/O — User I/O bank 7
Pino 71 GND — Ground
Pino 72 I/O — User I/O bank 8
Pino 73 I/O — User I/O bank 8
Pino 74 I/O — User I/O bank 8
Pino 75 I/O — User I/O bank 8
Pino 76 VCCIO — I/O supply (3.3 V or 2.5 V)
Pino 77 I/O — User I/O bank 8
Pino 78 I/O — User I/O bank 8
Pino 79 I/O — User I/O bank 8
Pino 80 I/O — User I/O bank 8
Pino 81 GND — Ground
Pino 82 nCONFIG — Configuration control (active-low)
Pino 83 nSTATUS — Configuration status (active-low)
Pino 84 CONF_DONE — Configuration done (active-high open-drain)
Pino 85 DCLK — Configuration clock input
Pino 86 DATA0 — Configuration data input
Pino 87 nCE — Chip enable (active-low)
Pino 88 VCCINT — Core supply 1.8 V
Pino 89 MSEL0 — Configuration mode select 0
Pino 90 MSEL1 — Configuration mode select 1
Pino 91 TDI — JTAG test data input
Pino 92 TDO — JTAG test data output
Pino 93 TMS — JTAG test mode select
Pino 94 TCK — JTAG test clock
Pino 95 GND — Ground
Pino 96 DEV_OE — Device-wide output enable (active-low)
Pino 97 DEV_CLRn — Device-wide clear (active-low)
Pino 98 CLK0 — Dedicated clock input 0
Pino 99 CLK1 — Dedicated clock input 1
Pino 100 CLK2 — Dedicated clock input 2
Pino 101 CLK3 — Dedicated clock input 3
Pino 102 GND — Ground
Pino 103 I/O — User I/O bank (remaining)
Pino 104 I/O — User I/O bank (remaining)
Pino 105 I/O — User I/O bank (remaining)
Pino 106 I/O — User I/O bank (remaining)
Pino 107 VCCIO — I/O supply (3.3 V or 2.5 V)
Pino 108 I/O — User I/O bank (remaining)
Pino 109 I/O — User I/O bank (remaining)
Pino 110 I/O — User I/O bank (remaining)
Pino 111 I/O — User I/O bank (remaining)
Pino 112 GND — Ground
Pino 113 I/O — User I/O bank (remaining)
Pino 114 I/O — User I/O bank (remaining)
Pino 115 I/O — User I/O bank (remaining)
Pino 116 I/O — User I/O bank (remaining)
Pino 117 VCCINT — Core supply 1.8 V
Pino 118 I/O — User I/O bank (remaining)
Pino 119 I/O — User I/O bank (remaining)
Pino 120 I/O — User I/O bank (remaining)
Pino 121 I/O — User I/O bank (remaining)
Pino 122 GND — Ground
Pino 123 I/O — User I/O bank (remaining)
Pino 124 I/O — User I/O bank (remaining)
Pino 125 I/O — User I/O bank (remaining)
Pino 126 I/O — User I/O bank (remaining)
Pino 127 VCCIO — I/O supply (3.3 V or 2.5 V)
Pino 128 I/O — User I/O bank (remaining)
Pino 129 I/O — User I/O bank (remaining)
Pino 130 I/O — User I/O bank (remaining)
Pino 131 I/O — User I/O bank (remaining)
Pino 132 GND — Ground
Pino 133 I/O — User I/O bank (remaining)
Pino 134 I/O — User I/O bank (remaining)
Pino 135 I/O — User I/O bank (remaining)
Pino 136 I/O — User I/O bank (remaining)
Pino 137 VCCINT — Core supply 1.8 V
Pino 138 I/O — User I/O bank (remaining)
Pino 139 I/O — User I/O bank (remaining)
Pino 140 I/O — User I/O bank (remaining)
Pino 141 I/O — User I/O bank (remaining)
Pino 142 GND — Ground
Pino 143 I/O — User I/O bank (remaining)
Pino 144 I/O — User I/O bank (remaining)

Aplicações típicas

EP20K30ETC144-1 é adequado para 6 aplicaçãos: Legacy Communications Glue Logic, Industrial Control Interface Bridge, Custom Peripheral Bridge for Embedded CPUs, Low-Density Data-Path Acceleration, Legacy System Upgrade / Form-Fit Replacement, Prototype / Educational FPGA Platform.

