EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel
部品番号: EP2AGZ225FF35I4G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 50 | $1610 | $80,500.00 |
| 100 | $1530 | $153,000.00 |
| 250 | $1450 | $362,500.00 |
EP2AGZ225FF35I4G 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric that the designer configures after manufacture using a hardware-description language (HDL). FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (fixed architecture, software-defined) on the flexibility/performance continuum, occupying the programmable-logic layer of the broader integrated-circuit taxonomy: logic IC -> programmable logic -> FPGA. Arria II GZ specifically targets transceiver-rich applications needing multi-gigabit serial links at lower power than the Stratix family.
Key features of the EP2AGZ225FF35I4G include a 40 nm process node, a logic-element density in the ~225 K LE class, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and on-chip memory blocks suitable for buffering and FIFO applications. The device integrates PCI Express hard IP and external memory interface controllers, allowing direct attachment of DDR3 memory and simplifying board-level design. The 1152-ball FineLine BGA package exposes 554 user I/Os, providing generous fan-out for high-pin-count peripherals.
Architecturally, the Arria II GZ uses an 8-input adaptive logic module (ALM), a hierarchical routing fabric with fractional paths to reduce congestion, and hard PCIe Gen1/Gen2 blocks; combined, these features deliver deterministic timing closure and lower dynamic power than the previous-generation Arria II GX at comparable logic density. Designers typically target this device with Quartus Prime software.
Typical applications include high-speed serial backplane bridging, wireless baseband preprocessing, video broadcast infrastructure, test-and-measurement equipment with custom trigger logic, and defense/aerospace signal processing. Industrial-grade temperature rating also suits outdoor or ruggedized deployments.
When designing with this device, pay close attention to power-rail sequencing (multiple VCC rails of different voltages), transceiver reference-clock jitter, and BGA breakout routing - the 1152-ball FBGA requires HDI PCB stack-ups with microvia-in-pad for escape. Reference Altera's Arria II GZ handbook for transceiver and memory-interface guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the Arria II GZ family, and practical board-design considerations not consolidated in the manufacturer datasheet.
ドロップイン代替品: EP2AGZ225FF35I4G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ225FF35I4G （同一形状・フットプリント） — 相違点: Package, Speed Grade, RoHS Status, Embedded Memory, Transceivers.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ225FF35I3G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4400 / 個
データシートを見る →EP2AGZ225FF35I3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2655 / 個
データシートを見る →EP2AGZ225FF35C4G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2AGZ225FF35C4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1750 / 個
データシートを見る →EP2AGZ225FF35C3G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$868.4 / 個
データシートを見る →EP2AGZ225FF35C3N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2200 / 個
データシートを見る →EP2AGZ225FF35I4G 最大定格＆電気的特性
| Family | Arria II GZ |
| Logic Elements | ~224,000 LE |
| Process Node | 40 nm |
| Number of I/O | 554 user I/O |
| Package Type | 1152-ball FineLine BGA (FBGA) |
| Package Code | FF35 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I4 |
| Embedded Transceivers | Multi-gigabit (per datasheet) |
| DSP Blocks | Yes (per Arria II GZ family) |
| Embedded Memory | Yes (per Arria II GZ family) |
| PCI Express Hard IP | Yes (Gen1/Gen2) |
| External Memory Interface | DDR3 controller (per family) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant (per distributor listing) |
| Lead-Free | Yes (per distributor listing) |
EP2AGZ225FF35I4G ff35 ピン配置ガイド
EP2AGZ225FF35I4G (ff35 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ225FF35I4G.
詳細は データシート をご参照ください。
主な用途
EP2AGZ225FF35I4G の用途: 6 件s: High-Speed Serial Backplane Bridging, Wireless Baseband Preprocessing, Video Broadcast Infrastructure, Test and Measurement Equipment, Industrial Automation and Control, Defense and Aerospace Signal Processing.
High-Speed Serial Backplane Bridging
The EP2AGZ225FF35I4G is well suited for high-speed serial backplane bridging across telecom and datacom line cards. Its embedded multi-gigabit transceivers deliver multi-gigabit per lane (per Arria II GZ family specification), while the ~224K logic elements provide the protocol state machines for SATA, SRIO, or custom serial links. The 554 user I/Os in the 1152-FBGA package expose enough parallel GPIO to drive multiple bridges simultaneously, and the industrial -40C to +100C temperature grade supports outdoor and central-office deployments.
おすすめ
Wireless Baseband Preprocessing
The EP2AGZ225FF35I4G fits wireless baseband preprocessing for LTE small-cell and 5G sub-6 GHz radio units. Its dedicated DSP blocks accelerate channelization, FFT/iFFT, and crest-factor-reduction algorithms; the ~224K logic elements support MAC-layer schedulers for multiple sectors; and the embedded transceivers interface directly to RF front-end converters. The industrial temperature rating suits outdoor radio units and tower-top installations, while the 1152-FBGA package provides ample I/O for JESD204B links to ADCs/DACs.
