EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel
MPN: EP2AGZ225FF35I4G ✓ نشطEP2AGZ225FF35I4G نظرة عامة
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric that the designer configures after manufacture using a hardware-description language (HDL). FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (fixed architecture, software-defined) on the flexibility/performance continuum, occupying the programmable-logic layer of the broader integrated-circuit taxonomy: logic IC -> programmable logic -> FPGA. Arria II GZ specifically targets transceiver-rich applications needing multi-gigabit serial links at lower power than the Stratix family.
Key features of the EP2AGZ225FF35I4G include a 40 nm process node, a logic-element density in the ~225 K LE class, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and on-chip memory blocks suitable for buffering and FIFO applications. The device integrates PCI Express hard IP and external memory interface controllers, allowing direct attachment of DDR3 memory and simplifying board-level design. The 1152-ball FineLine BGA package exposes 554 user I/Os, providing generous fan-out for high-pin-count peripherals.
Architecturally, the Arria II GZ uses an 8-input adaptive logic module (ALM), a hierarchical routing fabric with fractional paths to reduce congestion, and hard PCIe Gen1/Gen2 blocks; combined, these features deliver deterministic timing closure and lower dynamic power than the previous-generation Arria II GX at comparable logic density. Designers typically target this device with Quartus Prime software.
Typical applications include high-speed serial backplane bridging, wireless baseband preprocessing, video broadcast infrastructure, test-and-measurement equipment with custom trigger logic, and defense/aerospace signal processing. Industrial-grade temperature rating also suits outdoor or ruggedized deployments.
When designing with this device, pay close attention to power-rail sequencing (multiple VCC rails of different voltages), transceiver reference-clock jitter, and BGA breakout routing - the 1152-ball FBGA requires HDI PCB stack-ups with microvia-in-pad for escape. Reference Altera's Arria II GZ handbook for transceiver and memory-interface guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the Arria II GZ family, and practical board-design considerations not consolidated in the manufacturer datasheet.
بدائل مباشرة لـ EP2AGZ225FF35I4G — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP2AGZ225FF35I4G (نفس عامل الشكل والبصمة) — يختلف في Package, Speed Grade, RoHS Status, Embedded Memory, Transceivers.
EP2AGZ225FF35I3G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35I3N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35C4G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35C4N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35C3G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35C3N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP2AGZ225FF35I4G الحدود القصوى والخصائص الكهربائية
| Family | Arria II GZ |
| Logic Elements | ~224,000 LE |
| Process Node | 40 nm |
| Number of I/O | 554 user I/O |
| Package Type | 1152-ball FineLine BGA (FBGA) |
| Package Code | FF35 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 |
| Embedded Transceivers | Multi-gigabit (per datasheet) |
| DSP Blocks | Yes (per Arria II GZ family) |
| Embedded Memory | Yes (per Arria II GZ family) |
| PCI Express Hard IP | Yes (Gen1/Gen2) |
| External Memory Interface | DDR3 controller (per family) |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Compliant (per distributor listing) |
| Lead-Free | Yes (per distributor listing) |
دليل تكوين أطراف EP2AGZ225FF35I4G ff35
تكوين الأطراف لـ EP2AGZ225FF35I4G (حزمة ff35). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP2AGZ225FF35I4G.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP2AGZ225FF35I4G مناسب لـ 6 التطبيقs: High-Speed Serial Backplane Bridging, Wireless Baseband Preprocessing, Video Broadcast Infrastructure, Test and Measurement Equipment, Industrial Automation and Control, Defense and Aerospace Signal Processing.
High-Speed Serial Backplane Bridging
The EP2AGZ225FF35I4G is well suited for high-speed serial backplane bridging across telecom and datacom line cards. Its embedded multi-gigabit transceivers deliver multi-gigabit per lane (per Arria II GZ family specification), while the ~224K logic elements provide the protocol state machines for SATA, SRIO, or custom serial links. The 554 user I/Os in the 1152-FBGA package expose enough parallel GPIO to drive multiple bridges simultaneously, and the industrial -40C to +100C temperature grade supports outdoor and central-office deployments.
موصى به
Wireless Baseband Preprocessing
The EP2AGZ225FF35I4G fits wireless baseband preprocessing for LTE small-cell and 5G sub-6 GHz radio units. Its dedicated DSP blocks accelerate channelization, FFT/iFFT, and crest-factor-reduction algorithms; the ~224K logic elements support MAC-layer schedulers for multiple sectors; and the embedded transceivers interface directly to RF front-end converters. The industrial temperature rating suits outdoor radio units and tower-top installations, while the 1152-FBGA package provides ample I/O for JESD204B links to ADCs/DACs.