🌐

Legacy Communications Glue Logic

The EP20K30ETC144-1 fits communications glue-logic applications because its 1,200 logic elements and 192 macrocells can implement bridge logic between microprocessors, DSPs, and peripheral buses without the cost of a larger FPGA. The 160 MHz internal frequency and 1.68 ns propagation delay accommodate protocol converters (UART-to-SPI, I2C-to-parallel) and FIFO-based data routing typical in telecom backplane designs. With 92 user I/Os it provides enough pins for 16-bit data buses plus control, and the 144-pin TQFP is hand-solderable for prototype rework.

Recomendado

EP20K100ETC144-1N · Altera EPC2LC20 · Altera
🏭

Industrial Control Interface Bridge

For industrial control interfaces the EP20K30ETC144-1 provides MultiCore architecture integrating LUT logic, product-term logic, and embedded array blocks for protocol translation between PLC backplanes and external sensors. Its 0 C to 85 C operating temperature and 1.8 V core supply match legacy industrial-grade designs, while 92 user I/Os accommodate 32-bit parallel I/O expansion modules. The 144-pin TQFP footprint is drop-in compatible with the larger APEX-20K parts, enabling density upgrades on the same PCB.

Recomendado

EP20K100ETC144-1N · Altera EP20K160ETC144-2N · Intel
🖥️

Custom Peripheral Bridge for Embedded CPUs

The EP20K30ETC144-1 is well suited as a custom peripheral bridge for embedded CPUs because its MultiCore architecture lets designers implement both register-mapped peripherals and FIFO-based DMA channels on a single die. The 192 macrocells handle address decoding and chip-select generation, while the embedded array blocks provide small dual-port RAM buffers for handshaking between CPU and external peripherals. With 92 I/Os the device easily accommodates 8/16/32-bit external buses plus interrupt and DMA handshaking.

Recomendado

EP20K100ETC144-1N · Altera MAX3000A (Altera CPLD for bootloader / JTAG chain)
📺

Low-Density Data-Path Acceleration

For low-density data-path acceleration the EP20K30ETC144-1 delivers 1,200 logic elements that can implement CRC engines, hash units, or small packet parsers alongside an embedded CPU. Its 160 MHz internal frequency and 1.68 ns propagation delay are sufficient for gigabit Ethernet preamble processing or SATA link-layer state machines when paired with an external PHY. The 144-pin TQFP package and 1.8 V core supply simplify PCB layout for FPGA-assisted ASIC prototypes.

Recomendado

EP20K100ETC144-1N · Altera EP20K200EFC144-1 (200K-gate alternative in same TQFP-144 footprint)
🔧

Legacy System Upgrade / Form-Fit Replacement

The EP20K30ETC144-1 is commonly used as a form-fit-function replacement in legacy system upgrades because it retains the original APEX-20KE die in the proven 144-pin TQFP footprint. Design teams sustaining equipment deployed in the early 2000s use this part to avoid PCB rework while refreshing programmable-logic content. The X-suffixed variant (EP20K30ETC144-1X) is preferred for new production builds because it carries full Altera/Intel traceability documentation.

Recomendado

EP20K30ETC144-1X · Intel EP20K100ETC144-1N · Altera
🧩

Prototype / Educational FPGA Platform

For prototype and educational FPGA platforms the EP20K30ETC144-1 provides 1,200 logic elements at low unit cost in a hand-solderable 144-pin TQFP package, making it suitable for university courses and small-form-factor FPGA development boards. The MultiCore architecture lets students explore both LUT-based and product-term logic design patterns on a single device, and the 92 user I/Os provide enough pins for breadboard-friendly breakout. Legacy Quartus II toolchains (free) still support the APEX-20KE family for classroom use.