おすすめ
Video Broadcast Infrastructure
The EP2AGZ225FF35I4G powers video broadcast routers, multiviewers, and format converters where high-throughput pixel pipelines and serial-interface connectivity coexist. The Arria II GZ family supports 3G-SDI/HD-SDI transceivers, allowing direct attachment of broadcast video I/O without external serializer/deserializer chips. Its ~224K logic elements and DSP blocks handle real-time deinterlacing, scaling, and color-space conversion at full broadcast frame rates. The 1152-FBGA provides 554 user I/Os for parallel video buses and control interfaces in broadcast chassis.
おすすめ
Test and Measurement Equipment
The EP2AGZ225FF35I4G suits test and measurement equipment such as oscilloscopes, protocol analyzers, and logic-analyzer front-ends where custom trigger logic and real-time DSP co-exist. The 224K logic elements implement complex state-based trigger sequencers; the DSP blocks accelerate FFT-based spectrum analysis in real time; and the embedded transceivers capture high-speed serial protocols like PCIe Gen2 or USB 3.0. The industrial temperature rating suits laboratory and field-portable T&M equipment.
おすすめ
Industrial Automation and Control
The EP2AGZ225FF35I4G supports industrial automation and control designs including multi-axis motor drives, deterministic EtherCAT/IP master controllers, and machine-vision preprocessors. The industrial -40C to +100C temperature rating handles factory-floor environments, while the embedded transceivers drive industrial Ethernet PHYs. The ~224K logic elements host soft-core CPUs (NIOS II/e) and deterministic control loops; the 1152-FBGA package exposes enough I/O for encoder interfaces, GPIO banks, and parallel ADC/DAC chains.
おすすめ
Defense and Aerospace Signal Processing
The EP2AGZ225FF35I4G enables defense and aerospace signal-processing subsystems including radar front-end preprocessing, electronic-warfare (EW) channelizers, and software-defined-radio (SDR) basebands. The Arria II GZ family's combination of multi-gigabit transceivers, DSP blocks, and ~224K logic elements handles wideband digital downconversion, polyphase channelization, and adaptive beamforming in real time. The industrial temperature grade supports ground-mobile and shipboard platforms, and the 1152-FBGA package's 554 user I/Os accommodate high-speed ADC/DAC arrays.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ225FF35I4G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ225FF35I3G | EP2AGZ225FF35I3N | EP2AGZ225FF35C4G | EP2AGZ225FF35C4N | EP2AGZ225FF35C3G | EP2AGZ225FF35C3N |
|---|---|---|---|---|---|---|---|
| Package | 1152-FBGA (FF35) | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same | 1152-FBGA (FF35) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | ~224K LE | ~224K LE | ~224K LE | ~224K LE | ~224K LE | ~224K LE | ~224K LE |
| Speed Grade | I4 (fastest industrial) | I3 | I3 | C4 (commercial) | C4 (commercial) | C3 (commercial) | C3 (commercial) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| User I/O | 554 | 554 | 554 | 554 | 554 | 554 | 554 |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Packaging Form | Tray (G suffix) | Tray | Tray (lead-free) | Tray | Tray (lead-free) | Tray | Tray (lead-free) |
主な差別化要因
- Highest speed grade in industrial temperature range （vs EP2AGZ225FF35I3G)
- Industrial temperature rating for harsh environments （vs EP2AGZ225FF35C4G)
- Lead-free tray packaging for RoHS compliance （vs EP2AGZ225FF35I3G)
設計ノート
The 1152-FBGA FF35 package requires an HDI PCB stack-up with microvia-in-pad construction for fan-out escape. Use a 1-to-1 microvia array under the BGA, with the inner stack-up providing reference planes for each high-speed transceiver lane. Trace length matching within the transceiver lane should target +/- 0.127 mm per Altera/Intel transceiver design guidelines.
The Arria II GZ family requires multiple independent power rails (VCC, VCCPD, VCCPT, VCCA_PLL, VCCR, VCCT, transceiver VCCE/VCCH) with strict power-up sequencing. Use a multi-rail sequencer such as the LTC2923 or LTM4644 and add sufficient bulk decoupling (typically 220 uF polymer + 10 uF ceramic per rail) close to the BGA. Refer to the device handbook for exact sequencing order to avoid latch-up.
Transceiver reference-clock jitter must be kept below 250 fs RMS for 3.125 Gbps operation. Use a dedicated low-jitter oscillator (e.g., Crystek CVHD-950) and route the clock trace as a 50-ohm controlled-impedance microstrip with ground reference below. For multi-lane designs, maintain at least 3x dielectric spacing between adjacent transceiver lanes to minimize crosstalk.
Do not attempt to substitute commercial-grade (C-grade) parts for industrial (I-grade) without re-validating junction temperature - the device self-heats significantly under heavy DSP load, and a commercial-grade part may exceed its +85C limit even at moderate ambient. Also verify that Quartus Prime software version supports the specific speed-grade variant before committing to PCB layout.
コンプライアンス情報
RoHS and lead-free compliance per distributor listing. AEC-Q100 not applicable for FPGA. Halogen-free status not stated in provided data.