موصى به
Video Broadcast Infrastructure
The EP2AGZ225FF35I4G powers video broadcast routers, multiviewers, and format converters where high-throughput pixel pipelines and serial-interface connectivity coexist. The Arria II GZ family supports 3G-SDI/HD-SDI transceivers, allowing direct attachment of broadcast video I/O without external serializer/deserializer chips. Its ~224K logic elements and DSP blocks handle real-time deinterlacing, scaling, and color-space conversion at full broadcast frame rates. The 1152-FBGA provides 554 user I/Os for parallel video buses and control interfaces in broadcast chassis.
موصى به
Test and Measurement Equipment
The EP2AGZ225FF35I4G suits test and measurement equipment such as oscilloscopes, protocol analyzers, and logic-analyzer front-ends where custom trigger logic and real-time DSP co-exist. The 224K logic elements implement complex state-based trigger sequencers; the DSP blocks accelerate FFT-based spectrum analysis in real time; and the embedded transceivers capture high-speed serial protocols like PCIe Gen2 or USB 3.0. The industrial temperature rating suits laboratory and field-portable T&M equipment.
موصى به
Industrial Automation and Control
The EP2AGZ225FF35I4G supports industrial automation and control designs including multi-axis motor drives, deterministic EtherCAT/IP master controllers, and machine-vision preprocessors. The industrial -40C to +100C temperature rating handles factory-floor environments, while the embedded transceivers drive industrial Ethernet PHYs. The ~224K logic elements host soft-core CPUs (NIOS II/e) and deterministic control loops; the 1152-FBGA package exposes enough I/O for encoder interfaces, GPIO banks, and parallel ADC/DAC chains.
موصى به
Defense and Aerospace Signal Processing
The EP2AGZ225FF35I4G enables defense and aerospace signal-processing subsystems including radar front-end preprocessing, electronic-warfare (EW) channelizers, and software-defined-radio (SDR) basebands. The Arria II GZ family's combination of multi-gigabit transceivers, DSP blocks, and ~224K logic elements handles wideband digital downconversion, polyphase channelization, and adaptive beamforming in real time. The industrial temperature grade supports ground-mobile and shipboard platforms, and the 1152-FBGA package's 554 user I/Os accommodate high-speed ADC/DAC arrays.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP2AGZ225FF35I4G — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP2AGZ225FF35I3G | EP2AGZ225FF35I3N | EP2AGZ225FF35C4G | EP2AGZ225FF35C4N | EP2AGZ225FF35C3G | EP2AGZ225FF35C3N |
|---|---|---|---|---|---|---|---|
| Package | 1152-FBGA (FF35) | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | ~224K LE | ~224K LE | ~224K LE | ~224K LE | ~224K LE | ~224K LE | ~224K LE |
| Speed Grade | I4 (fastest industrial) | I3 | I3 | C4 (commercial) | C4 (commercial) | C3 (commercial) | C3 (commercial) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| User I/O | 554 | 554 | 554 | 554 | 554 | 554 | 554 |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Packaging Form | Tray (G suffix) | Tray | Tray (lead-free) | Tray | Tray (lead-free) | Tray | Tray (lead-free) |
أبرز الفروقات
- Highest speed grade in industrial temperature range (مقابلEP2AGZ225FF35I3G)
- Industrial temperature rating for harsh environments (مقابلEP2AGZ225FF35C4G)
- Lead-free tray packaging for RoHS compliance (مقابلEP2AGZ225FF35I3G)
ملاحظات التصميم
The 1152-FBGA FF35 package requires an HDI PCB stack-up with microvia-in-pad construction for fan-out escape. Use a 1-to-1 microvia array under the BGA, with the inner stack-up providing reference planes for each high-speed transceiver lane. Trace length matching within the transceiver lane should target +/- 0.127 mm per Altera/Intel transceiver design guidelines.
The Arria II GZ family requires multiple independent power rails (VCC, VCCPD, VCCPT, VCCA_PLL, VCCR, VCCT, transceiver VCCE/VCCH) with strict power-up sequencing. Use a multi-rail sequencer such as the LTC2923 or LTM4644 and add sufficient bulk decoupling (typically 220 uF polymer + 10 uF ceramic per rail) close to the BGA. Refer to the device handbook for exact sequencing order to avoid latch-up.
Transceiver reference-clock jitter must be kept below 250 fs RMS for 3.125 Gbps operation. Use a dedicated low-jitter oscillator (e.g., Crystek CVHD-950) and route the clock trace as a 50-ohm controlled-impedance microstrip with ground reference below. For multi-lane designs, maintain at least 3x dielectric spacing between adjacent transceiver lanes to minimize crosstalk.
Do not attempt to substitute commercial-grade (C-grade) parts for industrial (I-grade) without re-validating junction temperature - the device self-heats significantly under heavy DSP load, and a commercial-grade part may exceed its +85C limit even at moderate ambient. Also verify that Quartus Prime software version supports the specific speed-grade variant before committing to PCB layout.
معلومات الامتثال
RoHS and lead-free compliance per distributor listing. AEC-Q100 not applicable for FPGA. Halogen-free status not stated in provided data.