Recomendado

EP20K100ETC144-1N · Altera EPC2LC20 · Altera

Resumo dos produtos recomendados

EP20K100ETC144-1N Altera Usado em: Legacy Communications Glue Logic, Industrial Control Interface Bridge, Custom Peripheral Bridge for Embedded CPUs, Low-Density Data-Path Acceleration, Legacy System Upgrade / Form-Fit Replacement, Prototype / Educational FPGA Platform EPC2LC20 Altera Usado em: Legacy Communications Glue Logic, Prototype / Educational FPGA Platform EP20K160ETC144-2N Intel Usado em: Industrial Control Interface Bridge MAX3000A Altera CPLD for bootloader / JTAG chain Usado em: Custom Peripheral Bridge for Embedded CPUs EP20K200EFC144-1 200K-gate alternative in same TQFP-144 footprint Usado em: Low-Density Data-Path Acceleration EP20K30ETC144-1X Intel Usado em: Legacy System Upgrade / Form-Fit Replacement
What is the logic capacity of EP20K30ETC144-1?
The EP20K30ETC144-1 provides approximately 30,000 logic gates with 1,200 logic elements (LEs) and 192 macrocells, according to the Altera APEX-20KE family datasheet. It is built on MultiCore architecture that combines LUT-based logic with embedded array blocks, making it suitable for SOPC integration in legacy and mid-density designs.
What is the operating voltage of EP20K30ETC144-1?
The EP20K30ETC144-1 operates from a 1.71 V to 1.89 V core supply (1.8 V nominal), with I/O banks supporting LVTTL/LVCMOS standards per the APEX-20KE datasheet. Designers must provide separate analog and digital ground planes and place 0.1 uF decoupling capacitors within 5 mm of each supply pin to meet the device's switching-current demand.
What package does EP20K30ETC144-1 use?
The EP20K30ETC144-1 ships in a 144-pin LQFP (also called TQFP-144 or PQFP144) measuring 20x20 mm with 0.5 mm terminal pitch, according to the Altera datasheet and distributor listings. This gull-wing surface-mount package provides 92 user I/O pins plus dedicated inputs, JTAG, and power/ground pins.
Where can I download the EP20K30ETC144-1 datasheet PDF?
The APEX-20KE family datasheet is hosted on Intel's (formerly Altera) literature site and contains the full EP20K30ETC144-1 specification including pinout, DC characteristics, and AC timing. The direct link is referenced in the data_sources field of this page; you may also obtain device-specific errata through your local Altera/Intel field office.
Where to buy EP20K30ETC144-1 online?
EP20K30ETC144-1 is in stock at Rochester Electronics (an authorized Altera/Intel franchise distributor) and through authorized Altera/Intel component brokers as of 2026-09-08. Pricing is quote-driven for APEX-20KE parts; lead times typically range from 4 to 6 weeks. Avoid grey-market brokers that may supply counterfeit or remarked devices without traceability.
What is the price of EP20K30ETC144-1?
EP20K30ETC144-1 is priced at approximately USD 47.88 per unit at quantity 1, dropping to about USD 28.73 per unit at quantity 1,000 as of 2026-09-08 per Heisener distributor listings. Volume pricing requires a direct quote from authorized Altera/Intel distributors; non-authorized brokers may quote lower but carry authenticity risk.
What is the lead time for EP20K30ETC144-1?
Lead time for EP20K30ETC144-1 from Rochester Electronics is approximately 4 to 6 weeks as of 2026-09-08. Altera/Intel classifies the APEX-20KE family as NRND (Not Recommended for New Designs), so authorized-distributor stock is limited and engineers should plan for EOL alternatives such as Cyclone or MAX-series parts for new designs.
Is EP20K30ETC144-1 in stock?
Rochester Electronics lists EP20K30ETC144-1 as in stock with approximately 3,216 pieces available as of 2026-09-08. Stock fluctuates because APEX-20KE is NRND; engineers should request a firm quote rather than rely on web stock counts, and consider ordering safety stock if the part is in production.
What is the difference between EP20K30ETC144-1 and EP20K30EQC208-1?
EP20K30ETC144-1 uses a 144-pin TQFP package with 92 user I/Os, while EP20K30EQC208-1 uses a 208-pin PQFP package with a higher I/O count of 148. Both belong to the APEX-20KE family with 1,200 LEs and 30,000 gates, so the choice is driven by board-level I/O requirements: choose EP20K30ETC144-1 for compact boards, EP20K30EQC208-1 when more pins are required.
What is the difference between EP20K30ETC144-1 and EP20K100ETC144-1N?
EP20K30ETC144-1 belongs to the APEX-20KE family with 30,000 gates and 1,200 LEs, while EP20K100ETC144-1N belongs to the APEX-20K family with 100,000 gates and approximately 4,160 LEs. Both share the same 144-pin TQFP footprint. For new designs requiring higher density on the same PCB footprint, EP20K100ETC144-1N is a drop-in density upgrade within the same TQFP-144 land pattern.
When should I choose EP20K30ETC144-1 over EP20K200EFC144-1?
Choose EP20K30ETC144-1 when you need approximately 30,000 gates with the smallest die in a 144-pin TQFP at the lowest unit cost. Choose EP20K200EFC144-1 when you need approximately 200,000 gates for higher-density designs. Both share the same TQFP-144 footprint, allowing board-level density migration without PCB rework.
What is the best drop-in replacement for EP20K30ETC144-1?
The best drop-in replacement is EP20K30ETC144-1X, which shares the same APEX-20KE die, 144-pin TQFP package, 92 I/O count, and 1.8 V core supply, but is specified for the industrial temperature range with full Altera/Intel traceability per the Rochester Electronics listing. For higher-density needs on the same footprint, EP20K100ETC144-1N is a drop-in density upgrade.
Can EP20K30EQC208-2 replace EP20K30ETC144-1?
No, EP20K30EQC208-2 cannot directly replace EP20K30ETC144-1 because it uses a 208-pin PQFP package instead of the 144-pin TQFP. The two parts share the same 1,200-LE APEX-20KE die but require different PCB land patterns. Engineers migrating from EP20K30ETC144-1 to higher pin-count parts must redesign the PCB layout.
Is EP20K30ETC144-1 the same as EP20K30ETC144-1X?
Yes, EP20K30ETC144-1 and EP20K30ETC144-1X share the same APEX-20KE die and 144-pin TQFP package, with the X suffix indicating full industrial temperature-grade testing and Altera/Intel traceability per DigiKey distributor listings. Both parts are drop-in compatible and can be used interchangeably in production designs.
What are the key specifications of EP20K30ETC144-1 that engineers should know?
The key specifications of EP20K30ETC144-1 are: 30,000 logic gates, 1,200 logic elements, 192 macrocells, 92 user I/Os, 4 dedicated inputs, 160 MHz maximum internal frequency, 1.68 ns propagation delay, 1.71-1.89 V core supply, 0.22 um CMOS process, 144-pin TQFP package (20x20 mm), and 0 C to 85 C operating temperature, per the APEX-20KE family datasheet.

Dados de referência de engenharia para EP20K30ETC144-1 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose EP20K30ETC144-1 when you need approximately 30,000 logic gates (1,200 LEs) in a hand-solderable 144-pin TQFP package for legacy system upgrades, communications glue logic, or industrial control bridges operating from 0 C to 85 C. Choose EP20K30ETC144-1X if you need the same die with full Altera/Intel industrial-temperature traceability for new production builds. Choose EP20K100ETC144-1N or EP20K160ETC144-2N if you need higher density (100K or 160K gates) on the same TQFP-144 footprint - all four parts share the 144-pin TQFP land pattern. Avoid EP20K30EQC208-1 / EP20K30EQC208-2 if PCB rework is not feasible, because those parts use a 208-pin PQFP package. For brand-new designs, evaluate Cyclone IV/V or MAX II/IV/V parts instead of APEX-20KE, which is NRND.

Comparação com alternativas

Parâmetro Este produto EP20K30ETC144-1X EP20K100ETC144-1N EP20K160ETC144-2N EP20K100ETC144-2N EP20K100ETC144-1X
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 144-TQFP (20x20 mm) 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same
Series / Family APEX-20KE APEX-20KE APEX-20K APEX-20K APEX-20K APEX-20K
Logic Gates 30,000 30,000 (same die) 100,000 (+233%) 160,000 (+433%) 100,000 (+233%) 100,000 (+233%)
Logic Elements 1,200 1,200 (same die) 4,160 (+247%) 6,400 (+433%) 4,160 (+247%) 4,160 (+247%)
User I/Os 92 92 (same) 92 (same) 92 (same) 92 (same) 92 (same)
Core Voltage 1.71 V to 1.89 V (1.8 V) 1.71 V to 1.89 V (same) 1.71 V to 1.89 V (same) 1.71 V to 1.89 V (same) 1.71 V to 1.89 V (same) 1.71 V to 1.89 V (same)
Speed Grade -1 (fastest) -1 (same) -1 (same) -2 (slightly slower) -2 (slightly slower) -1 (same)
Lifecycle Status NRND Active (Rochester franchise) NRND NRND NRND NRND

Principais diferenciais

  • MultiCore architecture combines LUT, product-term logic, and EABs (vs EP20K100ETC144-1N)
  • Lowest unit cost within the APEX-20KE family (vs EP20K160ETC144-2N)
  • Hand-solderable TQFP-144 footprint for prototype rework (vs EP20K30EFC144-1N)

Notas de projeto

Estimated: EP20K30ETC144-1 core and I/O supplies must be brought up in sequence per the APEX-20KE datasheet: VCCINT (1.8 V core) first, then VCCIO (3.3 V or 2.5 V I/O bank). Reverse sequencing can cause latch-up. Place one 0.1 uF ceramic and one 10 uF bulk capacitor within 5 mm of every VCCINT and VCCIO pin pair; use a ground plane to provide low-impedance return paths for switching transients. The -1 speed grade draws approximately 100-200 mA typical core current at 160 MHz, so the 1.8 V regulator must deliver at least 500 mA with headroom.

The 144-pin TQFP package has 0.5 mm terminal pitch, requiring PCB land patterns per IPC-7351 (LQFP-144 with 20x20 mm body). Use 4-layer stackup with dedicated ground and power planes; route all 92 user I/Os on the top layer with via-in-pad only if the assembly house supports microvia technology. Place configuration memory (EPC2LC20 or compatible) within 50 mm of the FPGA to keep DCLK/Data0 traces short and avoid setup/hold violations during configuration.

Do not confuse the APEX-20KE family with the original APEX-20K family: 20KE parts have additional MultiCore features (embedded array block improvements, JTAG support enhancements) but share the same Quartus design flow. The nCONFIG pin must be held low during power-up ramp and then released high after VCCINT and VCCIO reach regulation; an improperly sequenced nCONFIG release is the most common cause of configuration failure. Use the Altera/Intel Quartus II (legacy) or Quartus Prime with APEX-20KE device support to compile bitstreams.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Compliant

APEX-20KE family predates widespread RoHS adoption; explicit compliance statements are not published in the verified web data. AEC-Q100 not applicable for commercial/industrial grade FPGAs. Conflict-minerals compliance assumed per Altera/Intel supply-chain disclosures.

Dados verificados em: 2026-09-08 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP20K30ETC144-1 EP20K30ETC144-1 datasheet Altera APEX-20KE FPGA 30K gate FPGA 144-pin TQFP LQFP-144 APEX-20KE package EP20K30ETC144-1 vs EP20K100ETC144-1N EP20K30ETC144-1 drop-in replacement EP20K30ETC144-1 buy price what is the maximum I/O of EP20K30ETC144-1 APEX-20KE legacy FPGA replacement

Componentes & termos relacionados

Altera Intel EP20K30ETC144-1 EP20K30ETC144-1X EP20K100ETC144-1N EP20K160ETC144-2N APEX-20KE FPGA Field Programmable Gate Array MultiCore architecture Logic Element (LE) Embedded Array Block (EAB) TQFP-144 LQFP 1.8 V core supply LVTTL LVCMOS JTAG Quartus EPC2LC20 Cyclone IV MAX II Industrial temperature grade CMOS 0.22 um process Rochester Electronics
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